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1、MPXHZ6116ARev 1, 04/2009Freescale SemiconductorTechnical Data? Freescale Semiconductor, Inc., 2009. All rights reserved.Media Resistant Integrated Silicon Pressure Sensor for Measuring Absolute Pressure, On-Chip Signal Conditioned, Temperature Compensated and Calibrated The MPXHZ6116A series pressur
2、e sensor integrates on-chip, bipolar op amp circuitry and thin film resistor networks to provide a high output signal and temperature compensation. The sensors packaging has been designed to provide resistance to high humidity conditions as well as common automotive media. The small form factor and
3、high reliability of on-chip integration make this sensor a logical and economical choice for the system designer.The MPXHZ6116Aseries pressure sensor is a state-of-the-art, monolithic, signal conditioned sensor designed for a wide range of applications, but particularly those employing a microcontro
4、ller or microprocessor with A/D inputs. This piezoresistive transducer combines advanced micromachining techniques, thin film metallization, and bipolar processing to provide an accurate, high level analog output signal that is proportional to the applied pressure.Features?Resistant to High Humidity
5、 and Common Automotive Media?1.43% Maximum Error over 0 to 85C?Temperature Compensated from -40C to +125 C?Durable Thermoplastic (PPS) Surface Mount Package (SSOP) with Optional Axial Port?Ideally Suited for Microprocessor or MicrocontrollerBased SystemsORDERING INFORMATIONDevice TypeOptionsCase No.
6、MPX Series Order No.Packing OptionsDevice MarkingSUPER SMALL OUTLINE PACKAGEBasic ElementAbsolute, Element Only1317MPXHZ6116A6URailsMPXHZ6116AAbsolute, Element Only1317MPXHZ6116A6T1Tape & ReelMPXHZ6116APorted ElementAbsolute, Axial Port1317AMPXHZ6116AC6URailsMPXHZ6116AAbsolute, Axial Port1317AMPXHZ6
7、116AC6T1Tape & ReelMPXHZ6116AMPXHZ6116ASeriesINTEGRATED PRESSURE SENSOR20 to 116 kPa (2.9 to 16.8 PSI)0.399 to 4.645 V Output(SUPER SMALL OUTLINE PACKAGEMPXHZ6116A6U/6T1CASE 1317-04MPXHZ6116AC6U/C6T1CASE 1317A-03SUPER SMALL OUTLINE PACKAGEPIN NUMBERS(1)1234N/CVSSGNDVOUT5678N/CN/CN/CN/C1. Pins 1, 5,
8、6, 7, and 8 are internal device connections. Do not connect to external circuitry or ground. Pin 1 is denoted by the notch in the lead. This document contains certain information on a new product.Specifications and information herein are subject to change without notice.名师资料总结 - - -精品资料欢迎下载 - - - -
9、- - - - - - - - - - - - - - 名师精心整理 - - - - - - - 第 1 页，共 11 页 - - - - - - - - - MPXHZ6116ASensors2Freescale SemiconductorPreliminaryFigure 1 shows the block diagram of the internal circuitry integrated on the pressure sensor chip. Figure1. Fully Integrated Pressure Sensor SchematicTable 1. Maximum R
10、atings(1)1.Exposure beyond the specified limits may cause permanent damage or degradation to the device.RatingSymbolValueUnitsMaximum PressurePmax400kPaStorage TemperatureTstg-40 to +125 COperating TemperatureTA-40 to +125 COutput Source Current Full Scale Output(2)2.Maximum Output Current is contro
11、lled by effective impedance from Vout to Gnd or Vout to VS in the application circuit.Io+0.5mAdcOutput Sink Current Minimum Pressure Offset(2)Io-0.5mAdcPins 1, 5, 6, 7, and 8 are NO CONNECTSSensingElementVOUTVSGain Stage #2GNDand GroundReferenceShiftCircuitryThin FilmTemperatureCompensationandGain S
12、tage #1名师资料总结 - - -精品资料欢迎下载 - - - - - - - - - - - - - - - - - - 名师精心整理 - - - - - - - 第 2 页，共 11 页 - - - - - - - - - MPXHZ6116ASensorsFreescale Semiconductor3PreliminaryTable 2. Operating Characteristics(VS = 5.0 Vdc, TA = 25 C unless otherwise noted. Decoupling circuit shown in Figure re-quired to m
13、eet electrical specifications.)CharacteristicSymbolMinTypMaxUnitPressure RangePOP20115kPaSupply Voltage(1)VS4.755.05.25VdcSupply CurrentIS6.010mAdcFull Scale Span(2)(0 to 85 C)VFSS4.2VdcOffset(3)(0 to 85 C)Voff0.3350.3990.463VdcSensitivityV/P44.2mV/kPaAccuracy(4)(0 to 85 C)-1.5+1.5%VFSS1.Device is r
14、atiometric within this specified excitation range.2.Full Scale Span (VFSS) is defined as the algebraic difference between the output voltage at full rated pressure and the output voltage at the minimum rated pressure.3.Offset (Voff) is defined as the output voltage at the minimum rated pressure.4.Ac
15、curacy (error budget) is the deviation in actual output from nominal output over the entire pressure range and temperature range as a percent of VSS span at 25 C due to all sources of error including the following:? Linearity:Output deviation from a straight line relationship with pressure over the
16、specified pressure range.? Temperature Hysteresis:Output deviation at any temperature within the operating temperature range, after the temperature is cycled to and from the minimum or maximum operating temperature points, with zero differential pressure applied.? Pressure Hysteresis:Output deviatio
17、n at any pressure within the specified range, when this pressure is cycled to and from minimum or maximum rated pressure at 25 C.? Offset Stability: Output deviation, after 1000 temperature cycles, -40 to 125 C, and 1.5 million pressure cycles, with minimum rated pressure applied.? TcSpan:Output dev
18、iation over the temperature range of 0 to 85 C, relative to 25 C.? TcOffset:Output deviation with minimum pressure applied, over the temperature range of 0 to 85 C, relative to 25 C.名师资料总结 - - -精品资料欢迎下载 - - - - - - - - - - - - - - - - - - 名师精心整理 - - - - - - - 第 3 页，共 11 页 - - - - - - - - - MPXHZ6116
19、ASensors4Freescale SemiconductorPreliminaryON CHIP TEMPERATURE COMPENSATION, CALIBRATION, AND SIGNAL CONDITIONINGFigure2. Cross Sectional Diagram SSOP (not to scale)Figure3. Typical Application Circuit(Output Source Current Operation)Figure4. Output vs. Absolute Pressure The performance over tempera
20、ture is achieved by integrating the shearstress strain gauge, temperature compensation, calibration, and signal conditioning circuitry onto a single monolithic chip.Figure 2 illustrates the configuration in the basic chip carrier (case 1317-04) prior to porting. A gel die coat isolates the die surfa
21、ce and wire bonds from the environment, while allowing the pressure signal to be transmitted to the sensor diaphragm. The gel die coat and durable thermoplastic package provide a media resistant barrier that allows the sensor to operate reliably in high humidity conditions as well as common automoti
22、ve media. NOTE: The MPXHZ6116A series pressure sensors operating characteristics, internal reliability and qualification tests are based on use of air as the pressure media. Media, other than air, may have adverse effects on sensor performance and longterm reliability. Contact the factory for inform
23、ation regarding media compatibility in your application.Figure 3 shows the recommended decoupling circuit for interfacing the integrated sensor to the A/D input of a microprocessor or microcontroller. Proper decoupling of the power supply is recommended.Wire BondStainlessSteel CapThermoplasticCaseDi
24、e BondSealed Vacuum ReferenceFluoro SiliconeGel Die CoatLeadFrameAbsolute ElementP1DieVS Pin 2+5.0 VGND Pin 3Vout Pin 4MPXHZ6116Ato ADC100 nF51 K47 pFOUTPUT(V)5.04.54.03.53.00204060801002.52.01.51.00.50140120 Vout = VS (0.008938 x P (kPa) - 0.09895) (1.5 x TM x VS x 0.008938) VS = 5.0 V 0.25 TEMP =
25、0 to 85oCMAXMINPRESSURE (kPa)NOM名师资料总结 - - -精品资料欢迎下载 - - - - - - - - - - - - - - - - - - 名师精心整理 - - - - - - - 第 4 页，共 11 页 - - - - - - - - - MPXHZ6116ASensorsFreescale Semiconductor5PreliminaryMINIMUM RECOMMENDED FOOTPRINT FOR SUPER SMALL PACKAGESSurface mount board layout is a critical portion of t
26、he total design. The footprint for the semiconductor package must be the correct size to ensure proper solder connection interface between the board and the package. With the correct pad geometry, the packages will self-align when subjected to a solder reflow process. It is always recommended to fab
27、ricate boards with a solder mask layer to avoid bridging and/or shorting between solder pads, especially on tight tolerances and/or tight layouts.Figure5. SSOP Footprint (Case 1317 and 1317A) Temperature Error BandMPXHZ6116A SERIESBreak PointsTempMultiplier- 402.850 to 850.961251.66Temperature in Co
28、4.03.02.00.01.0-40-20020406014012010080TemperatureErrorFactor(TM)NOTE: The Temperature Multiplier is a linear response from 0oC to -40oC and from 85oC to 125oC Pressure Error BandError Limits for Pressure3.02.01.0-1.0-2.0-3.00.020Pressure (in kPa)PressureError(kPa)20 to 115 (kPa)1.5 (kPa)40608010012
29、0PressureError (Max)0.027 TYP 8X0.690.053 TYP 8X1.35inchmm0.3879.830.1503.810.0501.27TYP名师资料总结 - - -精品资料欢迎下载 - - - - - - - - - - - - - - - - - - 名师精心整理 - - - - - - - 第 5 页，共 11 页 - - - - - - - - - MPXHZ6116ASensors6Freescale SemiconductorPreliminaryPACKAGE DIMENSIONSCASE 1317-04ISSUE FSUPER SMALL OU
30、TLINE PACKAGE名师资料总结 - - -精品资料欢迎下载 - - - - - - - - - - - - - - - - - - 名师精心整理 - - - - - - - 第 6 页，共 11 页 - - - - - - - - - MPXHZ6116ASensorsFreescale Semiconductor7PreliminaryPACKAGE DIMENSIONSCASE 1317-04ISSUE FSUPER SMALL OUTLINE PACKAGE名师资料总结 - - -精品资料欢迎下载 - - - - - - - - - - - - - - - - - - 名师精心整
31、理 - - - - - - - 第 7 页，共 11 页 - - - - - - - - - MPXHZ6116ASensors8Freescale SemiconductorPreliminaryPACKAGE DIMENSIONSCASE 1317-04ISSUE FSUPER SMALL OUTLINE PACKAGE名师资料总结 - - -精品资料欢迎下载 - - - - - - - - - - - - - - - - - - 名师精心整理 - - - - - - - 第 8 页，共 11 页 - - - - - - - - - MPXHZ6116ASensorsFreescale S
32、emiconductor9PreliminaryPACKAGE DIMENSIONSCASE 1317A-04ISSUE DPORTED SUPER SMALL OUTLINE PACKAGE名师资料总结 - - -精品资料欢迎下载 - - - - - - - - - - - - - - - - - - 名师精心整理 - - - - - - - 第 9 页，共 11 页 - - - - - - - - - MPXHZ6116ASensors10Freescale SemiconductorPreliminaryPACKAGE DIMENSIONSCASE 1317A-04ISSUE DPORT
33、ED SUPER SMALL OUTLINE PACKAGE名师资料总结 - - -精品资料欢迎下载 - - - - - - - - - - - - - - - - - - 名师精心整理 - - - - - - - 第 10 页，共 11 页 - - - - - - - - - MPXHZ6116ARev. 104/2009Information in this document is provided solely to enable system and software implementers to use Freescale Semiconductor products. There
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