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1、b/電電路路板板朮朮語語總總整整理理 A *A*Abietic Acid松脂酸.Abrasion Resistance耐磨性.Abrasives磨料,刷材.ABS樹脂.Absorption吸收(入).Ac Impedance交流阻抗.Accelerated Test(Aging)加速老化(試驗).Acceleration速化反應.Accelerator 加速劑,速化劑.Acceptability,Acceptance 允收性,允收.Access Hole露出孔,穿露孔.Accuracy准確度.Acid Number(Acid Value)酸值.Acoustic Microscope(AM)感音
2、成像顯微鏡.Acrylic壓克力(聚丙烯酸樹脂).Actinic Light(or Intensity,or Radiation)有效光.Activation活化.Activator活化劑.Active Carbon活性炭.Active Parts(Devices)主動零件.Acutance解像銳利度.Addition Agent添加劑.Additive Process加成法.Adhesion附著力.Adhesion Promotor附著力促進劑.Adhesive膠類或接著劑.1Admittance導納(阻抗的倒數).Aerosol噴霧劑,氣熔膠,氣懸體.Aging老化.Air Inclusi
3、on氣泡夾雜.Air Knife風刀.Algorithm演算法.Aliphatic Solvent脂肪族溶劑.Aluminium Nitride(AlN)氮化鋁.Ambient Tamp環境溫度.Amorphous無定形,非晶形.Amp-Hour安培小時.Analog Circuit/Analog Signal 類比電路/類比訊號.Anchoring Spurs著力爪.Angle of Contack接觸角.Angle of Attack攻角.Anion陰離子.Anisotropic異向性,單向的.Anneal 韌化(退火).Annular Ring孔環.Anode陽極.Anode Sludg
4、e陽極泥.Anodizing陽極化.ANSI美國標準協會.Anti-Foaming Agent消泡劑.Anti-pit Agent抗凹劑.AOI自動光學檢驗.Apertures開口,鋼版開口.AQL品質允收水準.2AQL(Acceptable Quality Level)允收品質水準.Aramid Fiber聚醯胺纖維.Arc Resistance耐電弧性.Array排列.Artwork底片.ASIC特定用途勣體電路器.Aspect Ratio縱橫比.Assembly組裝裝配.A-stage A階段.ATE自動電測設備.Attenuation訊號衰減.Autoclave壓力鍋.Axial-le
5、ad軸心引腳.Azeotrope共沸混合液.*B*B*Back Light(Back Lighting)背光法.Back Taper反錐斜角.Backpanels,Backplanes支撐板.Back-up 墊板.Balanced Transmission Lines 平衡式傳輸線.Ball Grid Array球腳陣列(封裝).Bandability彎曲性.Banking Agent護岸劑.Bare Chip Assembly裸體晶片組裝.Barrel孔壁,滾鍍.Base Material基材.Basic Grid基本方格.Batch批.3Baume波美度(凡液體比重比水重則 Be=145-
6、(145Sp.Gr)凡液體比重比水輕則 Be=140(Sp.Gr-130)*Sp.Gr 為比重即同體勣物質對純水1g/cm的比值).Beam lead光芒式的平行密集引腳.Bed-of-Nail Testing針床測試.Bellows Conact彈片式接觸.Beta Ray Backscatter貝他射線反彈散射.Bevelling切斜邊.Bias斜張綱布,斜纖法.Bi-Level Stencil雙階式鋼板.Binder粘結劑.Bits頭(Drill Bits).Black Oxide黑氧化層.Blanking沖空斷開.Bleack 漂洗.Bleeding溢流.Blind Via Hole肓
7、通孔.Blister局部性分層或起泡.Block Diagram電路系統塊圖.Blockout封綱.Blotting干印.Blotting Paper吸水紙.Blow Hole吹孔.Blue Plaque藍紋(錫面鈍化層).Blur Edge(Circle)模糊邊帶(圈).Bomb Sight彈標.Bond Strength結合強度.Bondability結合性.4Bonding Layer結合層接著層.Bonding Sheet(Layer)接合片.Bonding Wire結合線.Bow,Bowing板彎.Braid編線.Brazing硬焊(用含銀的銅鋅合金焊條).在425870下進行熔接的
8、方式).Break Point顯像點.Break-away Panel可斷開板.Breakdown Voltage崩潰電壓.Break-out破出.Bridging搭橋.Bright Dip光澤浸漬處理.Brightener光澤劑.Brown Oxide棕氧化.Brush Plating刷鍍.B-stageB階段.Build Up Process增層法制程.Build-up堆積.Bulge鼓起.Bump 突塊.Bumping Process凸塊制程.Buoyancy浮力.Buried Via Hole埋導孔.Burn-in高溫加速老化試驗.Burning燒焦.Burr毛頭.Bus Bar匯電杆
9、.5Butter Coat 外表樹脂層.*C*C4 Chip JointC4晶片焊接.Cable電纜.CAD電腦輔助設計.Calendered Fabric軋平式綱布.Cap Lamination帽式壓合法.Capacitance電容.Capacitive Coupling電容耦合.Capillary Action毛細作用.Carbide碳化物.Carbon Arc Lamp碳弧燈.Carbon Treatment,Active活化炭處理.Card卡板.Card Cages/Card Racks電路板搆裝箱.Carlson Pin卡氏定位稍.Carrier載體.Cartridge濾心.Cast
10、allation堡型勣體電路器.Catalyzed Board,Catalyzed Substrate催化板材.Catalyzing催化.Cathode陰極.Cation陰向離子,陽离子.Caul Plate隔板.Cavitation空泡化 半真空.Center-to-Center Spacing中心間距.Ceramics陶瓷.Cermet陶金粉.6Certificate証明書.CFC氟氫碳化物.Chamfer倒角.Characteristic Impedance特性阻抗.Chase綱框.Check List檢查清單.Chelate螯合.Chemical Milling化學研磨.Chemica
11、l Resistance抗化性.Chemisorption化學吸附.Chip晶片(粒).Chip Interconnection晶片互連.Chip on Board晶片粘著板.Chip On Glass晶玻接裝(COG).Chisel鑽針的尖部.Chlorinated Solvent含氯溶劑,氯化溶劑.Circumferential Separation環狀斷孔.Clad/Cladding披覆.Clean Room無塵室.Cleanliness清潔度.Clearance余地,余環.Clinched Lead Terminal緊箝式引腳.Clinched-wire Through Connect
12、ion通孔彎線連接法.Clip Terminal繞線端接.Coat,Coating皮膜表層.Coaxial Cable同軸纜線.Coefficient of Thermal Expansion熱膨脹系數.Co-Firing共繞.7Cold Flow冷流.Cold Solder Joint冷焊點.Collimated Light平行光.Colloid膠體.Columnar Structure柱狀組織.Comb Pattern梳型電路.Complex Ion錯離子.Component Hole零件孔.Component Orientation零件方向.Component Side組件面.Compo
13、sites,(CEM-1,CEM-3)復合板材.Condensation Soldering凝熱焊接,液化放熱焊接.Conditioning整孔.Conductance導電.Conductive Salt導電鹽.Conductivity導電度.Conductor Spacing導體間距.Conformal Coating貼護層.Conformity吻合性,服貼性.Connector連接器.Contact Angle接觸角.Contact Area接觸區.Contact Resistance接觸電阻.Continuity連通性.Contract Service協力廠,分包廠.Controlled
14、 Depth Drilling定深鑽孔.Conversion Coating 轉化皮膜.Coplanarity共面性.8Copolymer共聚物.Copper Foil銅皮.Copper Mirror Test銅鏡試驗.Copper Paste銅膏.Copper-Invar-Copper(CIC)綜合夾心板.Core Material內層板材,核材.Corner Crack 通孔斷角.Corner Mark板角標記.Counterboring方型擴孔.Countersinking錐型擴孔.Coupling Agent 偶合劑.Coupon,Test Coupon板邊試樣.Coverlay/Co
15、vercoat表護層.Crack裂痕.Crazing白斑.Crease皺折.Creep潛變.Crossection Area截面積.Crosshatch Testing十字割痕試驗.Crosshatching十字交叉區.Crosslinking,Crosslinkage交聯,架橋.Crossover越交,搭交.Crosstalk雜訊,串訊.Crystalline Melting Point晶體熔點.C-Stage C階段.Cure硬化,熟化.Current Density電流密度.Current-Carrying Capability載流能力.9Curtain Coating濂塗法.*D*Da
16、isy Chained Design菊瓣設計.Datum Reference基准參考.Daughter Board子板.Debris碎屑,殘材.Deburring去毛頭.Declination Angle斜射角.Definition邊緣逼真度.Degradation 劣化.Degrasing脫脂.Deionized Water去離子水.Delamination分離.Dendritic Growth 枝狀生長.Denier丹尼爾(是編織紡織所用各種紗類直徑單位,定義9000米紗束所具有的重量(以克米計).Densitomer透光度計.Dent凹陷.Deposition 皮膜處理.Desiccat
17、or干燥器.Desmearing去膠渣.Desoldering解焊.Developer顯像液,顯像機.Developing顯像.Deviation偏差.Device電子元件.Dewetting縮錫.D-glassD玻璃.10Diaze Film偶氮棕片.Dichromate重鉻 酸鹽.Dicing晶片分割.Dicyandiamide(Dicy)雙氰胺.Die 沖模.Die Attach晶粒安裝.Die Bonding晶粒接著.Die Stamping沖壓.Dielectric 介質.Dielectric Breakdown Voltage 介質崩潰電壓.Dielectric Constant介
18、質常數.Dielectric Strength介質強度.Differential Scanning Calorimetry(DSC)微差掃瞄熱卡分析法.Diffusion Layer擴散層.Digitizing數位化.Dihedral Angle雙反斜角.Dimensional Stability尺度安定性.Diode二極體.Dip Coating浸塗法.Dip Soldering浸焊法.DIP(Dual Inline Package)雙排腳封裝體.Dipole偶極,雙極.Direct/Indirect Stencil直接/間接版膜.Direct Emulsion直接乳膠.Direct Pla
19、ting直接電鍍.Discrete Compenent散裝零件.Discrete Wiring Board散線電路板,復線板.Dish Down碟型下陷.11Dispersant分散劑.Dissipation Factor散失因素.Disspation Factor散逸因子.Disturbed Joint受擾焊點.Doctor Blade修平刀,刮平刀.Dog Ear狗耳.Doping摻雜.Double Layer雙電層.Double Treated Foil雙面處理銅箔.Drag In/Drag Out帶進/帶出.Drag Soldering拖焊.Drawbridging吊橋效應.Drift
20、漂移.Drill Facet鑽尖切削面.Drill Pointer鑽針重磨機.Drilled Blank已鑽孔的裸板.Dross浮渣.Drum Side銅箔光面.Dry Film干膜.Dual Wave Soldering 雙波焊接.Ductility展性.Dummy Land假焊墊.Dummy,Dummying假鍍(片).Durometer橡膠硬度計.DYCOstrate電漿蝕孔增層法.Dynamic Flex(FPC)動態軟板.*E*E-Beam(Electron Beam)電子束.12Eddy Current渦電流.Edge Spacing板邊空地.Edge-Board Connecto
21、r板邊(金手指)承接器.Edge-Board Contact板邊金手指.Edge-Dip Solderability Test板邊焊錫性測試.EDTA乙二胺四乙酸.Effluent排放物.E-glass電子級玻璃.Elastomer彈性體.Electric Strength(耐)電性強度.Electrodeposition電鍍.Electro-deposition Photoresist 電著光阻,電泳光阻.Electroforming電鑄.Electroless-Deposition無電鍍.Electrolytic Tough Pitch電解銅.Electrolytic-Cleaning電解
22、清洗.Electro-migration電遷移.Electro-phoresis電泳動,電滲.Electro-tinning鍍錫.Electro-Winning電解冶煉.Elongation 延伸性,延伸率.Embossing凸出性壓花.EMF(Electromotive Force)電動勢.EMI(Electromagnetic Interference)電磁干擾.Emulsion乳化.Emulsion Side藥膜面.Encapsulating膠囊.Encroachment沾污,侵犯.13End Tap封頭.Entek有機護銅處理.Entrapment夾雜物.Entry Material蓋
23、板.Epoxy Resin環氧樹脂.Etch Factor蝕刻因子.Etchant蝕刻劑(液).Etchback回蝕.Etching Indicator蝕刻指標.Etching Resist蝕刻阻劑.Eutetic Composition共融組成.Exotherm放熱(曲線).Exposure曝光.Eyelet鉚眼.*F*Fabric綱布.Face Bonding反面朝下結合.Failure故障.Fan Out Wiring/Fan In Wiring 扇出布線/扇入布線.Farad 法拉.Farady法拉第.Fatigue Strength抗疲勞強度.Fault缺陷.Fault Plane斷
24、層面.Feed Through Hole導通孔.Feeder 進料器.Fiber Exposure玻纖顯露.Fiducial Mark基准記號.14Filament纖絲.Fill緯向.Filler填充料.Fillet內圓填角.Film底片.Film Adhesive接著膜,粘合膜.Filter過濾器.Fine Line細線.Fine Pitch密腳距,密線距,密墊距.Fineness粒度,純度.Finger手指.Finishing終修(飾).Finite Element Method有限要素分析法.First Article首產品.First Pass-Yield初檢良品率.Fixture夾具
25、.Flair刃角變形.Flame Point自燃點.Flame Resistant耐燃性.Flammability Rate燃性等級.Flare扇形崩口.Flash Plating閃鍍.Flashover閃絡.Flat Cable扁平排線.Flat Pack扁平封裝(之零件).Flatness平坦度.Flexible Printed Circuit(FPC)軟板.Flexural Failure撓曲損壞.15Flexural Module彎曲模數,抗撓性模數.Flexural Strength抗撓強度.Flip Chip覆晶,扣晶.Flocculation絮凝.Flood Stroke Pri
26、nt覆墨沖程印刷.Flow Soldering(Wave Soldering)流焊.Fluorescence熒光.Flurocarbon Resin碳氟樹脂.Flush Conductor嵌入式線路 ,貼平式 導體.Flush Point閃火點.Flute退屑槽.Flux助焊劑.Foil Burr銅箔毛邊.Foil Lamination銅箔壓板法.Foot殘足(干膜殘余物).Foot Print(Land Pattern)腳墊.Foreign Material 外來物,異物.Form-to-List布線說明清單.Four Point Twisting四點扭曲法.Free Radical自由基.
27、Freeboard干舷.Frequency頻率.Frit 玻璃熔料.Fully-Additive Process全加成法.Fungus Resistance抗霉性.Fused Coating熔錫層.Fusing熔合.Fusing Fluid助熔液.16 *G*G-10由連續玻纖所織成的玻纖布與 環氧樹脂粘結劑所復合成的材料.Gage,Gauge量規.Gallium Arsenide(GaAs)砷化鎵.Galvanic Corrosion賈凡尼式腐蝕(電解式腐蝕).Galvanic Series賈凡尼次序(電動次序).Galvanizing鍍鋅.GAP第一面分離,長刃斷開.Gate Array閘
28、列,閘極陣列.Gel Time膠化時間.Gelation Particle膠凝點.Gerber Data,Gerber File格博檔案(是美商Gerber公司專為PCB面線路 圖形與孔位,所發展一系列完整的軟體檔案).Ghost Image陰影.Gilding鍍金(現為:Glod Plating).Glass Fiber玻纖.Glass Fiber Protrusion/Gouging,Groove玻纖突出/挖破.Glass Transition Temperature,Tg玻璃態轉化溫度.Glaze釉面,釉料.Glob Top圓頂封裝體.Glouble Test球狀測試法.Glycol(E
29、thylene Glycol)乙二醇.Golden Board測試用標準板.Grain Size結晶粒度.Grass Leak 大漏.Grid標准格.Ground Plane/Earth Plane接地層.17Ground Plane Clearance接地空環.Guide Pin導針.Gull/Wing Lead鷗翼引腳.*H*Halation環暈.Half Angle半角.Halide鹵化物.Haloing白圈,白邊.Halon海龍,是CFC氟碳化物的一種商品名.Hard Anodizing硬陽極化.Hard Chrome Plating鍍硬鉻.Hard Soldering硬焊.Harde
30、ner(Curing Agent)硬化劑(或Curing Agent).Hardness硬度.Haring-Blum Cell海固槽.Harness電纜組合.Hay Wire跳線.Heat Cleaning燒潔.Heat Dissipation散熱.Heat Distortion Point(Temp)熱變形點(溫度).Heat Sealing熱封.Heat Sink Plane散熱層.Heat Transfer Paste導熱膏.Heatsink Tool散熱工具.Hertz(Hz)赫.High Efficiency Particulate Air Filter(HEPA)高效空氣塵粒過瀘機
31、.Hipot Test 高壓電測.Hi-Rel高度靠度.18Hit 擊(鑽孔時鑽針每一次刺下的動作).Holding Time停置時間.Hole Breakout孔位破出.Hole Counter數孔機.Hole Density孔數密度.Hole Preparation通孔准備.Hole Pull Strength孔壁強度.Hole Void破洞.Hook 切削刀緣外凸.Hot Air Levelling噴錫.Hot Bar Soldering熱把焊接.Hot Gas Soldering熱風手焊.HTE(High Temperature Elongation)高溫延伸性.Hull Cell哈氏
32、槽.Hybrid Integrated Circuit混成電路.Hydraulic Bulge Test液壓鼓起試驗.Hydrogen Embrittlement氫脆.Hydrogen Overvoltage氫過(超)電壓.Hydrolysis水解.Hydrophilic親水性.Hygroscopic吸溼性.Hypersorption超吸咐.*I*I.C.Socket勣體電路器插座.Icicle錫尖.Illuminance照度.Image Transfer影像轉移.Immersion Plating浸鍍.19Impedance阻抗.Impedance Match阻抗匹配.Impregnate含
33、浸.In-Circuit Testing組裝板電測.Inclusion異物,夾雜物.Indexing Hole基准孔.Inductance(L)電感.Infrared(IR)紅外線.Input/Output輸入/輸出.Insert,Insertion插接.Inspection Overlay套檢底片.Insulation Resistance絕緣電阻.Integrated Circuit(IC)勣體電路器.InterFace介面.Interconnection互連.Intermetallic Compound(IMC)介面共化物.Internal Stress內應力.Interposer互邊導
34、電物.Interstitial Via-Hole(IVH)局部層間導通孔.Invar殷鋼(63.8%Fe,36%Ni,0.2%C).Ion Cleanliness離子清潔度.Ion Exchange Resins離子交換樹脂.Ion Migration離子遷移.Ionizable(Ionic)Contaimination 離子性污染.Ionization游離,電離.Ionization Voltage(Corona Level)電離化電壓(電纜內部狹縫空氣中,引起其 電離所施加之最小電壓).IPC美國印刷電路板協會.20Isolation隔離性,隔絕性.*J*JEDEC(Joint Elect
35、ronic Device 聯合電子元件工程委員會.Engineering Council)J-LeadJ型接腳.Job Shop專業工廠.Joule焦耳.Jumper Wire跳線.Junction接(合)面,接頭.Just-In-Time(JIT)適時供應,及時出現.*K*Kapton聚亞醯胺軟板.Karat克拉 (1克拉(鑽石)=0.2g 純金則24k金為 100%的鈍金.Kauri-Butanol Value考立丁醇值(簡稱K.B.值).Kerf.切形,裁剪.Kevlar聚醯胺纖維.Key電鍵Key Board鍵盤.Kiss Pressure吻壓,低壓.Knoop Hardness努普硬
36、度.Known Good Die(KGD)已知之良好晶片.Kovar科伐合金(Fe53%,Ni29%,Co17%).Kraft Paper牛皮紙.*L*Lamda Wave延伸平波.Laminar Flow平流.Laminar Structure片狀結搆.21Laminate Void板材空洞.Laminate(s)基板.Lamination Void壓合空洞.Laminator壓膜機.Land孔環焊墊,表面焊墊.Landless Hole無環通孔.Laser Direct Imaging(LDI)雷射直接成像.Laser Maching雷射加工法.Laser Photogenerator(L
37、PG),Laser Photoplotter雷射曝光機.Laser Soldering雷射焊接法.Lay Back 刃角磨損.Lay Out布線,布局.Lay Up 疊合.Layer to Layer Spacing層間距離Leaching焊散漂出,熔出.Lead 引腳.Lead Frame腳架.Lead Pitch腳距.Leakage Current漏電電流.Legend文字標記.Leveling整平.Lifted Land孔環(焊墊)浮起.Ligand錯離子附屬體.Light Emitting Diodes(LED)發光二極體.Light Integrator光能累積器.Light Int
38、ensity光強度.Limiting Current Density極限電流密度.Liquid Crystal Display(LCD)液晶顯示器.22Liquid Dielectrics液態介質.Liquid Photoimagible Solder Mask,(LPSM)液態感光防焊綠漆.Local Area Network區域性網路.Logic 邏輯.Logic Circuit 邏輯電路.Loss Factor損失因素.Loss Tangent(TanDK)損失正切.Lot Size批量.Luminance發光強度.Lyophilic親水性膠體.*M*Macro-Throwing Pow
39、er巨觀分布力.Major Defect主要(嚴重)缺點.Major Weave Direction主要織向.Margin刃帶(鑽頭尖部).Marking標記.Mask阻劑.Mass Finishing大量整面(拋光).Mass Lamination大型壓板.Mass Transport質量輸送.Master Drawing主圖.Mat蓆(用于CEM-3(Composite Epoxy Material)的 復合材料.)Matte Side毛面(電鍍銅皮(ED Foil)之粗糙面).Mealing泡點.Mean Time To Failure(MTTF)故障前可用之平均時數.Measling白
40、點.Mechanical Stretcher機械式張網機.23Mechanical Warp機械式纏繞.Mechanism機理.Membrane Switch薄膜開關.Meniscograph Test弧面狀沾錫試驗.Meniscus彎月面.Mercury Vaper Lamp汞氣燈.Mesh Count綱目數.Metal Halide Lamp 金屬鹵素燈.Metallization金屬 化.Metallized Fabric金屬化綱布.Micelle微胞.Micro Wire Board微封線板.Micro-electronios微電子.Microetching微蝕.Microsectio
41、ning微切片法.Microstrip 微條.Microstrip Line微條線,微帶線.Microthrowing Power微分布力.Microwave微波.Migration遷移.Migration Rate遷移率.Mil英絲.Minimum Annular Ring孔環下限.Minimum Electrical Spacing電性間距下限.Minor Weave Direction次要織向.Misregistration 對不准度.Mixed Componmt Mounting Technology混合零件之組裝技術.Modem調變及解調器.24Modification修改.Modu
42、le模組.Modulus of Elasticity彈性系數.Moisture and Insulation Resistance Test溼氣與絕緣電阻試驗.Mold Release 脫模劑,離型劑.Mole摩爾.Monofilament單絲.Mother Board主機板,母板.Moulded Circuit模造立體電路機.Mounting Hole安裝孔.Mounting Hole組裝孔,機裝孔.Mouse Bite鼠齒(蝕刻后線路邊緣出現不規則缺口).Multi-Chip-Module(MCM)多晶片芯片模組.Multiwiring Board(or Discrete Wiring B
43、oard)復線板.*N*N.C.數值控制.Nail Head釘頭.Near IR近紅外線.Negative負片,鑽尖的第一面外緣變窄.Negative Etch-back反回蝕.Negative Stencil負性感光膜.Negative-Acting Resist負性作用之阻劑.Network綱狀元件.Newton牛頓.Newton Ring 牛頓環.Newtonian Liquid牛頓流體.Nick缺口.N-Methyl Pyrrolidine(NMP)N-甲基四氫嗶咯.25Noble Metal Paste貴金屬印膏.Node節點.Nodule節瘤.Nomencleature標示文字符號
44、.Nominal Cured Thickness標示厚度.Non-Circular Land非圓形孔環焊墊.Non-flammable非燃性.Non-wetting不沾錫.Normal Concentration (Strength)標準濃度,當量濃度.Normal Distribution常態分布.Novolac酯醛樹脂.Nucleation,Nucleating核化.Numerical Control數值控制.Nylon尼龍.*O*Occlusion吸藏.Off-Contact架空.Offset第一面大小不均.OFHC(Oxyen Free High Conductivity)無氧高導電銅
45、.Ohm歐姆.Oilcanning蓋板彈動.OLB(Outer Lead Bond)外引腳結合.Oligomer寡聚物.Omega Meter離子污染檢測儀.Omega Wave振盪波.On-Contact Printing密貼式印刷.Opaquer不透明劑,遮光劑.Open Circuits斷線.26Optical Comparater光學對比器(光學放大器.)Optical Density光密度.Optical Inspection光學檢驗.Optical Instrument光學儀器.Organic Solderability Preservatives(OSP)有機保焊劑.Osmosi
46、s滲透.Outgassing出氣,吹氣.Outgrowth懸出,橫出,側出.Output產出,輸出.Overflow溢流.Overhang總懸空.Overlap 鑽尖點分離.Overpotantial(Over voltage)過電位,過電壓.Oxidation氧化.Oxygen Inhibitor氧化抑制劑.Ozone Depletion臭氧層耗損.*P*Packaging封裝,搆裝.Pad焊墊,圓墊.Pad Master圓墊底片.Pads Only Board唯墊板.Palladium鈀.Panel制程板.Panel Plating全板鍍銅.Panel Process全板電鍍法.Paper
47、 Phenolic紙質酚醛樹脂(板材).Parting Agent脫膜劑.Passivation鈍化,鈍化外理.27Passive Device(Component)被動元件(零件)Paste膏,糊.Pattern板面圖形.Pattern Plating線路電鍍.Pattern Process線路電鍍法.Peak Voltage峰值電壓.Peel Strength抗撕強度.Periodic Reverse(PR)Current 周期性反電流.Peripheral周邊附屬設備.Permeability透氣性,導磁率.Permittivity誘電率,透電率.pH Value酸堿值.Phase相.P
48、hase Diagram相圖.Phenolic酚醛樹脂.Photofugitive感光褪色.Photographic film感光成像之底片.Photoinitiator感光啟始劑.Photomask光罩.Photoplotter,Plotter光學繪圖機.Photoresist光阻.Photoresist Chemical Machinning(Milling)光阻式化學(銑刻)加工.Phototool底片.Pick and Place拾取與放置.Piezoelectric壓電性.Pin 插腳,插梢,插針.Pin Grid Array(PGA)矩陣式針腳對裝.Pinhole針孔.28Pink
49、 Ring粉紅圈.Pitch跨距,腳距,墊距,線距.Pits凹點.Plain Weave平織.Plasma電漿.Plasticizers可塑劑,增塑劑.Plated Through Hole鍍通孔.Platen熱盤.Plating鍍.Plotting標繪.Plowing犁溝.Plug插腳,塞柱.Ply層,股.Pneumatic Stretcher氣動拉伸器.Pogo Pin伸縮探針.Point 鑽尖.Point Angle鑽尖面.Point Source Light點狀光源.Poise泊.粘滯度單位=1dyne*sec/cm2.Polar Solvent極性溶劑.Polarity電極性.Pol
50、arization分極,極化.Polarizing Slot偏槽.Polyester Films聚酯類薄片.Polymer Thick Film(PTF)厚膜糊.Polymerization聚合.Polymide(PI)聚亞醯胺.Popcorn Effect爆米花效應.29Porcelain瓷材,瓷面.Porosity Test疏孔度試驗.Positive Acting Resist正性光阻劑.Post Cure后續硬化,后烤.Post Separation后期分離,事后公離.Pot Life運用期,鍋中壽命.Potting鑄封,模封.Power Supply電源供應器.Preform 預制品