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1、目視檢驗規范IPC610IPQC RUI_LI2010/1/20目視檢驗規范標准IPC6101.允收標准2.拒收標准 零件本體僅下方有二接觸點的零件Chip ponents/Bottom Only Terminations cont.偏移 Shift 允收(Target Condition)零件黏焊於錫墊中心位置,沒有任何偏移.No side overhang.允收極限(Acceptable)零件往錫墊寬邊(A)偏移,但零件 本體寬邊(C)有75%以上焊接於 錫墊上.零件本體與電路板錫墊間(G)錫 厚至少0.2 mm.Side overhang(A)is allowed if minimum
2、end joint width(C)requirements are met.Minimum is 75%.Minimum thickness(G)is 0.2 mm unless satisfactory cleaning can be demonstrated with reduced clearance.拒收(Nonconforming Defect)零件往錫墊寬邊(A)偏移,且零 件本體小於75%寬邊(C)焊接 於錫墊上.零件往錫墊長邊(B)偏移.Side overhang(A)is allowed if minimum end joint width(C)requirements a
3、re met.Minimum is 75%.Minimum thickness(G)is 0.2 mm unless satisfactory cleaning can be demonstrated with reduced clearance.零件本體有1,3,5面矩形金屬焊接點 Rectangular End ponents-1,3or5 side Termination 偏移 Shift 允收(Target Condition)零件金屬部份黏焊於錫墊中 心位置,沒有任何偏移.零件 本體錫墊完全沾錫.No side overhang.Side joint length(D)equals
4、component termination length.允收極限(Acceptable)零件往錫墊寬邊(A)偏移,但 零件本體金屬焊墊寬邊(W)75%以上焊接於電路板錫墊上.End joint width(C)is 75%width of component termination area(W)or 75%width of PB land(P),whichever is less.拒收(Nonconforming Defect)零件往錫墊寬邊(A)偏移,但零 件本體不足75%寬邊(C)以上焊 接於電路板錫墊上.零件往錫墊長邊偏移(B).Side overhang(A)causes mini
5、mum end joint width(C)requirements not to be met.End overhang(B)is not permitted.零件本體有1,3,5面矩形接觸點 Rectangular End ponents-1,3or5 side Termination 偏移 Shift 允收(Target Condition)零件黏焊於錫墊中心位置,沒有任何偏移.零件本體錫 墊完全沾錫.No side overhang.允收極限(Acceptable)零件往錫墊寬邊偏移,但零件 之焊接面佔75%以上.End joint width is 75%width of compo
6、nent termination area or 75%width of PB land,whichever is less.拒收(Nonconforming Defect)零件往錫墊長邊偏移.End overhang is not permitted.圓柱體零件 Cylindrical End Cap Termination 偏移 Shift 允收(Target Condition)零件黏焊於錫墊中心位置,沒有任何偏移.吃錫面在圓筒零件直徑(W)與板上錫墊長(P)之間.No side overhang.End joint width is equal to or greater than t
7、he component width(W)or width of the land(P),whichever is less.允收極限(Acceptable)零件往錫墊寬邊偏移(A),側 邊偏移度允收極限為零件直 徑(W)的25%或錫墊長度(P)的25%.Side overhang(A)is 25%diameter of component width (W)or land with(P).拒收(Nonconforming Defect)零件側邊偏移度(A)超出25%零 件直徑(W)或錫墊長度(P)的25%.零件往錫墊長邊偏移(B).Side overhang(A)is 25%diameter
8、 of component width(W)or land with(P).End overhang is not permitted.無導腳零件Leadless Chip Carriers with Castellated Terminations 偏移 Shift 允收(Target Condition)零件未偏移.零件延伸引腳長等於電路板 上錫墊長.零件立於電路板上錫墊中心.No side overhang.Fillet extension equals land width.Fillet height covers terminal.允收極限(Acceptable)零件偏移向錫墊寬邊之
9、間(A),偏移度小於電路板上錫墊面 (W)的25%.Maximum side overhang(A)is 25%W.拒收(Nonconforming Defect)零件偏移向錫墊寬邊之間(A),偏 移度大於電路板上錫墊面(W)的 25%.零件偏移向錫墊長邊之間 (B).Maximum side overhang(A)is 25%W.End overhang(B)is not permitted.允收(Target Condition)零件腳未偏移.No side overhang.允收極限(Acceptable)零件偏移向錫墊寬邊之間(A),偏移小於電路板上錫墊寬度 (W)的 25%或偏移小於
10、0.5mm.Side overhang(A)is 25%W or 0.5 mm.拒收(Nonconforming Defect)零件偏移向錫墊寬邊之間(A),偏移大於電路板上錫墊寬度(W)的 25%或偏移大於0.5mm.不允許任何的零件趾端偏移 如(B).Side overhang(A)is greater than 25%W or 0.5 mm whichever is less.Toe overhang(B)is not specified 平緞腳 L型/鷗翼腳/圓柱L腳Flat Ribbon L/Gull Wing leads/Round leads 偏移 Shift I 腳“I Lea
11、ds 偏移 Shift 允收(Target Condition)零件腳未偏移.No side overhang.允收極限(Acceptable)零件偏移向錫墊寬邊之間(A),偏移大於錫腳寬度(W)的25%仍不允許.不允許任何的偏移.Overhang(A)exceeds 25%lead width(W).No overhang allowed.拒收(Nonconforming Defect)不允許任何的零件趾端偏移 如(B).Toe overhang(B)is not specified.範例 Example-平緞腳 L型/鷗翼腳/圓柱L腳 Flat Ribbon L/Gull Wing lea
12、ds/Round leads允收(Target Condition)允收極限(Acceptable)拒收(Nonconforming Defect)範例 Example-平緞腳 L型/鷗翼腳/圓柱L腳 Flat Ribbon L/Gull Wing leads/Round leads拒收(Nonconforming Defect)拒收(Nonconforming Defect)拒收(Nonconforming Defect)範例 Example-J 腳/I 腳 允收極限(Acceptable)拒收(Nonconforming Defect)拒收(Nonconforming Defect)範例
13、Example 拒收 Nonconforming Defect高翹/LIFTED 範例 Example 高翹/LIFTEDOKNG範例 Example 拒收 Nonconforming Defect折腳/BENT 缺件/MISSING 偏移 /SHIFT 範例 Example 拒收 Nonconforming Defect破損/DAMAGE 範例 Example 拒收 Nonconforming Defect撞件/BROKEN 撞件/BROKEN 範例 Example 允收極限 Acceptable偏移 /SHIFT 錫洞/Solder Hole 範例 Example ASR1:LED2 反向
14、 /REVERSE 拒收 Nonconforming Defect 缺口端為負極/Nick side is“5168:SW4 反向 /REVERSE Switch數字與PCBA同向/Number on ponent same direction with PCBA.範例 Example 折腳 /PIN BENT 包焊 /Poor Solder拒收 Nonconforming Defect範例 Example 拒收 Nonconforming DefectNG OK 退PIN Travis M/B DIP ponent cosmetic 1,整体高翘，且最大不可以超过0.3mm2.后邊、前邊緣高
15、翹不可超過0.2mm 整體高翹單邊高翹Travis M/B DIP ponent cosmetic 1.1.水平高翘，最大允许限度为水平高翘，最大允许限度为0.3mm.0.3mm.2.2.不允许不允许單單边高翘。边高翘。Travis base sampleRAM RAM 的卡勾不可出现变形等不良。的卡勾不可出现变形等不良。Travis M/B DIP ponent cosmetic 不能出现任何标记,特别是有铅异物。不能出现任何标记,特别是有铅异物。Travis M/B DIP ponent cosmetic JUSB 不可出现气泡和明不可出现气泡和明显擦痕显擦痕.Travis base sa
16、mpleMicrophone 不能失掉海绵，禁止使用双面胶黏贴脱落海绵。Travis M/B solder hole JDOCK 不允許單邊高翹 Travis base sample1.Function Pin 吃锡量不应少于75%.2.固定pin锡量不应少于50%.以固定住零件为标准3.折脚 1:如果pin 折脚但是有露出，function 測試pass 可以判断为良品。2 如果pin脚完全没有露出，则要判断为不良。固定固定pinFunction pin Travis base samplepin 脚不可刺穿该处Mylar Travis base sampleSmart card socket Smart card socket 不可出现大幅度凹陷变形。不可出现大幅度凹陷变形。Travis base sampleJSIO,JCRT 等零件不可出现沾锡等不良,PBATT late solder can be accept。THE END