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1、Global CSGlobal CS JJ.KIM2008. 11. 042008. 11. 04 Global CS Global CS 1Global CSGlobal CS JJ.KIM 1.1. EOS/ESD EOS/ESD 2.2. . EOS . EOS / / 3.3. . ESD . ESD / / 2. 2. . . . . ESD ESD . MSL . MSL . ESD . ESD Mechanism Mechanism3. 3. . . . . . EOS/ESD . EOS/ESD . . 2Global CSGlobal CS JJ.KIM (Absolute
2、Maximum Rating) Over Stress : Electrical Over-Stress : Electrical Over-Stress Burnt Burnt Wire Open Wire Open (Decap. , pattern )3Global CSGlobal CS JJ.KIMEOS EOS . Spec. limit . Spec. limit . Impulsive Surge. Impulsive Surge AC DC Switching/Noise , pulse . AC leak. AC leak AC Ground Floating Chassi
3、s AC . Swell/Sag Voltage. Swell/Sag Voltage DC Switching Over (swell)/ Under (sag) voltage. . Latch-up. Latch-up . 4Global CSGlobal CS JJ.KIM : : discharge discharge ESD ESD (HBM, CDM) (HBM, CDM)HOT SPOTHOT SPOT5Global CSGlobal CS JJ.KIMESD ESD . . . . (induction) (induction)ESD ESD . EMI Pulse (Wid
4、e-band Electromagnetic Interference Pulse). EMI Pulse (Wide-band Electromagnetic Interference Pulse) Spark . . (Thermal Breakdown) (Thermal Breakdown) (Hot Spot) HBM, MM . . (Dielectric Breakdown) (Dielectric Breakdown) MOS Gate CDM, HBM . . (Metallization Melt) (Metallization Melt) Bond wire 6Globa
5、l CSGlobal CS JJ.KIM . ( + ) ( - ) , . , . . ESD (Electro-Static Discharge) . + - 7Global CSGlobal CS JJ.KIM . . : 2 , +, - . : . : . : . : , . : , +,- . . . , , .8Global CSGlobal CS JJ.KIM . (+) (-) 1 . ( ) Class Class ( ( ESD ESD , HBM) , HBM) (-)(-)(+)(+) PVC,DEVICE TYPEDEVICE TYPE DEVICE TYPEDEV
6、ICE TYPE V MOS30 V-C MOS250 V-MOS FET100 V-SCHOTTKY DIODES300 V-GA, AS FET100 V-FILM RESISTORS300 V-EP ROM100 V-BIPOLAR 380 V-J FET140 V-ECL(P.C.B LEVEL)500 V-SAW150 V-SCR680 V-OP - AMP190 V-PASSPASSFailFail CLASS 0-250 VCLASS 1A250 V500 VCLASS 1B500 V1 KVCLASS 1C1 KV2 KVCLASS 22 KV4 KVCLASS 3A4 KV8
7、 KVCLASS 3B8 KV-9Global CSGlobal CS JJ.KIM 3KV , 100V IC . 1.0 . () 90 -150 .2.0 .2.5 .3.0 . . 4.0 .5.0 .6.0 .7.0, 8.0 .9.0 .10.0 .11.0 12.0 .10Global CSGlobal CS JJ.KIM () , . 50% . , . . . 5, 65% 20 24%, . (10 - 20%) (65 - 90%) 35000 V12000 V6000 V7000 V20000 V18000 V1500 V250 V100 V600 V1200 V150
8、0 V11Global CSGlobal CS JJ.KIM( () ) . MSL : LEVEL (Moisture-Sensitive devices Level) . : 1 . BAKING MSL MSL , , BakingBaking BakingBaking 12Global CSGlobal CS JJ.KIMMSL MSL Baking Baking ( () ) LevelLevel30 / 30 / 60% RH 60% RH Bag Bag 1130 / 85% RH 2212a2a433168168 (7 (7) ) 447272 (3 (3) )554848 (
9、2 (2) )5a5a2424 (1 (1) )Package Package LevelLevel125125 BakeBakeTray Tray 4040 BakeBakeReel Reel 1.4mm 2a2a4533711449135510145a5a14192.0mm 2a2a18213324334431435537525a5a4868MSL LEVELMSL LEVELBAKING BAKING 13Global CSGlobal CS JJ.KIMESD ESD Mechanism Mechanism . HBM (Human Body Model). HBM (Human Bo
10、dy Model) V KW . CDM (Charged Device Model). CDM (Charged Device Model) , , . 14Global CSGlobal CS JJ.KIMESD ESD Mechanism Mechanism . FIM (Field Induced Model). FIM (Field Induced Model) , IC IC IC Data . Q E = Q / 4。rV/m Q , . . MM (Machine Model). MM (Machine Model) Ex) IC Mount IC .15Global CSGl
11、obal CS JJ.KIM (ESD (ESD ) ) : Condenser Charge : Condenser Charge HBMMMCDMESD Association StandardESD STM 5.1Ds. 5.2Ds. 5.3MIL StandardMIL-STD-883D-EIAJ StandardA114-BA115-A-JEDEC StandardA114-BA115-AC101-A16Global CSGlobal CS JJ.KIMGround (Ground () ) , : 2 1 , 102 150 / I3 100 3 1017Global CSGlob
12、al CS JJ.KIM 18Global CSGlobal CS JJ.KIM / /GlassGlass/ /1) Class 13 2) , 3) Lay Out 4) Check List ,Level Check, Main 19Global CSGlobal CS JJ.KIM Point PointCHIPTESTA/S ()MATFLOORMAT() / / SHIELDBAG ANTI-STATIC 20Global CSGlobal CS JJ.KIMEOS/ESD EOS/ESD . AC Leak ( ) 1. Tester (DVM) AC .2. , . .3. :
13、 AC 5V 4. : 1/ 5. : PBA() , , JIG, , 21Global CSGlobal CS JJ.KIMEOS/ESD EOS/ESD . Earth-Ring 1. .2. , .3. : ()/()4. : 1/ 5. : Earth-Ring DVM 1. Tester (DVM) .2. () . 3. () .3. : 1.0 10%4. : 1/ 5. : 22Global CSGlobal CS JJ.KIMEOS/ESD EOS/ESD . 1. ON. (Shied )2. Zero Setting , Point 3. : 100V 4. : 1/
14、5. : IC, , , /6. (ex. ) (1) (2)1. ON , Zero Setting .2. Shied , 20cm 3. : 20V 4. : 1/ 5. : 6. : Filter Clean 23Global CSGlobal CS JJ.KIMEOS/ESD EOS/ESD . 1. Mat Tile Point .2. 3 , .3. : 106 109 /4. : 1/, ( Mat, Tile)24Global CSGlobal CS JJ.KIMEOS/ESD EOS/ESD . 1. ON .2. Out/GND Ground .3. .4. , M 5.
15、 : 5V 6. : 1/ 25Global CSGlobal CS JJ.KIMEOS/ESD EOS/ESD . 1. Tester (DVM) .2. () GND . 3. () .3. : 10 / AC 5V 4. : 1/ 5. : ON , 5 1. ON .2. 5 .3. , 4. . (3 10S )5. .6. : 350 10 ()7. : 1/ 26Global CSGlobal CS JJ.KIMEOS/ESD EOS/ESD . GND 1. Tester (DVM) .2. () GND . 3. () GND .4. .GND ( ). : 2 . : 1/
16、 27Global CSGlobal CS JJ.KIMEOS/ESD EOS/ESD . 1., Check Sheet .2. : 2/3. : 4. 28Global CSGlobal CS JJ.KIMEOS/ESD EOS/ESD . Earth 29Global CSGlobal CS JJ.KIMEOS/ESD EOS/ESD . / /PBA / Tray Tile30Global CSGlobal CS JJ.KIMEOS/ESD EOS/ESD . Check Sheet31Global CSGlobal CS JJ.KIMEOS/ESD EOS/ESD . SET (H/
17、W ) . ESD Tape SETGND PCB Slide FPCB Connector Slide FPCB Connector Ground Ground (MSM, Memory)(MSM, Memory) FPCB FPCB Tape Tape : Tape SET 15KV KeyTape - 32Global CSGlobal CS JJ.KIMEOS/ESD EOS/ESD . EMI . SET ESD Test key EMI - JIG WALLJIG WALL , EMI , EMI , , ( (粘着粘着 ) ) 1 () 2 () 33Global CSGlobal CS JJ.KIM演讲完毕，谢谢观看！