2022年Atom开发手册 .pdf

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1、Developer s Kit User Manual Intel? Atom? Processor N270 and Mobile Intel? 945GSE Express Chipset Development Kit User s Manual September 2008 Revision 002 320436-002 名师资料总结 - - -精品资料欢迎下载 - - - - - - - - - - - - - - - - - - 名师精心整理 - - - - - - - 第 1 页,共 36 页 - - - - - - - - - 2 Developer s Kit User Ma

2、nual INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL? PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT. EXCEPT AS PROVIDED IN INTELS TERMS AND CONDITIONS OF SALE FOR SUCH PRODUCTS, INTEL ASSUMES NO L

3、IABILITY WHATSOEVER, AND INTEL DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY, RELATING TO SALE AND/OR USE OF INTEL PRODUCTS INCLUDING LIABILITY OR WARRANTIES RELATING TO FITNESS FOR A PARTICULAR PURPOSE, MERCHANTABILITY, OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. Inte

4、l products are not intended for use in medical, life saving, life sustaining, critical control or safety systems, or in nuclear facility applications. Intel may make changes to specifications and product descriptions at any time, without notice. Designers must not rely on the absence or characterist

5、ics of any features or instructions marked “reserved” or “undefined.” Intel reserves these for future definition and shall have no responsibility whatsoever for conflicts or incompatibilities arising from future changes to them. The information here is subject to change without notice. Do not finali

6、ze a design with this information. The products described in this document may contain design defects or errors known as errata which may cause the product to deviate from published specifications. Current characterized errata are available on request. Contact your local Intel sales office or your d

7、istributor to obtain the latest specifications and before placing your product order. Copies of documents which have an order number and are referenced in this document, or other Intel literature, may be obtained by calling 1-800-548-4725, or by visiting Intel s Web Site. Any software source code re

8、printed in this document is furnished under a software license and may only be used or copied in accordance with the terms of that license. Intel processor numbers are not a measure of performance. Processor numbers differentiate features within each processor family, not across different processor

9、families. See http:/ for details. Code Names are only for use by Intel to identify products, platforms, programs, services, etc. (“products”) in development by Intel that have not been made commercially available to the public, i.e., announced, launched or shipped. They are never to be used as “ com

10、mercial” names for products. Also, they are not intended to function as trademarks. *Other names and brands may be claimed as the property of others. The Intel? Atom? Processor N270 and Mobile Intel? 945GSE Express Chipset may contain design defects or errors known as errata which may cause the prod

11、uct to deviate from published specifications. Current characterized errata are available on request. Contact your local Intel sales office or your distributor to obtain the latest specifications and before placing your product order. Intel? Atom Processor N270, Intel? 945GSE Express Chipset, and the

12、 Intel logo are trademarks or registered trademarks of Intel Corporation or its subsidiaries in the United States and other countries. *Other names and brands may be claimed as the property of others. Copyright ? 2008, Intel Corporation. All rights reserved. 名师资料总结 - - -精品资料欢迎下载 - - - - - - - - - -

13、- - - - - - - - 名师精心整理 - - - - - - - 第 2 页,共 36 页 - - - - - - - - - Developer s Kit User Manual 3 Contents 1About This Manual.71.1Content Overview.71.2Text Conventions.81.3Glossary of Acronyms.91.4Technical Support.101.4.1Additional Technical Support.101.5Product Literature.111.6Related Documents.12

14、2Getting Started.132.1Overview.132.2Development Board Features.152.3Included Hardware and Documentation.162.4Software Key Features.172.4.1EFI firmware.172.5Before You Begin.183Theory of Operation.193.1Block Diagram.193.2Mechanical Form Factor.193.3Thermal Management.193.3.1Thermal Solution.203.4Powe

15、r Management.203.4.1Power Management States.203.4.2Power Measurement Support.203.5Intel? Atom? Processor N270.213.5.1Processor Voltage Regulators.213.5.2FSB.213.5.3Power Management.213.5.4Debug Interfaces.213.5.5Testability.213.6Mobile Intel? 945GSE Express Chipset GMCH.223.6.1Memory.223.6.2Graphics

16、.223.7ICH7M.223.7.1PCI Expansion Slot.223.7.2PCIe* x1 Expansion Slot.223.7.3PCIe* Mini-Card.233.7.4LAN.233.7.5USB 2.0.233.7.6Audio.233.7.7SATA.233.7.8IDE.243.7.9TPM.243.7.10GPIO.25名师资料总结 - - -精品资料欢迎下载 - - - - - - - - - - - - - - - - - - 名师精心整理 - - - - - - - 第 3 页,共 36 页 - - - - - - - - - 4 Developer

17、 s Kit User Manual 3.7.11PCI Configuration Space.274Hardware Reference.294.1Primary Features.294.2Power.294.2.1Power Supply.304.3I/O Headers and Connectors.304.3.1Front Panel I/O Headers.304.3.2Back Panel I/O Connectors.314.4Configuration Settings.324.4.1Configuration Jumpers/Switches.324.4.2System

18、EFI Firmware Configuration.324.5LED.335Software.345.1EFI Firmware.345.1.1Overview.345.1.2EFI Setup Security.345.1.3PXE Boot Support.345.1.4ACPI.345.2OS Support.346Quick Start.356.1Required Peripherals.356.2Power Up/Power Down.35Figures Figure 1. Intel? Atom? Processor N270 and Mobile Intel? 945GSE E

19、xpress Chipset Board (Top View).14Figure 2. Intel? Atom? Processor N270 and Mobile Intel? 945GSE Express Chipset CRB Block Diagram.19Figure 3. CRB Components.29Figure 4. Front Panel.30Figure 5. Back Panel.31Figure 6. Firmware Hub.32Tables Table 1. Text Conventions.8Table 2. Acronyms.9Table 3. Intel

20、Literature Centers.11Table 4. Related Documents.12Table 5. Intel? Atom? Processor N270 and Mobile Intel? 945GSE Express Chipset CRB Feature Set Summary.15Table 6. Platform Power Management States.20Table 7. ICH GPIOs.25Table 8. PCI Configuration Space.27名师资料总结 - - -精品资料欢迎下载 - - - - - - - - - - - - -

21、 - - - - - 名师精心整理 - - - - - - - 第 4 页,共 36 页 - - - - - - - - - Developer s Kit User Manual 5 Table 9. CRB LEDs.33名师资料总结 - - -精品资料欢迎下载 - - - - - - - - - - - - - - - - - - 名师精心整理 - - - - - - - 第 5 页,共 36 页 - - - - - - - - - 6 Developer s Kit User Manual Revision History Document Number Revision Number

22、 Description Revision Date 320436 001 Initial release. August 2008 320436 002 ? Updated Chapter 5 EFI Firmware September 2008 名师资料总结 - - -精品资料欢迎下载 - - - - - - - - - - - - - - - - - - 名师精心整理 - - - - - - - 第 6 页,共 36 页 - - - - - - - - - About This Manual Developer s Kit User Manual 7 1About This Manua

23、l This manual describes the typical hardware set-up procedures, features, and use of the Intel? Atom? Processor N270 and Mobile Intel? 945GSE Express Chipset Customer Reference Board (CRB) and other components included in the Development Kit. This manual is written for OEMs, system evaluators, and e

24、mbedded system developers. This document defines all jumpers, headers, LED functions, and their locations on the development board along with subsystem features. This manual assumes basic familiarity in the fundamental concepts involved with installing and configuring hardware for a personal compute

25、r system. Note:Read this document in its entirety prior to applying power to the motherboard. Chapter 6 provides quick start procedures. Intel recommends having both the schematic and board present while reading this document. The references in this document correlate to reference designators and bo

26、ard properties of Intel? Atom? Processor N270 and Mobile Intel? 945GSE Express Chipset FAB B Customer Reference Board. This manual is intended to be used with the Development Kit but can also be used to help bring up the Intel? Atom? Processor N270 and Mobile Intel? 945GSE Express Chipset board, alt

27、hough not all associated peripherals will be included with the development board. 1.1Content Overview Chapter 1.0, “ About This Manual” This chapter contains a description of conventions used in this manual. The last few sections explain how to obtain literature and contact customer support. Chapter

28、 2.0, “ Getting Started” This chapter identifies key components, features and specifications. Chapter 3.0, “ Theory of Operation” This chapter provides information on the system design. Chapter 4.0, “ Hardware Reference” This chapter provides a description of development kit primary features, connec

29、tors, and configuration settings. Chapter 5.0, “ Software” This chapter provides information on system BIOS and OS support. Chapter 6.0, “ Quick Start” This chapter provides a summary of hardware and power-on instructions for the development kit. 名师资料总结 - - -精品资料欢迎下载 - - - - - - - - - - - - - - - -

30、- - 名师精心整理 - - - - - - - 第 7 页,共 36 页 - - - - - - - - - Developer s Kit User Manual 1.2Text Conventions The notations listed in Table 1 may be used throughout this manual. Table 1. Text Conventions Notation Definition # The pound symbol (#) appended to a signal name indicates that the signal is acti

31、ve low. (e.g., PM_BMBUSY#) Variables Variables are shown in italics. Variables must be replaced with correct values. Instructions Instruction mnemonics are shown in uppercase. When you are programming, instructions are not case-sensitive. You may use either uppercase or lowercase. Numbers Hexadecima

32、l numbers are represented by a string of hexadecimal digits followed by the character H. A zero prefix is added to numbers that begin with A through F. (For example, FF is shown as 0FFH.) Decimal and binary numbers are represented by their customary notations. (That is, 255 is a decimal number and 1

33、111 is a binary number. In some cases, the letter B is added for clarity.) Units of Measure A GB KB KmA MB MHz ms mW ns pF W V A F s W The following abbreviations are used to represent units of measure: amps, amperes gigabytes kilobytes kilo-ohms milliamps, milliamperes megabytes megahertz milliseco

34、nds milliwatts nanoseconds picofarads watts volts microamps, microamperes microfarads microseconds microwatts Signal Names Signal names are shown in uppercase. When several signals share a common name, an individual signal is represented by the signal name followed by a number, while the group is re

35、presented by the signal name followed by a variable (n). For example, the lower chip-select signals are named CS0#, CS1#, CS2#, and so on; they are collectively called CSn#. A pound symbol (#) appended to a signal name identifies an active-low signal. Port pins are represented by the port abbreviati

36、on, a period, and the pin number (e.g., P1.0). 名师资料总结 - - -精品资料欢迎下载 - - - - - - - - - - - - - - - - - - 名师精心整理 - - - - - - - 第 8 页,共 36 页 - - - - - - - - - Developer s Kit User Manual 1.3Glossary of Acronyms Table 2 defines the acronyms used throughout this document. Table 2. Acronyms Term Definitio

37、n ACPI Advanced Configuration and Power Interface AGTL Assisted Gunning Transceiver Logic ATA Advanced Technology Attachment (disk drive interface) ATX Advanced Technology Extended (motherboard form Factor) BGA Ball Grid Array BIOS Basic Input/Output System CMOS Complementary Metal-Oxide-Semiconduct

38、or CRB Customer Reference Board DDR Double Data Rate DMA Direct Memory Access DVI-D Digital Visual Interface Digital only EFI Extensible Firmware Interface FAE Field Application Engineer FCBGA Flip Chip Ball Grid Array FSB Front Side Bus FWH Firmware Hub GMCH Graphics Memory Controller Hub GPIO Gene

39、ral Purpose Input Output HDD Hard disk drive ICH I/O Controller Hub IDE Integrated Device Electronics Intel? HD Audio Intel? High Definition Audio ITP In-Target Probe LAN Local Area Network LED Light Emitting Diode LPC Low Pin Count OS Operating System PATA Parallel AT Attachment PCIe* PCI Express*

40、名师资料总结 - - -精品资料欢迎下载 - - - - - - - - - - - - - - - - - - 名师精心整理 - - - - - - - 第 9 页,共 36 页 - - - - - - - - - About This Manual 10 Developer s Kit User Manual Term Definition POST Power-on self-test PXE Pre-boot Execution Environment RTC Real Time Clock SATA Serial Advanced Technology Attachment SIO

41、Super Input Output SMB System Management Bus SMC System Management Controller SO-DIMM Small Outline Dual In-line Memory Module SPI Serial Peripheral Interface Bus SSD Solid-state Drive TDP Thermal Design Power TPM Trusted Platform Module USB Universal Serial Bus VGA Video Graphics Array VID Voltage

42、Identification VRM Voltage Regulator Module WoL Wake on LAN XDP Extended Debug Port1.4Technical Support Support Services for your hardware and software are provided through the secure Intel? Premier Support Web site at https:/. After you log on, you can obtain technical support, review “ What s New,

43、” and download any items required to maintain the platform. Support is provided through the following product: Dev Kit (Embedded/N270/945GSE/ICH7M). 1.4.1Additional Technical Support If you require additional technical support, please contact your field sales representative or local distributor. 名师资

44、料总结 - - -精品资料欢迎下载 - - - - - - - - - - - - - - - - - - 名师精心整理 - - - - - - - 第 10 页,共 36 页 - - - - - - - - - Developer s Kit User Manual 1.5Product Literature To order hard copies of product literature, the following instructions should be followed: 1.Determine the SKU Number If you do not know the SK

45、U # of the document you are ordering, please refer to or contact your FAE. The SKU # is the first 6 digits of the number on the PDF file, such as: 12345612.pdf or at the bottom of the download page for that document. 2.Call, Mail or Email a request Call: To place an order for a publication or text i

46、n hardcopy or CD form, please contact our Intel? Literature Fulfillment Centers listed in Table 3 . Table 3. Intel Literature Centers Location Telephone Number U.S. and Canada 1-800-548-4725 International 1-303-675-2148 Fax 1-303-675-2120 Mail a request to: Intel Literature Fulfilment Center P.O. Bo

47、x 5937 Denver, Colorado 80217-9808 USA Email a request to: Please make sure to include in your mailed/emailed request: SKU # Company Name Your Name (first, last) Full mailing address Daytime Phone Number in case of questions Note:Please be aware not all documents are available in all media types. So

48、me may only be available as a download. 名师资料总结 - - -精品资料欢迎下载 - - - - - - - - - - - - - - - - - - 名师精心整理 - - - - - - - 第 11 页,共 36 页 - - - - - - - - - About This Manual 12 Developer s Kit User Manual 1.6Related Documents Table 4 is a partial list of the available collateral. For the full lists, conta

49、ct your local Intel representative. Table 4. Related Documents Document Document Numbers/ Location Processor and GMCH-Related Documents Basic Mobile Platform 08 Design GuideIntel? Atom? Processor N270 with Intel? 945GSE Express Chipset Platform Design Guide Addendum Intel? Atom? N270 Processor with

50、Mobile Intel? 945GSE Express Chipset Schematic Contact your FAE for the latest revision Mobile Intel? Atom? Processor N270 Single Core Datasheet http:/ Atom? Processor N270 Series Specification Update http:/ Intel? 945 Express Chipset Family Datasheet Intel? 945 Express Chipset Family Specification

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