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1、1Design.Build.Ship.Service.锡膏印刷培训锡膏印刷培训Document Title:Lean Hand BookDocument No :GBE-KPO-2-033-00Doc.Revision:02Document Date:March 26,2008Business Excellence22023/3/102TechnologyScreen printer/丝网印刷机丝网印刷机Solder Paste Printing丝网印刷丝网印刷丝印机Chip贴片机多功能贴片机多功能贴片机Chip贴片机回流炉32023/3/103TechnologyDescribing the
2、 Stencil Printing Process丝网印刷工艺概述丝网印刷工艺概述42023/3/104Technology15mm min Dia.Paste/最小直径最小直径15mm的锡膏体的锡膏体Zero Print Gap零印刷间隙Metal sheet/金属平板金属平板Open aperture/开孔开孔Basic Stencil Printing Process/Basic Stencil Printing Process/基本丝网印刷工艺基本丝网印刷工艺基本丝网印刷工艺基本丝网印刷工艺52023/3/105TechnologyControlled Print Speed控制印刷速
3、度Even Squeegee Pressure以及刮刀压力Basic Stencil Printing Process,Basic Stencil Printing Process,cont.cont./基本丝网印刷工艺基本丝网印刷工艺基本丝网印刷工艺基本丝网印刷工艺（续）（续）（续）（续）Paste Rolling锡膏滚动62023/3/106TechnologyBoard is lowered under controlled Separation Speed在“分离速度”控制下，板被分离下来Basic Stencil Printing Process,Basic Stencil Prin
4、ting Process,cont.cont./基本丝网印刷工艺基本丝网印刷工艺基本丝网印刷工艺基本丝网印刷工艺（续）（续）（续）（续）710-Mar-237TechnologySTENCIL钢网钢网810-Mar-238TechnologyEffect of stencil丝网的影响效果丝网的影响效果vWith a good stencil优良的丝网Excellent results极好的结果Few failures很少的故障Predictable yields可预知的合格率vWith a bad stencil不良的丝网Lots of stencil wiping需要大量的擦拭Lots o
5、f bridges and insufficient disposition产生许多的桥连和少锡Stencil Design Guideline:IPC 7525丝网设计指导文件：IPC7525910-Mar-239TechnologyStencils Considerations 丝网的关键因素丝网的关键因素Stencil Thickness丝网的厚度Stencil Material丝网的材质Stepped or uniformed thickness stencil阶梯式的或者同一厚度的丝网Stencil Material Coefficient of Friction丝网材质的摩擦系数S
6、tencil Surface Roughness丝网的表面粗糙度Stencil Hardness/Tensile Strength丝网的硬度、抗拉强度Framing Tension边框的张力Mounting Material原料的装配Partial or Full部分的和全部的Aperture Size孔径尺寸Aperture Shape&Wall开口外形和内侧的形状Aperture Arrangement开口排列Aperture Aspect Ratio开口的纵横比例Area Ratio面积比Aperture Tolerance开口大小的公差Aperture Gasketing开口的涂层Ap
7、erture Location Tolerance开口的位置公差Thickness Tolerance厚度公差1010-Mar-2310TechnologyStencil Type丝网的类型丝网的类型1.Full Stencil全平面丝网2.Partial Stencil(stencil with mesh border)局部的丝网Polyester mesh(tension 22-30 Newtons per square cm)聚酯型网孔（表面张力在22-30N/cm2之间)Stainless steel mesh(tension 30-40 Newton per square cm)不锈
8、钢网孔（表面张力在30-40N/cm2之间）1.Frameless stencil 无框的丝网MicroMount from DEKDEK公司的微小贴装丝网TECFOIL from TECFOILTECFOIL公司的TECFOIL技术SMart frame from SMTSMT小巧的外框1110-Mar-2311TechnologyStencil Fabrication Methods 丝网的制作方法丝网的制作方法1.Chemical etch化学腐蚀Single side etch单个侧面腐蚀Dual side etch双行侧面腐蚀Etch and electro-polish蚀刻和电抛光
9、2.Laser cut激光切割Straight laser 直接光刻Laser and polish 光刻并抛光3.Electroform 电铸成型 Stencils are manufactured by three main methods:制造丝网的主要三种方法制造丝网的主要三种方法1210-Mar-2312TechnologyWall characteristicChemical Etch 化学腐蚀孔内壁的特性化学腐蚀孔内壁的特性1310-Mar-2313TechnologyCleaning of stencilWhenever printing is completed,Clean
10、the stencil with low lint paper soaked in IPA.任何时候,只要印刷结束，就要用浸有IPA的无尘纸擦净丝网Use brush to clear paste in stencil aperture if necessary.如果需要，用刷子清理丝网开孔1410-Mar-2314TechnologyStencil Handling丝网的使用丝网的使用Handle the stencil with extreme care.Any dents,crack or damages will result in poor print quality.移动丝网时，要
11、万分小心任何破边，破碎，或损坏都将导致糟糕的印刷质量Always hold the stencil by the aluminum frame and do not drop any object on the stencil or foil.保持丝网在铝框中永远处于绷紧状态，并且严禁把东西放在丝网上Do not set stencil down on surface that will damage the foil surface.不要把丝网底部平放其它物体上，那样会损坏金属的表面152023/3/1015TechnologyThe Perfect Print/完美的印刷完美的印刷Clea
12、n edges/清洁的边缘Flat on top/顶部平坦Height=Stencil Thickness 高度=钢网厚度Good Alignment/很好地对位No Flux Bleed.无助焊剂溢出162023/3/1016TechnologyPaste Print Defect:Bridging/锡膏印刷缺陷：桥联锡膏印刷缺陷：桥联172023/3/1017TechnologyPaste Print Defect:Excess Print Height/锡膏印刷缺陷：高度偏高锡膏印刷缺陷：高度偏高182023/3/1018TechnologyPaste Print Defect:Scoo
13、ping/锡膏印刷缺陷：塌陷锡膏印刷缺陷：塌陷192023/3/1019TechnologyIncomplete Print/不完全印刷（少锡）不完全印刷（少锡）202023/3/1020TechnologyPaste Print Defect:Misalignment/锡膏印刷缺陷：偏位锡膏印刷缺陷：偏位212023/3/1021TechnologyTailing/锡膏拉尖Acceptable/可接受(Solder smear or slump 10%)锡量减少10%)锡量减少10%Solder Paste Print Quality/Solder Paste Print Quality/锡
14、膏印刷质量锡膏印刷质量锡膏印刷质量锡膏印刷质量222023/3/1022TechnologyPaste Clogging锡膏堵塞Acceptable/可接受(paste deposit 90%)焊盘锡量超过90%Reject/拒收(paste deposit 90%)焊盘锡量超过90%Solder Paste Print Quality/Solder Paste Print Quality/锡膏印刷质量锡膏印刷质量锡膏印刷质量锡膏印刷质量232023/3/1023TechnologySmearing and Slumping/锡膏塌陷Acceptable/可接受(Solder smear or
15、 slump 10%)塌陷大于10%Solder Paste Print QualitySolder Paste Print Quality242023/3/1024TechnologyMajor contributor to defects/缺陷的主要分布缺陷的主要分布Source:MPMs A users guide to more Precise SMT printing252023/3/1025TechnologyHardware/硬件硬件Software/软件软件Environment/环境环境Squeegees/刮刀Print Speed/印刷速度Temperature/温度Pas
16、te/锡膏Humidity/湿度Stencil/钢网Pressure/压力Tooling/surport pin Print Gap/印刷间隙Board/印刷线路板Separation Speed/分离速度Factors Affecting the Print/Factors Affecting the Print/影响印刷的因素影响印刷的因素影响印刷的因素影响印刷的因素262023/3/1026TechnologySqueegee/刮刀刮刀272023/3/1027TechnologySqueegee Type/刮刀类型刮刀类型Diamond edgeTrailing edgeD cut28
17、2023/3/1028TechnologySqueegee Material/刮刀材料刮刀材料Polyurethane/聚亚安酯Composite/合成物2 part polyurethaneEpoxy/环氧树脂Metal/金属Plain Steel/平钢Polished/被抛光RolledLubricated surfaceTeflonPermalex292023/3/1029TechnologySqueegee/刮刀刮刀Hardness/硬度:30 to 90 durometer(Shore A)with 60 to 90 durometer most used,metal.Attack
18、Angle/接触角度:45 to 75 degreesPressure/压力Parallelism/平行度302023/3/1030TechnologyScan pic of rubber and metal squeegee,paste,cyberoptics橡胶和金属刮刀，锡膏，影像Scavenging312023/3/1031TechnologyPrint Parameters/印刷参数印刷参数Print Speed/印刷速度Squeegee Pressure/刮刀压力Separation Speed/分离速度Print Gap/印刷间隙Under Screen Clean Rate/钢
19、网底板清洗频率Paste Dispense/加锡膏Environment/环境322023/3/1032TechnologyTriangulation method/三角方法三角方法Laser/激光激光Measurements量测值量测值Note on beam splatter连续光梁连续光梁332023/3/1033Technology2D Inspection(built-in system)/二维检测二维检测Coverage on pad在焊盘上的覆盖范围Coverage on pad together with stencil release/钢网分离以后的锡膏在焊盘上的覆盖范围34Design.Build.Ship.Service.谢谢 谢！谢！Business Excellence35谢谢观看/欢迎下载BY FAITH I MEAN A VISION OF GOOD ONE CHERISHES AND THE ENTHUSIASM THAT PUSHES ONE TO SEEK ITS FULFILLMENT REGARDLESS OF OBSTACLES.BY FAITH I BY FAITH