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1、?http:/http:/1PCB?PCB?PCB?.2?PCB?.41.?50?.42?PCB.53?(SMT)?.74PCB?.85PCB?.86?.97.PCB?.9?DFM.121DFM?.122?.13?http:/http:/2?PCB?PCB?1.Test Coupon:?test coupon?TDR(Time Domain Reflectometer)?PCB?test coupon?(?)?(ground lead)?TDR?(probe)?(probe tip)?test coupon?2.?Edge-Conncetion?(Gold Finger)?(Connector
2、)?140 Knoop?30u in?(Substrate)?COBchip on board?wire bond?100Knoop?3.?,?:Hard Gold;?soft Gold?IC?4.SMT?Additive Process(?)?PCB?(?)?Angle of attack(?)?Anisotropic adhesive(?)?Z?Application specific integrated circuit(ASIC?)?Artwork(?)PCB?3:1?4:1?Automated test equipment(ATE?)?Blind via(?)PCB?Buried v
3、ia(?)PCB?(?)?Bonding agent(?)?http:/http:/3?Bridge(?)?Circuit tester(?)?PCB?Cladding(?)?PCB?CTE-Coefficient of the thermal expansion(?)?(ppm)?Cold cleaning(?)?Component density(?)PCB?Conductive epoxy(?)?Copper foil(?)?PCB?Copper mirror test(?)?Defect(?)?Delamination(?)?Desoldering(?)?(?)?DFM(?)?Envi
4、ronmental test(?)?Functional test(?)?Fiducial(?)?Fine-pitch technology(FPT?)?0.025(0.635mm)?Fixture(?)?PCB?Lead configuration(?)?Machine vision(?)?Mean time between failure(MTBF?)?Photo-plotter(?)?PCB?(?)?Pick-and-place(?-?)?PCB?Placement equipment(?)?PCB?SMD?X/Y?Reflow soldering(?)?/?Schematic(?)?S
5、older bump(?)?Soldermask(?)?http:/http:/4?Type I,II,III assembly(?)?PCB(I)?SMD?(II)?SMD?(?)?(III)?Ultra-fine-pitch(?)?0.010(0.25mm)?Void(?)?Yield(?)?5Keying Slot?6.Mounting Hole?Insertion Hole,Lead Hole7.Laminate:?CCLCopper per Claded Laminates8.Prepreg?9.Silk Screen?10.Screen Printing?11.Screen abi
6、lity?12.Solder Bump?13.Substractive Process?14.Surface-Mount Device(SMD)?SMD15.Surface Mount Technology?SMT16.Thin Core?17.Through Hole Mounting?18.Twist?PCB?1.?50?PCB?1.?50?PCB?50?6?1PWB?1936?http:/http:/5?1936?2PWB?1950?PP?PWB?PWB?PP?PWB3PWB?1960?GE?PWB?GE?PWB?GE?1965?GE?GE?PP?4PWB?1970MLB?PWB?4?6
7、810204050?0.5mm?0.350.20.1mm?PWB?PWB?TMT?SMT?PWB?20?SMT?PWB?5MLB?1980?1982?1991?10?PWB?3?1982?3615?1991?10940?MLB?1986?1468?1989?2784?MLB?1980?PCB?62?MLBMLB?6?21?1990?MLB?1991?PWB?1994?MLB?1998?MLB?IC?BGA?CSP?50?PWB?1947?ICISIVLSI?MCMBGACSP?IC21?21?2 2?PCB?PCBPCB?(Printed Circuit Board)?PCB?PCB?http
8、:/http:/6?PCB?100?PCB?UV?UV?/?:?B?/?PCB?http:/http:/7?1?2?3?4?MCM?MCM?(Multi Chip Module?)?MCM?MCM?MCM?MCM?MCM-D?Mulit Chip ModuleDeposited Thin Film?500Mhz?10-25?1050?PCB?3 3?(SMT)?(SMT)?1)SMT?1/10?SMT?40%60%?60%80%?http:/http:/8?30%50%?2)?(SMT)?(IC)?IC?(IC)?3)SMT?/?Surface MountTechnology?SMT?SMT?
9、SMT?SMT?SMT?CIMS?SMT?SMT?SMT?FMS?SMT?4 4PCB?PCB?2.44?5 5PCB?PCB?MILSTD275?0.001?http:/http:/96 6?7.7.PCB?PCB?(HASL,hot air solder leveling)?(OEM,original equipment manufacturer)?OEM?HASL?(PWB,printed wiring board)?(?)?OSP?20 30%?HASL?ENIGOSP?HASL?PWB?HASL?OSP?organometallic)(?)?(ENIG)?OSP?OSP?PWB?1?
10、OSP?http:/http:/10?PWB?ENIG?ENIG?PWB?OSP?PWB?HASL?OSP?2,3?OSP?/?(intrusive reflow)?(selective solder fountain)?(compliant pin)?(through-hole)?(paste-in-hole)?PWB?HASL?(compliant pin)?HASL?4?OEM?OSP?OSP?PWB?PWB?PWB?HASL?(key contact)?(component shielding)?(edge connector)?PWB?(wire bonding)?PWB?(HDI,
11、high-density interconnect)?ENIG?(field failure)?http:/http:/11?OSP?PWB?wire bonding)?/?OSP?(?)?(gold?OSP?PWB?OSP?OSP?(?)?OSP?ENIG?OSP?(area array package)?OSP?ENIG?5,6?300,000?0.020?10oz?100%?#1?#2?#3?OSPBTH?10370KG20.5001.250.500OSP?10370KKY0.5000.5000.500?BTH?10370KGM0.0250.0250.025?10370KHW0.0250
12、.0250.025?BTH?10370K9Z0.0250.0250.025?10370K8Y0.0250.0250.025?/?0.0250.0250.025?http:/http:/12Sn63/Pb37?0.0250.0250.025?PWB?(whisker)?(30 50 millionths?)?(ICT,in-circuit test)?ICT?OSP?PWB?OSP?(chip-scale)?(flip chip)?/?(TAB,tape automated bonding)?(wire bondable)?ICT?OSP?HASL?HASL?DFM?DFMDFM(Design
13、For Manufacture)?DFM?DFM?1 1DFM?DFM?DFM?DFM?DFM?DFM?DFM?DFM?DFM?DFM?DFM?DFM?DFM?http:/http:/13?(?)?DFM?DFM?DFM?(?)?DFM?DFM?2 2?DFM?DFM?DFM?:?:?DFM?PCB DFM?/?(?)?DFM?:?:?:?:?DFM?(dpm,defects per million)?DFM PCB?DFM PCB?(?)?PCB X?DFM?http:/http:/14?DFM?PCB?66%?DFM?DFM?10%?DFMPCB?*Standards PCB X befo
14、re DFM PCB X after DFM ProcessdpmS/U RunVariableS/URunQuantityS/URunQuantityStencil Print(T)2050.5(PCB)50.5150.51Chip Place 100100.012(SMT)100.0484100.31226IC Place 200150.025(SMT)000000Reflow255-Internal50.3150.31Stencil Print(B)2050.5(PCB)000000Chip Place 100100.012(SMT)000000IC Place 200150.025(S
15、MT)000000Reflow255-Internal000000Clean1050.3(PCB)000000DIP5000150.1(Comp)000000Sequence1500200.02(Comp)200.2613000VCD1500150.03(Comp)150.3913000Radial5000300.04(Comp)000000Stake6000100.14(Comp)000000Mask2500100.05(Point)100.153000AdhesiveDispense505-Internal50505050Chip Place 100100.12(SMT)100.65010
16、0.650IC Place 200150.025(SMT)000000Cure255-Internal501501Clean1050.3(PCB)000000Prep5000150.1(Comp)150.77000?http:/http:/15Prewave7500100.2(Comp)10210100.84WaveSolder/Clean200050.7(PCB)50.7150.71Postwave Difficult 15000103(Comp)1093000Postwave Easy 10000101(Comp)000000Clean50050.3(PCB)50.31000Depanel
17、500051.5(PCB)56451.51Conformal Coat 100002010(PCB)2010120101Inspection50050.007(SolderJoint)51.1216051.12160Enter Lot Size 5050Enter Realization 0.550.8 I.E.Minutes 16532.068 9015.832 Prorated Setup 3.3 1.8 Total I.E.Min.35.368 17.632 Total I.E.Hours 0.589 0.294 Expected Cycle Time 1.072 0.367 Expec
18、ted Cost$32.15$11.02 Expected Yield 89.40%98.70%*All numbers are fictitious and are intended for instructioal purposes only.?.DFM?:?:?PCB?18?DFM?1?0?(1=?0=?)?(?1?2?)?1?0?(1=?0=?)?(?18)?(?)?DFM?http:/http:/16Design for Manufacturability Scoring Project:X Board#:Y ComponentsSpecsProto 1 Proto 2Manufac
19、turing Model Production95%PPSL compliance 11111Process compatible packaging 10111Component count-single pass 1111090%111111%post wave process 10001Process steps 10 10001No fixtures/tools required 111116 sigma yield possible 10011DFM Score 18%33%50%72%89%93-100%World Class?http:/http:/1785-92%Highly
20、Manufacturable 77-84%Acceptable69-76%Poor0-68%Unacceptable?:?:?DFM?X?Y?(?)?10?10?75?50?10?100?100?DFM?DFM?DFM?DFM?DFM?DFMM?DFM?20?DFM?CAE?DFM?DFM?DFM?IPC?Association Connecting Electronics Industries,(846)509-9700.Surface Mount Equipment Manufacturers Association(SMEMA),(847)831-1002.Electronic Indu
21、stries Alliance(EIA),(703)907-7500.SMC-WP-004 Design For Excellence?http:/http:/18IPC-T-50 Terms and Definitions for Interconnecting and Packaging Electronic Circuits IPC-D-275 Design Standard for Rigid Printed Boards and Rigid Printed Board Assemblies IPC-D-279 Design Guidelines for Reliable Surfac
22、e Mount Technology Printed Board Assemblies IPC-D-322 Guidelines for Selecting Printed Wiring Board Sizes Using Standard Panel Sizes IPC-D-325 Documentation Requirements for Printed Boards,Assemblies,and Support Drawings IPC-D-330 Design Guide Manual IPC-D-390 Automated Design Guidelines IPC-C-406 D
23、esign and Application Guidelines for Surface Mount Connectors IPC-SM-782 Surface Mount Design and Land Pattern Standard IPC-EM-782 Surface Mount Design and Land Pattern Standard Spreadsheet EIA-JEP-95 JEDEC Registered and Standard Outlines for Semiconductor Devices SMEMA 3.1 Fiducial Design Standard?PCB?http:/http:/19_?2001?2001?http:/