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1、4.6.2 Heat sink-Contact 散热片接触片 arget-Class 1,2,3 目标等级 1,2,3 Component and heatsink are in full contact with the mounting surface.组件和散热片与安装表面完全接触 Hardware meets specified attachment requirements.部件满足规定的接触要求。Figure 图 4-64 1.Heat sink 散热片 Acceptable-Class 1,2,3 可接受的 等级 1,2,3 Component not flush.组件不平齐 M
2、inimum 75%contact with mounting surface.至少有 75%与安装表面接触 Hardware meets mounting torque requirements if specified.如果有规定，部件满足安装的转距要求 Figure 图 4-65 1.Gap 2.Heat sink 间隙 散热片 Defect-Class 1,2,3 缺点等级 1,2,3 Component is not in contact with mounting surface.组件没有接触到安装表面 Hardware is loose and can be moved.部件松弛
3、可以移动。Figure 图 4-66 1.Heat sink 2.Gap 散热片 间隙 5.1 Orientation 方向 5.1.1 Orientation-Horizontal 方向水平 Target-Class 1,2,3 目标等级 1，2，3 Components are centered between their lands.组件位于焊盘中央 Component markings are discernible.组件标识清晰可见 Nonpolarized components are oriented so that markings all read the same way(
4、left-to-right or top-to-bottom).Figure 图 5-1 无极性组件的方向应使其标识都能按同样方式进行辨识（从左到右或从上到下）Acceptable-Class 1,2,3 可接受的等级 1，2，3 Polarized and multilead components are oriented correctly.有极性和多引脚的组件应按正确方向安装。When hand formed and hand-inserted,polarization symbols are discernible.当手工成型及手插件时，极性符号可以辨识。All components
5、are as specified and terminate to Figure 图 5-2 correct lands.所有组件都符合规定并连接到正确的焊盘上。Nonpolarized components do not need to be oriented so that markings all read the same way(left-to right or top to-bottom).无极性的组件不需要按同样的方向，只要标识可按相同方向辨识即可（从左到右或从上到下）.5.1.1 Orientation-Horizontal(cont.)方向水平（续）Defect-Class
6、1,2,3 缺点等级 1，2，3 Component is not as specified(Wrong part).组件不符合规定（组件错误）Component not mounted in correct holes.组件没有安装在正确的孔中。Polarized component mounted backwards.有极性组件安装方向相反。Multileaded component not oriented correctly.Figure 图 5-3 多引脚组件的安装方向不正确。5.1.2 Orientation-Vertical 方向垂直 Target-Class 1,2,3 目标等
7、级 1，2，3 Nonpolarized component markings read from the top down.无极性组件的标识可以从上至下辨识 Polarized markings are located on top.极性标识位于顶部.Figure 图 5-4 Acceptable-Class 1,2,3 可接受的等级 1，2，3 Polarized part is mounted with a long ground lead.极性组件安装时有长的接地引脚 Polarized marking hidden.极性标识被隐藏起来 Nonpolarized component m
8、arkings read from bottom to top.无极性组件标识可以从底至上辨识。Figure 图 5-5 Defect-Class 1,2,3 缺点等级 1，2，3 Polarized component is mounted backwards.极性组件安装反向。Figure 图 5-6 5.2 Mounting 安装 5.2.1 Mounting-Horizontal-Axial Leaded-Supported Holes 安装水平轴向引脚有支撑孔 Target-Class 1,2,3 目标等级 1，2，3 The entire body length of the co
9、mponent is in contact with the board surface.整个组件本体长度与线路板表面完全接触 Components required to be mounted off the board are,at least 1.5mm0.059 infrom the board surface;e.g.,high heat dissipating.需要离开线路板表面安装的组件至少要离开线路板 Figure 图 5-7 平面 1.5mm（0.059 in），如高散热器件.Figure 图 5-8 5.2.1 Mounting-Horizontal-Axial Leade
10、d-Supported Holes(cont.)安装水平轴对称引脚有支撑孔 Acceptable-Class 1,2 可接受的等级 1，2，3 The maximum space between the component and the board surface does not violate the requirements for lead protrusion(see 5.2.7)or component height(H).Figure 图 5-9 (H)is a user-determined dimension.)组件与线路板平面之间的最大间距不应违反引脚突出（见 5.2.7
11、）或组件高度（H）的要求。（高度（H）是由使用者决定的尺寸）Process Indicator-Class 3 程序指示等级 3 The farthest distance between the component body and the board(D)is larger than 0.7mm0.028 in.组件本体与线路板之间的最大的距离（D）超过 0.7mm（0.028 in）。Defect-Class 1,2,3 缺点等级 1，2，3 Components required to be mounted above the board surface are less than 1
12、.5mm0.059 in 要求离开线路板表面安装的组件与线路板的距离小于 1.5mm（0.059 in）.5.2.2 Mounting-Horizontal-Axial Leaded-Unsupported Holes 安装水平轴向引脚无支撑的孔 Target-Class 1,2,3 目标等级 1.2.3 The entire body length of the component is in contact with the board surface.整个组件本体长度与线路板表面完全接触.Components required to be mounted off the board ar
13、e at minimum 1.5mm0.059 in from the board Figure 图 5-10 surface;e.g.,high heat dissipating.1.No Plating in barrel 需要离开线路板表面安装的组件至少要离开线路板平 孔壁上没有电镀 面 1.5mm（0.059 in），如高散热器件.Components required to be mounted off the board are provided with lead forms at the board surface or other mechanical support to
14、prevent lifting of solder land.需要离开线路板安装的组件在线路板表面利用引脚形状或其它机械支撑来防止焊盘的翘起。Figure 图 5-11 Figure 图 5-12 1.Lead forms 引脚形状 Defect-Class 1,2,3 缺点等级 1，2，3 Components required to be mounted off the board are not provided with lead forms at the board surface or other mechanical support to prevent lifting of s
15、older land.Figure 图 5-13 需要离开面板安装的组件在线路板表面未利用引脚的形状或其它机械支撑来防止焊盘翘起 surface Components required to be mounted above the board are less than 1.5mm0.059 in.要求离开线路板表面安装的组件与线路板的距离小于 1.5mm（0.059 in）Figure 图 5-14 5.2.3 Mounting-Horizontal-Radial Leaded 安装水平径向引脚 Target-Class 1,2,3 目标等级 1，2，3 The component bod
16、y is in flat contact with the boards surface.组件本体与线路板表面平贴接触 Bonding material is present,if required.See4.4.若需要，则可存在粘贴的物质，见 4.4 Figure 图 5-15 Acceptable-Class 1,2,3 可接受的等级 1，2，3 Component in contact with board on at least one side and/or surface.组件与线路板至少有一边和/或面接触。Note:When documented on an approved a
17、ssembly drawing,a component may be either side mounted or end mounted.The side or surface of the body,or at least one point of any irregularly configured component(such as certain pocketbook capacitors),needs Figure 图 5-16 to be in full contact with the printed board.The body should to be bonded or
18、otherwise retained to the board to prevent damage when vibration and shock forces are applied.注意：在被认可的组装图中，一个组件既可能是面安装也可能是边沿安装。组件体的表面或侧面，或不规则形状组件的至少一点（如某种袖珍电容），需要与印刷线路板完全接触。组件本体应粘贴或保持在线路板上以防止在震动或撞击时损坏。Defect-Class 1,2,3 缺点等级 1，2，3 Unbonded component body not in contact with mounting surface.未粘贴的组件本体
19、没有和安装表面接触。Bonding material not present if required.在有要求时，却没有粘贴物质。Figure 图 5-17.2.4 Mounting-Vertical-Axial Leaded-Supported Holes 安装垂直轴向引脚有支撑的孔 Target-Class 1,2,3 目标等级 1，2，3 The height of the component body above the land,(H)is 0.4mm0.016 into1.5mm 0.059 in.组件本体距离焊盘的高度，（H）为 0.4mm（0.016in）到 1.5m（0.05
20、9in）之间。The component body is perpendicular to the board.组件本体与线路板垂直 Figure 图 5-18 The overall height does not exceed the height specified.总的高度未超过规定的高度.Acceptable-Class 1,2,3 可接受的等级 1，2，3 The component height above the board,(H)is not outside the range given in Table 5-1.组件距离线路板的高度(H)未超出表 5-1 给出的范围。Th
21、e angle()of the component lead does not cause a violation of minimum electrical clearance.组件引脚的角度未产生对最小电气间隙的影响。Figure 图 5-19 Table 5-1 Component to Board Height 表 5-1 组件到线路板的高度 Class1 等级 1 Class2 等级 2 Class3 等级 3 H(min)最小值 0.1mm0.0039in 0.4mm0.016in 0.4mm0.016in H(max)最大值 6mm0.24in 3mm0.12in 1.5mm0.
22、059in 5.2.4 Mounting-Vertical-Axial Leaded-Supported Holes(cont.)安装垂直轴向引脚有支撑孔（续）Acceptable-Class 1 可接受的等级 1 Process Indicator-Class 2,3 过程指示等级 2，3 The component mounting height(H)is greater than the maximum given in Table 5-1.组件安装高度（H）超过了表 5-1 中给出的最大值。Figure 图 5-20 Defect-Class 1,2,3 缺点等级 1，2，3 Components violate minimum electrical clearance.组件影响到最小电气间隙。以上仅为整个国际检验规范中的一小部份，整套内容大约为 4 张光盘，包括了整个电子产业上的国际检验标准。经过几个月的奋战，终于把一本从国外带回来的英文本翻译成中英文版。是从事电子研发、制造、检验等部门不可缺少的工具资料！如果你有这方面的需求，请您与我联系：