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1、MISSING IMAGE产品规格书ZT2835IRM1-94090度钻光杨小姐：一叁叁一陆捌玖贰捌贰柒正面图外形111Outlinedimensions ：M面图90CO003 / 4 toj3?5i：oj缺口+正面困焊盘建议图0 jlOJ0,105 oj缺口O+1OJ71+ 103焊盘建议大小 Recommended size of pad焊点结构 Pad Configuration ：焊点Pad功能 Function1正极Anode2负极 Cathode注释：1 .所有尺寸单位为毫米所用尺寸罩位悬毫米2 .如果无其它注明，公差范围通常采用0毫米。missing image x 光重参数
2、Photoelectricity Parameter （璟境温度 Ambient temperature ： 25C ;累度 humidity ： RH60%）参数Parameter符号Symbol测试条件最小Min平均Typ最大Max单位Unit光功率Luminous powerPoIF=20mA10mWIF=100mA45光强Luminous intensityIeIF=20mA6mW/SrIF=100mA30视角 Emission Angle201/260Deg波长 Wavelength入PIF=100mA925940955nm半波宽 Half wave width入IF=100mA60
3、nm正向电压Forward VoltageVFIF=20mA1.1-1.7VIF=100mA1.3-2.0反向电流Reverse currentIRVR=5,0V-10口 A：亮度测公差15%、波晨汛唁式公差lnm、正向重屋测就公差0.05VRemark ： The toleranceof intensity:15%, The tolerance of wave length:lnm,The tolerance of forwards voltage: 0.05V. Only reference for above data when testing.三、上亟限参数 Absolute Maxi
4、mum Rating （璟境温度 Ambient temperature : 25C。度 humidity ： RH60%）电气特性Electrical characteristicsSymbol额定值Rated Value单位Unit环境温condition Temperature最大持续工作电流Max continuous working currentIFW100mATa=25最大脉冲工作电流* Max pulse currentIFP300mATa=25反向电压Reverse breakdown voltageVR10VTa=25工作温度Operating TemperatureTop
5、r-25C to +85C存储温度Storage TemperatureTstg0C to +40C回流焊温度Circle solder TemperatureTsoi245C for lOsec结温complete TemperatureTj115Fig.l - Relative luminous Intensity vs. Forward Currento 0 8 6 4 2 0 L S 6sss UJ 00 二 B PSBUUOS xnLEW.SPBHRH8000Fig.2 - Forward Current vs. Forward Voltage00 19If-Forward Curr
6、ent mAFig.3 - Relative Radiant Flux (100mA) vs. Ambient TemperatureVf-Forward Voltage V4 - Forward Voltage (100mA) vs. Ambient Temperatureo 4080601.61.5告1.4 1.31.200180604020020406080100Ta PCFig.6 - Maximum Driving Forward DC Current vs. AmbientTemperature (De-rating based on Tj max. = 115cC)Fig.5 -
7、 Peak Wavelength ( 100mA) vs. Ambient Temperatureo o o o o o o 8 7 6 5 232 9 9 9 9 9 9 9Eu】dMo o o o o o o 2 0 8 6 4 21 1.100 C5C5min5min50Cycles220冷热退圈Cold and heat cycle testJIS7021:A35min 5min 5min50Cycles220MIL-STD- 202:107D MIL-STD- 705:105E-35C。25C。85co - 35C30min 5min 30min5min判隆计票型 Judging c
8、riterion:工程Item符虢Symbol修件Experiment condition判断木票举CriteriaMin.Max.Forward VoltageVflF=100mAInitial Datexl.lReverse CurrentIrVr=5V30|jALuminous IntensityIVlF=100mAInitial Datex0.8六、储存打包装前在温度不超谩40C。及漏度不超谩90%RH脩件下，LED可以保存一年，在储存的日寺候，建用带乾燥W0的防潮袋的包装方式。打包装接LED需要储存在=40C。& =60%RH相封漏度的脩件下，我优为负烈建言羲您彳花打包装到完成贴片整
9、他谩程在一他星期内完成。如果有未使用完的剩绘led,我优建重新使用出J日寺的防潮WJ,或且需要重新密 封。如果韩燥W0谩期了，LED放在70C。烤箱烘烤12小畤。led甯趣和引框架是由外表18了的铜合金横成，ifiigJS畲受到来自周圉璟境的破 , 把LED遽雕那槿曾腐触LED甯趣眉的璟境，LED甯趣被腐触彳爰，曾降低它 的焊接能力和光甯参数。吉青防止LED使用在温度快速燮化的璟境中，尤其是曾彝生冷凝的高潟璟境中。防青争霜静雷和浪涌重H曾损壤LED,建接斶LED日寺必须佩戴防静雷璟和防静重手套。 所有借、装置和械器必须接地，建取相JS措施防止浪涌甯H擎穿LED。Precaution for u
10、se(l)Before opening the packageThe LEDs should be kept at40 &90%RH and should be used within a year. When storing the LEDs, moisture proof package with absorbent materialfsilica gel) is recommended.(2)After opening the packageThe LEDs should be kept at=40 C &=60%RH and LEDs should be soldered within
11、 72 hours after opening the moisture proof package. Unused LEDs should be placed in the original moisture proof package which must be re-sealed again. If the moisture absorbent material has expired, the package should be baked at 70 C for 12 hours.The LEDs electrode and leadframe comprise a silver p
12、lated copper alloy. This silver surface may be affected by its surrounding environment. Please avoid conditions which may cause the LEDs to corrode or discolor. The corrosion or discoloration might lower solder ability or affect its optical characteristics.Please avoid rapid transition in ambient te
13、mperature, especially in high humidity environments where condensation can occur.Static electricitySince static electricity or surge voltage will damage the LEDsz anti-electrostatic wristband or anti-electrostatic gloves should be worn when handling the LEDs.All devices, equipments and machinery must be properly grounded. Measures must be taken to prevent surge voltage to the equipment that mounts the LEDs.