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1、APPLICATIONS Cell Phone Handsets and Accessories Microprocessor based equipment Personal Digital Assistants(PDAs)Notebooks,Desktops,and Servers Portable Instrumentation Peripherals PagersIEC COMPATIBILITY IEC61000-4-2(ESD)15kV(air),8kV(contact)IEC61000-4-4(EFT)40A(5/50s)IEC61000-4-5(Lightning)21A(8/
2、20s)BIDIRECTIONAL TVS DIODE ARRAYSOD-323FEATURES 320 Watts Peak Pulse Power per Line(tp=8/20s)Protects one I/O or power line Low clamping voltage Working voltages:3V,5V,12V,15V,18V,24V and 36V Low leakage currentMECHANICAL CHARACTERISTICS JEDEC SOD-323 Package Molding Compound Flammability Rating:UL
3、 94V-O Weight 5 Millgrams(Approximate)Quantity Per Reel:3,000pcs Reel Size:7 inch Lead Finish:Lead FreePIN CONFIGURATION ESD/TESD*Series 01|spsemi REV.2014.05.01(V)(V)1A(A)(pF)(max.)(min.)(mA)(max.)(max.)(A)(max.)(max.)2J15 16.712440 1113.32A341035127517.562001119TJVCIR1710100 Storage Temperature Ra
4、ngeTSTG-55 150MAXIMUM RATINGS(25 Unless Otherwise Specified)Lead Soldering TemperatureOperating Temperature RangeWattsPARAMETERSYMBOLVALUEPeak Pulse Power(tp=8/20s waveform)UNITSVCITTL260(10 sec.)DEVICE CHARACTERISTICSVBPART NUMBERDEVICEMARKINGVRWM320PPPELECTRICAL CHARACTERISTICS PER LINE(25 Unless
5、Otherwise Specified)CT-55 150 2B5 9.81845010.52040 2D12459 1 57 29 2K18 20.01 2H24 1 5026.714052740 2N36 401657551 ESD/TESD*Series 02|spsemi TESD03FB TESD05FB TESD12FB TESD15FB TESD18FB TESD24FB TESD36FB REV.2014.05.01*SOLDERING FOOTPRINTSOD-323 PACKAGE OUTLINE&DIMENSIONS *SOLDERING FOOTPRINT ESD/TESD*Series 03|spsemi REV.2014.05.01