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1、Q/ZX深圳市中兴通讯股份有限公司企业标准（技术标准）Q/ZX 04.100.5-印制电路板设计规范SMD元器件封装库尺寸要求2001-12-11 发布2002-01-01 实施深圳市中兴通讯股份有限公司 发布Q/Z X 04.100.5-2001目 次1 范围.12 引用标准.13 术语.14 使用说明.25 焊盘图形.25.1 S MD：表面贴装方焊盘图形尺寸.25.2 S MD C：表面贴装圆焊盘图形尺寸.35.3 S MD F表面贴装手指焊盘图形尺寸.45.4 THC通孔圆焊盘图形尺寸.55.5 THS通孔方焊盘图形尺寸.65.6 THR通孔矩形焊盘图形尺寸.76 S MD元器件及焊盘
2、图形尺寸.86.1 S MD分立元件.86.1.1 S MD 电阻.86.1.1.1 S MD电阻元件尺寸.86.1.2 S MD 电容.106.1.3 S MD 电感.126.1.4 S MD 锂电容.146.1.5 ME LF（金属电极无引线端面元件）.166.1.6 S MD 排阻.186.1.7 S OT 23.206.1.8 S OT 89.226.1.9 S OD 123.246.1.10 S OT 143.266.1.11 S OT 223.286.1.12 TO 252/T0 268.306.1.13 S MD 220元件（对应物料代码为15100085等）.326.1.14
3、S MA元件（对应物料代码为15100016a）.346.1.15 S OT-323元件（对应物料代码为15100001）.366.1.16 S OT-363元件（对应物料代码为15100001）.386.2 两侧翼形引脚元件.406.2.1 S OICS mall Out line Int e grat e d Circuit s:小外形集成电路.406.2.2 S S OICS mall Out line Int e grat e d Circuit s:小外形集成电路.426.2.3 S OP S mall Out line Package Int e grat e d Circuit
4、s:小外形封装集成电路.446.2.4 TS OPThin S mall Out line Package:薄小外形封装.466.2.5 CF PCe ramic F lat Packs:陶瓷扁平封装.486.3 两侧“J”形引脚元件S OJ.506.3.1 S OJ元件尺寸.506.3.2 S OJ的焊盘尺寸.516.4 四边有翼形引脚的元件.546.4.1 PQ F P(Plast ic Q uad F lat Pack).546.4.2 S Q F P(S hrink Q uad F lat Pack),方形.566.4.3 S Q F P 矩形.646.4.4 CQ F P Ce ra
5、mic Q uad F lat Pack.686.5 四边有“J”形引脚的元件.706.5.1 方形 PLCCPlast ic le ad e d chip carrie rs.706.5.2 PLCC,矩形.726.5.3 LCC Le ad le ss ce ramic chip carrie rs.746.6 改进型双列引脚元件.766.6.1 D IPMod ifie d D ual-In-Line comp one nt s.766.7 BGA.786.7.1 PBGAPlast ic Ball Grid Array,方形.786.7.2 1.27mm R-PBGA.92Q/Z X
6、04.100.5-2001前 言本标准规定了印制电路板设计过程中，元器件封装库焊盘图形及S MD焊盘图形尺寸要求。本标准由深圳市中兴通讯股份有限公司康讯工艺部提出，技术中心技术部归口。本标准起草部门：康讯工艺部。本标准起草人：贾变芬，贾忠中，杨清亮，袁红波。本标准于2001年12月首次发布。深圳市中兴通讯股份有限公司企业标准（设计标准）印制电路板设计规范元器件封装库尺寸要求Q/Z X 04.100.5-20011范围本标准规定了印制电路板（以下简称PCB）设计所使用的元器件封装库中的焊盘图形及S MD焊 盘图形尺寸要求。本标准适用于深圳市中兴通讯股份有限公司。2引用标准下面引用的标准，以网上发
7、布的最新标准为有效版本。IPC-S M-782 S urface Mount D e sign and Land Pat t e rn S t and ard oQ/Z X 04.100.2-2001印制电路板设计规范工艺性要求。Q/Z X 04.100.4-2001印制电路板设计规范元器件封装库基本要求。3术语S MD:S urface Mount D e vice s/表面贴装元件。R A：R e sist or Arrays/排阻。ME LF：Me t al e le ct rod e face comp one nt s/金属电极无引线端面元件.S OT：S mall out line
8、 t ransist or/小外形晶体管。S OD：S mall out line d iod e/小外形二极管。S OIC：S mall out line Int e grat e d Circuit s/小外形集成电路.S S OIC:S hrink S mall Out line Int e grat e d Circuit s/缩小外形集成电路.S OP:S mall Out line Package Int e grat e d Circuit s/小外形封装集成电路.S S OP:S hrink S mall Out line Package/缩小外形封装集成电路.TS OP:Th
9、in S mall Out line Package/薄小外形封装.TS S OP:Thin S hrink S mall Out line Package/收缩薄小外形封装.CF P:Ce ramic F lat Packs/陶瓷扁平封装.S OJ:S mall out line Int e grat e d Circuit s wit h J Le ad s/J 形引脚小外形集成电路.PQ F P：Plast ic Q uad F lat Pack/塑料方形扁平封装。S Q F P：S hrink Q uad F lat Pack/缩小方形扁平封装。CQ F P：Ce ramic Q ua
10、d F lat Pack/陶瓷方形扁平封装。PLCC：Plast ic le ad e d chip carrie rs/塑料封装有引线芯片载体。LCC：Le ad le ss ce ramic chip carrie rs/无引线陶瓷芯片载体。D IP：D ual-In-Line comp one nt s/双列引脚元件。PBGA：Plast ic Ball Grid Array/塑封球栅阵列器件。深圳市中兴通讯股份有限公司2001-12-11批准2002-01-01 实施1Q/Z X-20004使用说明4.1 表格中的“min”表示最小尺寸；“max”最大尺寸；“re f”表示参考尺寸；b
11、asic”表示基本尺寸；封装名称中的“mm”表示公制型号；in表示英制型号。4.2区域网格表示图形占用的网格数，表中给出为网格的数量，换算成mm时-，应乘以0.5 mm。5焊盘图形5.1 S MD：表面贴装方焊盘图形尺寸表面贴装方焊盘图形尺寸因应符合图1的要求。见图1：X焊盘名称X(mm)Y(mm)焊盘名称X(mm)Y(mm)焊盘名称X(mm)Y(mm)S MD 0rl7Xlr600.171.60S MD 0r80X3r400.803.40S MD 2r20X2r002.202.00S MD 0r25Xlr600.251.60S MD lr00X0r901.000.90S MD 2r20X2r
12、602.202.60S MD 0r30Xlr600.281.80S MD lrOOXlrOO1.001.00S MD 2r40X2r002.402.00S MD 0r35Xlr800.351.80S MD lr00Xlr401.001.40S MD 2r40X2r402.402.40S MD 0r35X2r600.352.60S MD lr00Xlr601.001.60S MD 2r40X2r602.402.60S MD 0r40Xlr600.401.60S MD lr00X3r401.003.40S MD 2r60Xlr452.601.45S MD 0r40Xlr800.401.80S MD
13、 lr20Xlr401.201.40S MD 2r60Xlr502.601.50S MD 0r40X2r200.402.20S MD lr20X2r001.202.00S MD 2r70Xlr602.701.60S MD 0r50Xlr800.501.80S MD lr20X2r201.202.20S MD 2r70Xlr802.701.80S MD 0r50X2r000.502.00S MD lr30Xlr001.301.00S MD 2r80Xlr402.801.40S MD 0r50X2r200.502.20S MD lr40X2r201.402.20S MD 3r20Xlr803.20
14、1.80S MD 0r60X2r000.602.00S MD lr40X2r401.402.40S MD 3r40Xlr903.401.90S MD 0r60X2r200.602.20S MD lr40X3r401.403.40S MD 3r60Xlr803.601.80S MD 0r65X2r200.652.20S MD lr50Xlr301.501.30S MD 3r60X2r203.602.20S MD 0r65X2r400.652.40S MD lr60Xlr201.601.20S MD 4r00Xlr804.001.80S MD 0r65X2r600.652.60S MD lr60X
15、lr301.601.30S MD 5r40X6r205.406.20S MD 0r70X0r600.700.60S MD lr80Xlr401.801.40S MD 4r00Xlr804.001.80S MD 0r80Xlr400.801.40S MD lr80Xlr601.801.60S MD 6r80Xlr906.801.90S MD 0r80Xlr600.801.60S MD 2r00Xlr602.001.60S MD 6r80X9r606.809.60S MD 0r80X2r600.802.60S MD 2r00Xlr802.001.80S MD 13r60X13r4013.6013.
16、40图1表面贴装方焊盘图形尺寸2Q/Z X-20005.2 S MD C：表面贴装圆焊盘图形尺寸表面贴装圆焊盘图形尺寸应符合图2要求。见图2：图2表面贴装圆焊盘图形尺寸焊盘名称C(mm)焊盘名称C(mm)S MD C0r350.35S MD C0r900.90S MD C0r400.40S MD ClrOO1.00S MD C0r500.50S MD C2r602.60S MD C0r600.603Q/Z X-20005.3 S MD F表面贴装手指焊盘图形尺寸表面贴装手指焊盘图形尺寸应符合图3要求。见图3：图3表面贴装手指焊盘图形尺寸XYc:焊盘名称X(mm)Y(mm)焊盘名称X(mm)Y(
17、mm)S MD F lr00X2r501.002.50S MD F lr80X2r501.802.50S MD F lr00X2r801.002.80S MD F lr80X2r301.802.304Q/Z X-20005.4 THC通孔圆焊盘图形尺寸通孔圆焊盘图形尺寸应符合图4要求。见图4：图4通孔圆焊盘图形尺寸D1厂c焊盘名称C(mm/mil)D(mm/mi1)焊盘名称c(mm/mi1)D(mm/mi1)THC0r50D 0r200.45/180.20/8THClr30D 0r801.30/510.80/32THC0r60D 0r300.60/240.30/12THClr40D 0r901
18、.40/550.90/36THC0r70D 0r400.70/280.40/16THClr50D lr001.50/601.00/40THC0r90D 0r500.80/360.50/20THC2r60D lr302.60/1021.30/51THClrl0D 0r601.10/440.60/24THC3r20D lr603.20/1261.60/63THClr20D 0r701.20/480.70/28THC4r00D 2r004.00/1582.00/79THClr20D 0r701.23/490.73/29THC0r00D 3r000/03.00/1185Q/Z X-20005.5 TH
19、S通孔方焊盘图形尺寸通孔方焊盘图形尺寸应符合图5要求。见图5：图5通孔方焊盘图形尺寸ns焊盘名称S(mm/mil)D(mm/mil)焊盘名称S(mm/mil)D(mm/mil)THS 1R 10D 0R 601.10/440.60/24THS lr50D lr001.50/601.00/40THS lr20D 0r701.20/480.70/28THS 2r60D lr302.60/1021.30/51THS lr30D 0r801.30/510.80/32THS 3r20D lr603.20/1261.60/63THS lr40D 0r901.40/550.90/36THS 4r00D 2r
20、004.00/1582.00/796Q/Z X-20005.6 THR通孔矩形焊盘图形尺寸通孔矩形焊盘图形尺寸应符合图6要求。见图6：图6通孔矩形焊盘图形尺寸nXV7Y焊盘名称X(mm/mil)Y(mm/mil)D(mm/mil)THR lr20Xlr40D 0r701.20/481.40/550.70/287Q/Z X-20006 S MD元器件及焊盘图形尺寸6.1 S MD分立元件6.1.1 S MD 电阻6.1.1.1 S MD电阻元件尺寸S MD电阻元件尺寸应符合图7的规定。见图7：图7 S MD电阻元件尺寸gT.1Ms工封装名称L(mm)S(mm)W(mm)T(mm)H(mm)min
21、maxminmaxminmaxminmaxmax0402R1.001.100.400.700.480.600.100.300.400603R1.501.700.701.110.700.950.150.400.600805R1.852.150.551.321.101.400.150.650.651206R3.053.351.552.321.451.750.250.750.711210R3.053.351.552.322.342.640.250.750.712010R4.855.153.153.922.352.650.350.850.712512R6.156.454.455.223.053.350
22、.350.850.716.1.1.2 S MD电阻的焊盘尺寸8Q/Z X-2000S MD电阻的焊盘尺寸应符合图8的规定。见图8：jrid p lace me n!图8 S MD电阻的焊盘尺寸封装名称Z(mm)G(mm)X(mm)Y(mm)C(mm)区域网格（网格单元号码）re fre f0402R2.200.400.700.901.302X40603R2.800.601.001.101.704X60603R-W3.200.800.701.202.004X60805R3.200.601.501.301.904X80805R-W3.600.801.001.402.204X81206R4.401.
23、201.801.602.804X101206R-W4.801.201.201.803.004X101210R4.401.202.701.602.806X102010R6.202.602.701.804.406X142512R7.403.803.201.805.608X16注：大二 后缀“TV”。F 0603R的元件在波峰焊时，丫一尺寸向外侧增加0.2mm,X-尺寸减小30%。封装名称加9Q/Z X-20006.1.2 S MD 电容6.1.2.1 S MD电容元件尺寸S MD电容元件尺寸应符合图9的规定。见图9：图9 S MD电容元件尺寸T1S工封装名称L(mm)S(mm)W(mm)T(mm)
24、H(mm)Minmaxminmaxminmaxminmaxmax0402C0.901.100.300.650.400.600.100.300.600504C1.021.320.260.720.771.270.130.381.020603C1.451.750.450.970.650.950.200.500.850805C1.802.200.301.111.051.450.250.751.101206C3.003.401.502.311.401.800.250.751.351210C3.003.401.502.312.302.700.250.751.351812C4.204.802.303.463
25、.003.400.250.951.351825C4.204.802.303.466.006.800.250.951.1010Q/Z X-20006.1.2.2 S MD电容焊盘尺寸S MD电容焊盘尺寸应符合图10的规定。见图10：Grid p lace me nt图10 S MD电容焊盘尺寸封装名称Z(mm)G(mm)X(mm)Y(mm)C(mm)区域网格（网格单元号码）re fre f0402C1.600.400.700.601.002X40504C2.000.401.300.801.204X60603C2.800.601.001.101.704X60603C-W3.200.800.701.
26、202.004X60805C3.200.601.501.301.904X80805C-W3.600.801.001.402.204X81206C4.401.201.801.602.804X101206C-W4.801.201.201.803.004X101210C4.401.202.701.602.806X101812C5.802.003.401.903.908X121825C5.802.006.801.903.9014X12注：大于0603C的元件在波峰焊时，Y-尺寸向夕 后缀“TV”o卜侧增加0.2mm,X-尺寸减小30%。封装名称加11Q/Z X20006.1.3 S MD 电感6.1.
27、3.1 S MD电感元件尺寸S MD电感元件尺寸应符合图11的规定。见图11：L JLL也_1工xlr,XsTSbdChipPrecision wire-wounMoldeC封装名称L(mm)S(mm)Wl(mm)W2(mm)T(mm)Hl(mm)H2(mm)minMaxminmaxminmaxminmaxminmaxmaxmax2012L-C1.702.301.101.760.601.20一一0.100.301.20一3216L-C2.903.501.902.631.301.900.200.501.904516L-C4.204.802.603.530.601.20一一0.300.801.90
28、一一2825L-P2.202.800.901.621.952.112.102.540.370.652.290.073225L-P2.903.500.901.831.401.80一一一0.501.002.000.504532L-P4.204.802.203.133.003.40一一0.501.002.800.505038L-P4.354.952.813.512.462.623.413.810.510.773.800.763225-3230L-M3.003.401.602.181.802.002.302.700.400.702.400.514035L-M3.814.320.811.601.201.
29、502.923.181.201.502.671.274532L-M4.204.802.303.152.002.203.003.400.650.953.400.505650L-M5.305.503.304.323.804.204.705.300.501.005.801.008530L-M8.258.765.256.041.201.502.923.181.201.502.671.27注：C 为 Chip 的简写，P 为 Pre c.w/w(Pre cision wire-wound)的简写,M 为 Mold e d 的简写。图11 S MD电感元件尺寸12Q/Z X-20006.1.3.2 S M
30、D电感焊盘尺寸S MD电感焊盘尺寸应符合图12的规定。见图12：Gr id plac ementX干 11 三Z一11封装名称Z(mm)G(mm)X(mm)C(mm)Y(mm)区域网格（网格单元号码）re fre f2012L-C3.001.001.002.001.004X83216L-C4.201.801.603.001.206X104516L-C5.802.601.004.201.604X122825L-P3.801.002.402.401.406X103225L-P4.601.002.002.801.806X104532L-P5.802.203.604.001.808X145038L-P
31、5.803.002.804.401.408X143225-3230L-M4.401.202.202.801.606X104035L-M5.401.001.403.202.208X124532L-M5.801.802.403.802.008X145650L-M6.803.204.005.001.8012X 168530L-M9.805.001.407.402.408X22注：1后缀“-C”的元件在波峰焊时,Y-尺寸向外侧增加0.2mm,X-尺寸减小3后。封装名称加后缀“-WC2后缀“-P”和“-M”的元件在波峰焊时，Y-尺寸向外侧增加0.2mm,X-尺寸不变，封装名称加后缀“7”。图12 S M
32、D电感焊盘尺寸13Q/Z X20006.1.4 S MD笆电容6.1.4.1 S MD留电容元件尺寸S MD锂电容元件尺寸应符合图13的规定。见图13：CXJ Z E1/ST.W1t.LW2封装名称L(mm)S(mm)Wl(mm)W2(mm)T(mm)Hl(mm)H2(mm)minmaxminmaxminmaxminmaxminmaxmaxmax3216T3.003.400.801.741.171.211.401.800.501.100.701.803528T3.303.701.102.042.192.212.603.000.501.100.702.106032T5.706.302.503.5
33、42.192.212.903.501.001.601.002.807343T7.007.603.804.842.392.914.004.601.001.601.003.10图13 S MD锂电容元件尺寸14Q/Z X-20006.1.4.2 S MD笆电容焊盘尺寸S MD但电容的焊盘尺寸应符合图14的规定。见图14：Gr id注：元件在波峰焊时，Y尺寸向外侧增加0.2mm,X尺寸不变，封装名称加后缀“T”。封装名称Z(mm)G(mm)X(mm)Y(mm)C(mm)区域网格（网格单元号码）re fre f3216T4.800.801.202.002.806X123528T5.001.002.20
34、2.003.008X126032T7.602.402.202.605.008X187343T9.003.803.002.606.4010X20图14 S MD锂电容焊盘尺寸15Q/Z X-20006.1.5 ME LF（金属电极无引线端面元件）6.1.5.1 ME LF元件尺寸ME LF元件尺寸应符合图15的规定。见图15：图15 ME LF元件尺寸11J1SLmm in封装名称L(mm)S(mm)W(mm)T(mm)元件类型MinMaxminmaxminmaxminmaxS 0D 80MLL343.303.702.202.651.601.700.410.55二极管S 0D 87MLL414.
35、805.203.804.252.442.540.360.50二极管2012ME 0805M1.902.101.161.441.351.450.230.370.10mW电阻3216ME 1206M3.003.401.862.311.751.850.430.570.25mW电阻3516ME 1406M3.303.702.162.611.551.650.430.570.12W电阻5923ME 2309M5.706.104.364.812.402.500.530.670.25W电阻16Q/Z X-20006.1.5.2 ME LF的焊盘尺寸ME LF的焊盘尺寸应符合图16的规定。见图16：图16 ME
36、 LF焊盘尺寸XGr id plac ement c o ur t yar d1Opt io nal det ent pat t er nmm in封装名称Z(mm)G(mm)X(mm)Y(mm)C(mm)AB区域网格（网格单元号码）re fr（、S 0D 80MLL344.802.001.801.403.400.500.506X12S 0D 87E MLL416.303.402.601.154.850.500.506X142012ME 0805M3.200.601.601.301.900.500.354X83216ME 1206M4.401.202.001.602.800.500.556X1
37、03516ME 1406M4.802.001.801.403.400.500.556X125923ME 2309M7.204.202.601.505.700.500.656X18注：元件在波峰焊比，丫尺寸向外侧增加0.2mm,X尺寸不变，封装名称加后缀“TV,。17Q/Z X-20006.1.6 S MD 排阻6.1.6.1 S MD排阻元件尺寸S MD排阻元件尺寸应符合图17的规定。见图17：重路外形CIRCUIT CONFIGURATIO7N4*04L3F i 1J-/-Tw胤长尺寸DIMENSIONSI51 r|TjpeW TABpCrCHIMW 3.2t0 101.6*0.15 0.5
38、*0 100.5*0.150.3t0 15 I0.8t0.10.3 0.15KMOMW 5.08x0.303.2 x 0.20 0.6 10.101 0.9x0.150,5*62|1.27*0.10,580.15封装名称L(mm)W(mm)T(mm)A(mm)B(mm)P(mm)C(mm)1206R A3.20.101.60.150.50.100.50.150.30.150.80.10.30.15图17 S MD排组元件尺寸18Q/Z X-20006.1.6.2 S MD排阻焊盘尺寸S MD排阻焊盘尺寸应符合图18的规定。见图18：图18 S MD排阻焊盘尺寸封装名称区域网格（网格单元号码）1
39、206R A8x619Q/Z X-20006.1.7 S OT 236.1.7.1元件尺寸S OT 23的尺寸应符合图19的规定。见图19：图19 S OT 23的元件尺寸2 8-3.00H一171Cxi1十S e e p rofile .fableITp封装名称L(mm)S(mm)W(mm)T(mm)H(mm)P(mm)MinmaxminmaxminmaxminmaxmaxnomS OT 232.302.601.101.470.360.460.450.601.100.9520Q/Z X-20006.1.7.2 S OT 23的焊盘尺寸S OT 23的焊盘尺寸应符合图20的规定。见图20：图2
40、0 S OT 23焊盘尺寸封装名称Z(mm)G(mm)X(mm)Y(mm)C(mm)E(mm)区域网格（网格单元号码）re fR e fre fS OT 23（回流焊）3.600.801.001.402.200.958X8注:如果采用波峰焊工艺，“Y”尺寸外延0.2 mm.21Q/Z X-20006.1.8 S OT 896.1.8.1元件尺寸S OT 89的尺寸应符合图21的规定。见图21：封装名称 L(mm)T(mm)W1(mm)W2(mm)W3(mm)K(mni)H P(mm)(mm)min max min max min max min max min max min max max
41、basicS OT 89 3.94 4.25 0.89 1.20 0.36 0.48 0.44 0.56 1.62 1.83 2.60 2.85 1.60 1.50图21 S OT 89的元件尺寸22Q/Z X-20006.1.8.2 S OT 89的焊盘尺寸S OT 89的焊盘尺寸应符合图22的规定。见图22：图22 S OT 89焊盘尺寸封装名称Z (mm)Y 1(mm)XI(mm)X2(mm)X3(mm)Y 2(mm)Y 3(mm)E(mm)区域网格（网格单元号码）Minmaxminmaxre fR e fbasicS OT 895.101.100.800.801.001.802.002
42、.404.901.5012X1023Q/Z X-20006.1.9 S OD 1236.1.9.1元件尺寸S OD 123的尺寸应符合图23的规定。见图23：soc1235zM一SMBL廿 JL-1一工工TsT封装名称L(mm)S(mm)W1(mm)W2(mm)T(mm)H(mm)minMaxMinmaxminmaxminmaxMinmaxmaxS OD 1233.553.852.352.930.450.651.401.700.250.601.35S MB5.215.592.173.311.962.213.303.940.761.522.41图23 S OD 123的元件尺寸24Q/Z X-2
43、0006.1.9.2 S OD 123的焊盘尺寸S OD 123的焊盘尺寸应符合图24的规定。见图24：CGrid placement couryard _/XJYGZ封装名称Z(mm)G(mm)X(mm)Y(mm)C(mm)区域网格（网格单元号码）re fre fS OD 1235.001.800.801.603.404X12S MB6.802.002.402.404.408X16图24 S OD 123焊盘尺寸25Q/Z X-20006.1.10 S OT 1436.1.10.1元件尺寸S OT 143的尺寸应符合图25的规定。见图25：封装名称L(mm)S(mm)W1(mm)W2(mm)
44、T(mm)Pl(mm)P2(mm)I(mm)MinMaxminmaxMinmaxminmaxMinmaxbasicbasicMaxS OT 1432.102.641.001.690.370.460.760.890.25().551.921.721.20图25 S OT 143的元件尺寸26Q/Z X-20006.1.10.2 S OT 143的焊盘尺寸S OT 143的焊盘尺寸应符合图26的规定。见图26：图26 S OT 143焊盘尺寸封装名称Z(mm)G(mm)XI(mm)X2(mm)C(mm)E l(mm)E 2(mm)Y(mm)区域网格（网格单元号码）Minmaxre fbasicBa
45、sicre fS OT 1433.600.801.001.001.202.201.901.701.408X827Q/Z X-20006.1.11 S OT 2236.1.11.1元件尺寸S OT 223的尺寸应符合图27的规定。见图27：封装 名称L(mm)S(mm)W1(mm)W2(mm)T(mm)H(mm)Pl(mm)P2(mm)MinMaxminmaxMinmaxminmaxMinmaxmaxbasicBasicS OT 2236.707.304.104.920.600.882.903.180.901.301.802.304.60图27 S OT 223的元件尺寸28Q/Z X-2000
46、6.1.11.2 S OT 223的焊盘尺寸S OT 223的焊盘尺寸应符合图28的规定。见图28：图28 S OT 223焊盘尺寸封装名称Z(mm)G(mm)XI(mm)X2(mm)Y(mm)C(mm)E l(mm)E 2(mm)区域网格（网格单元号码）Minmaxre fre fbasicbasicS OT 2238.404.001.203.403.602.206.202.304.6018X1429Q/Z X-20006.1.12 TO 252/TO 2686.1.12.1元件尺寸TO 252的尺寸应符合图29的规定。见图29：6 35-6 734 32MIN封装名称L(mm)W1(mm)
47、W2(mm)T1(mm)T2(mm)Pl(mm)P2(mm)(mm)MinMaxminMaxMinmaxminmaxMinmaxbasicbasicmaxTS-003a9.3210.410.640.914.355.350.510.804.005.502.284.572.38TS-005b14.6015.880.510.916.226.862.292.798.009.002.545.084.83TO 26818.7019.101.151.4513.3013.602.402.7012.4012.705.4510.905.10注a:以前为TO 252O注b：以前为TO 263o图29 TO 252的
48、元件尺寸30Q/Z X-20006.1.12.2 TO 252的焊盘尺寸TO 252的焊盘尺寸应符合图30的规定。见图30：图30 T0 252焊盘尺寸封装名称Z(mm)Y 1(mm)Y 2(mm)XI(mm)X2(mm)C(mm)区域网格（网格单元号码）re fTS-003*11.201.606.201.005.407.3024X16TS-005*16.603.409.601.006.8010.1036X24T0 26819.803.4013.401.4013.6011.4042X3431Q/Z X-20006.1.13.1 S MD 220 元件尺寸元件尺寸应符合图31的规定。见图31：6
49、.1.13 S MD 220元件（对应物料代码为15100085等）4.69(0.18)42。(0.16)10.16(0.40)1 REF.h1.32(0 05)1 22(0.05)JL5.280.204.78(0.19)0.55(0.02)0.46(0.02)0.61(0.02)MAX.I*-5.08(0.20)REF.Dimensio ns in millimet er sand inc hes封装名称D2 Pak(SMD-220)图31 S MD-220元件尺寸32Q/Z X-20006.1.13.2 S MD-220 焊盘尺寸焊盘尺寸应符合图32的规定。见图32：33Q/Z X-200
50、06.1.14 S MA元件（对应物料代码为15100016a）6.1.14.1 S MA元件尺寸S MA元件尺寸应符合图33的规定。见图33：DIMINCHESMILLIMETERSMINMAXMINMAXA0.1600.1804.064.57B0.0900.1152.292.92C0.0750.1051.912.67D0.0500.0641.271.63H0.0040.0080.100.20J0.0060.0160.150.41K0.0300.0600.761.52S0.1900.2204.835.59SMAPLASTIC PACKAGE封装名称CASE 403B-01ISSUE 0图33