电子元件检验标准优秀课件.ppt

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1、电子元件检验标准Rev:1.0 1第1页，本讲稿共31页Rev:1.0 3DIP零件組裝工藝標準機構零件DIP Connector浮件與傾斜-1-22DIP component Assembly workmanship criteria-Tilt and floating of constructive componentDIP零件組裝工藝標準-機構零件DIP Connector未入孔-1-23DIP component Assembly workmanship criteria-Lead bend and no-inside the hole of assemblyDIP零件組裝工藝標準-板

2、彎、板翹、板扭(平面度)-1-24DIP component Assembly workmanship criteria-board wrapageDIP零件組裝工藝標準-零件破損-1-25DIP component Assembly workmanship criteria-component brokenDIP焊錫性工藝標準-零件面孔填錫與切面焊錫性標準-1-26DIP soldering workmanship-the solder fillet in the PTH by cross-sectionDIP焊錫性工藝標準-焊錫面焊錫性標準(1)-1-27DIP soldering wor

3、kmanship-soldering standard on solder side(1)DIP焊錫性工藝標準-DIP插件孔焊錫性檢驗圖示-1-28DIP soldering workmanship-Figure of PTH solder fillet evaluationDIP焊錫性工藝標準-焊錫性問題(錫橋、短路、錫裂)-1-29DIP soldering workmanship-soldering issue(Bridge,short,crack)PCBA缺點等級一覽表(1)-1-30classification table of defect description(1)PCBA缺點

4、等級一覽表(2)-1.31 -classification table of defect description(2)第3页，本讲稿共31页Rev:1.0 4PCBA 半成品握持方法:PCBA WIP product handling理想狀況（Target Condition）：配帶乾淨手套與配合良好靜電防護措施。Handling with clean gloves and full ESD protection 允收狀況（Accept Condition）：配帶良好靜電防護措施，握持PCB板邊或板角執行檢驗。Handling with clean hands by board edges

5、using full ESD protection拒收狀況（Reject Condition）：未有任何靜電防護措施，並直接接觸及導體、金手指與錫點表面(MA)。Handling with bare hands touching conductors,solder connections and gold finger,No ESD protection implemented第4页，本讲稿共31页Rev:1.0 5理想狀況(Target Condition)拒收狀況(Reject Condition)SMT零件組裝工藝標準-晶片狀(Chip)零件之對準度(組件X方向)SMD Assembly

6、 workmanship criteria-Chip component alignment(X Axis)1.晶片狀零件恰能座落在焊 墊的中央且未發生偏出，所有各金屬封頭都能完全 與焊墊接觸。1.Component is centered on both sides of the land.All the solder terminations shall completely touch pad.1.零件橫向超出焊墊以外，但 尚未大於其零件寬度的50%。(X1/2W)1.The component shifted off the pad and shift length shall les

7、s 1/2 chip width1.零件已橫向超出焊墊，大 於零件寬度的50%(MI)。(X1/2W)1.The component shifted off the pad and shift length over 1/2 chip with允收狀況(Accept Condition)X1/2W X1/2W330X1/2W X1/2W註:此標準適用於三面或五面 之晶片狀零件This standard only be used for 3 or 5 face terminations chip component ww330330第5页，本讲稿共31页Rev:1.0 6理想狀況(Target

8、Condition)拒收狀況(Reject Condition)1.晶片狀零件恰能座落在焊墊 的中央且未發生偏出，所有 各金屬封頭都能完全與焊墊 接觸。1.Component is centered on both sides of the land.All the solder terminations shall completely touch pad.1.零件縱向偏移，但焊墊尚保 有其零件寬度的25%以上。(Y1 1/4W)2.零件縱向偏移，但零件端電 極仍蓋住焊墊為其零件寬度 的25%以上。(Y2 1/4W)Component is shifted towards longest p

9、art of the chip,but the termiuad end of chip still on the land1.The Pad length not be cover by chip(Y1)shall over 1/4 chip width(W)2.1/4 width of the land for solder fillet to form.1.零件縱向偏移，但焊墊未 保有其零件寬度的25%(MI)。(Y11/4W)2.零件縱向偏移，但零件端 電極蓋住焊墊小於其零件 寬度的25%。(Y21/4W)3.Whichever is rejected.允收狀況(Accept Cond

10、ition)W W 330 330Y2 1/4W330Y1 1/4WY2 1/4WY1 1/4WSMT零件組裝工藝標準-晶片狀(Chip)零件之對準度(組件Y方向)SMD Assembly workmanship criteria-Chip component alignment(Y Axis)第6页，本讲稿共31页Rev:1.0 7理想狀況(Target Condition)拒收狀況(Reject Condition)SMT零件組裝工藝標準-圓筒形（Cylinder）零件之對準度SMD Assembly workmanship criteria-Cylinder component alig

11、nment 1.組件的接觸點在焊墊中心1.The point of contact is centered on the lands1.組件端寬(短邊)突出焊墊端 部份是組件端直徑33%以下。(X 1/3D)2.零件縱向偏移，但金屬封頭仍在焊墊上。(Y10 mil),(Y20 mil)1.The length of component shifted off the pad(X)shall less the 1/3 Diameter of component2.Shifted toward the longest part of the component,the solder termina

12、tions still on the land 1.組件端寬(短邊)突出焊墊端 部份是組件端直徑33%以上 (MI)。(X1/3D)2.零件縱向偏移，但金屬封頭未 在焊墊上。(Y10 mil),(Y20 mil)3.Whichever is rejected.允收狀況(Accept Condition)X1/3D1/3D X1/3D1/3D Y20mil Y10 0mil X1/3D1/3D X1/3D1/3D Y20 0 mil Y10 0 mil註：為明瞭起見,焊點上的錫已省去。Note:In order to clarify the figure,the solder joint be

13、eliminatedD第7页，本讲稿共31页Rev:1.0 8理想狀況(Target Condition)拒收狀況(Reject Condition)SMT零件組裝工藝標準-鷗翼(Gull-Wing)零件腳面之對準度 SMD Assembly workmanship criteria-Gull-Wing footprint alignment1.各接腳都能座落在各焊 墊的中央，而未發生偏 滑。1.All the leads footprint is centered on the lands1.各接腳已發生偏滑，所偏 出焊墊以外的接腳，尚未 超過接腳本身寬度的1/2W 。(X1/2W)2.偏移

14、接腳之邊緣與焊墊外緣之垂直距離5mil(0.13mm)。(S5mil)1.The length of the lead footprint shifted off the land(X)shall less 1/2 width of lead2.The clearance(S)between lead shifted off and land shall over 5 mil允收狀況(Accept Condition)W S XX1/2W S S5mil5mil X1/2W S5mil 1.各接腳已發生偏滑，所偏 出焊墊以外的接腳，已超過接腳本身寬度的1/2W (MI)。(X1/2W)2.偏移

15、接腳之邊緣與焊墊外緣之垂直距離5mil(0.13mm)(MI)。(S5mil)3.Whichever is rejected.第8页，本讲稿共31页Rev:1.0 9理想狀況(Target Condition)拒收狀況(Reject Condition)SMT零件組裝工藝標準-鷗翼(Gull-Wing)零件腳趾之對準度SMD Assembly workmanship criteria-Gull-Wing toe alingnment1.各接腳都能座落在各焊 墊的中央，而未發生偏 滑。1.All the leads footprint is centered on the lands1.各接腳已

16、發生偏滑，所偏 出焊墊以外的接腳，尚未 超過焊墊側端外緣。1.The lead had shifted and footprint not over the end of land1.各接腳側端外緣，已 超過焊墊側端外緣(MI)。1.The lead had shifted and footprint had over the end of land(MI)允收狀況(Accept Condition)W W 已超過焊墊側端外緣已超過焊墊側端外緣第9页，本讲稿共31页Rev:1.0 10理想狀況(Target Condition)拒收狀況(Reject Condition)SMT零件組裝工藝標準

17、-鷗翼(Gull-Wing)零件腳跟之對準度 SMD Assembly workmanship criteria-Gull-Wing heel alingnment1.各接腳都能座落在各焊 墊的中央，而未發生偏 滑。1.All the leads footprint is centered on the lands1.各接腳已發生偏滑，腳跟 剩餘焊墊的寬度，最少保有一個接腳厚度(XT)。1.The lead had shifted the length from lead heel to end of land(X)shall be over the thickness of land(T)1

18、.各接腳己發生偏滑，腳跟剩餘焊墊的寬度，已小於接腳 厚度(XT)(MI)。允收狀況(Accept Condition)T X T X TT T XT第10页，本讲稿共31页Rev:1.0 11理想狀況(Target Condition)拒收狀況(Reject Condition)SMT零件組裝工藝標準-J型腳零件對準度SMD Assembly workmanship criteria-J type lead alignment 1.各接腳都能座落在焊墊的中 央，未發生偏滑。1.All the leads footprint is centered on the lands允收狀況(Accept

19、 Condition)S W S5mil5mil X1/2W S1/2W 1.各接腳已發生偏滑，所偏 出焊墊以外的接腳，已超過接腳本身寬度的1/2W (MI)。(X1/2W)2.偏移接腳之邊緣與焊墊外緣之垂直距離5mil(0.13mm)以下(MI)。(S5mil)3.Whichever is rejected.1.各接腳已發生偏滑，所偏 出焊墊以外的接腳，尚未 超過接腳本身寬度的1/2W 。(X1/2W)2.偏移接腳之邊緣與焊墊外緣之垂直距離5mil(0.13mm)以上。(S5mil)The lead had shifted off the land1.The length of lead s

20、hifted off the land(X)shall less 1/2 width of lead(W)2.The clearance distance between shifted lead and land edge shall over 5 mil第11页，本讲稿共31页Rev:1.0 12理想狀況(Target Condition)拒收狀況(Reject Condition)SMT焊點性工藝標準-鷗翼(Gull-Wing)腳面與腳跟焊點最小量SMD solder joint workmanship criteria-Minimum solder of Gull Wing footp

21、rint1.引線腳的側面,腳跟吃錫良好2.引線腳與板子焊墊間呈現凹面 焊錫帶。3.引線腳的輪廓清楚可見。1.side face and footprint have good solder fillet 2.concave fillet between land and lead3.the shape(profile)of lead be clearly visible1.引線腳的底邊與板子焊墊間的 銲錫帶至少涵蓋引線腳長的 2/3L以上。2.腳跟(Heel)焊錫帶涵蓋高度h 大於零件腳1/2厚度。(h1/2T)。3.腳跟(Heel)沾錫角需90度。1.Width of solder fill

22、et between lead and land(X)shall over 2/3 lead footprint(L)2.Minimum solder fillet flows up end more than 1/2 thickness of lead on heel3.Wetting angle 90on heel1.引線腳的底邊與板子焊墊間的 銲錫帶不足涵蓋引線腳長的 2/3L。2.腳跟(Heel)焊錫帶涵蓋高 度 h小於零件腳1/2厚度。(h=2/3LLX2/3Lh1/2TTh1/2TT第12页，本讲稿共31页Rev:1.0 13理想狀況(Target Condition)SMT焊點性

23、工藝標準-鷗翼(Gull-Wing)腳面焊點最大量SMD solder joint workmanship criteria-Maximum solder of Gull Wing footprint 1.引線腳的側面,腳跟吃錫良好。2.引線腳與板子焊墊間呈現凹面 焊錫帶。3.引線腳的輪廓清楚可見。1.side face and footprint have good solder fillet 2.concave fillet between land and lead3.the shape(profile)of lead be clearly visible1.引線腳與板子焊墊間的焊錫連接

24、很好且呈一凹面焊錫帶。2.引線腳的側端與焊墊間呈現稍 凸的焊錫帶。3.引線腳的輪廓可見。1.Good solder flow up and concave fillet between land and lead2.Concave solder fillet between side face of lead and land3.The shape(profile)of lead(footprint)be clearly visible1.焊錫帶延伸過引線腳的 頂部(MI)。2.引線腳的輪廓模糊不清(MI)。3.Whichever is rejected.1.solder flow cover

25、 the end(TIP)of lead2.The shape(profile)of lead not be visible clearly3.Whichever is rejected拒收狀況(Reject Condition)允收狀況(Accept Condition)第13页，本讲稿共31页Rev:1.0 14理想狀況(Target Condition)拒收狀況(Reject Condition)SMT焊點性工藝標準-鷗翼(Gull-Wing)腳跟焊點最大量SMD solder joint workmanship criteria-Minimum solder of Gull Wing

26、Heel1.腳跟的焊錫帶延伸到引線上彎 曲處底部(B)與下彎曲處頂部(C)間的中心點。註：引線上彎頂部：引線上彎底部：引線下彎頂部：引線下彎底部1.Solder flow up to the center between B,C point on the heel of lead1.腳跟的焊錫帶已延伸到引線上彎曲處的底部(B)。1.solder flow up to B point on the heel1.腳跟的焊錫帶延伸到引線上 彎曲處的底部(B)，延伸過 高，且沾錫角超過90度，才 拒收(MI)。1.Solder flow up over(cross)B point and the we

27、tting angle over 90 degree允收狀況(Accept Condition)沾錫角超過90度 ABDC第14页，本讲稿共31页Rev:1.0 15理想狀況(Target Condition)拒收狀況(Reject Condition)SMT焊點性工藝標準-J型接腳零件之焊點最小量SMD solder joint workmanship criteria-Minimum solder of J type lead1.凹面焊錫帶存在於引線的四側2.焊錫帶延伸到引線彎曲處兩側的頂部(A,B)。3.引線的輪廓清楚可見。4.所有的錫點表面皆吃錫良好。1.Solder concave

28、fillet on the 4 face of lead2.solder flow up to the angle high point A,B3.Lead shape(profile)can be clearly visible4.Good soldering joint at every solder contact1.焊錫帶存在於引線的三側2.焊錫帶涵蓋引線彎曲處兩 側的50%以上(h1/2T)。1.Solder concave fillet on the 3 face of lead2.Height of solder flow-up on the lead angle(h)shall

29、 over 1/2 angle height(T)1.焊錫帶存在於引線的三側以 下(MI)。2.焊錫帶涵蓋引線彎曲處兩側 的50%以下(h1/2T)(MI)。3.Whichever is rejected.1.Solder concave fillet is less 3 face2.Height of solder flow-up on the lead angle(h)under 1/2 angle height(T)3.Whichever is rejected允收狀況(Accept Condition)h1/2TAT B h 1/2T第15页，本讲稿共31页Rev:1.0 16理想狀況

30、(Target Condition)拒收狀況(Reject Condition)SMT焊點性工藝標準-J型接腳零件之焊點最大量工藝水準點SMD solder joint workmanship criteria-Maximum solder of J type lead1.凹面焊錫帶存在於引線的四側2.焊錫帶延伸到引線彎曲處 兩側的頂部(A,B)。3.引線的輪廓清楚可見。4.所有的錫點表面皆吃錫良好。1.Solder concave fillet on the 4 face of lead2.solder flow up to the angle high point A,B3.Lead sh

31、ape(profile)can be clearly visible4.Good soldering joint at every solder contact1.凹面焊錫帶延伸到引線彎 曲處的上方,但在組件本體的下方。2.引線頂部的輪廓清楚可見。1.Solder flow up to top of lead angle and not touch the body2.Shape(profile)of lead angle can be visible clearly1.焊錫帶接觸到組件本體(MI)。2.引線頂部的輪廓不清楚(MI)。3.錫突出焊墊邊(MI)。4.Whichever is re

32、jected.1.Solder had touched the body2.Shape(profile)of lead angle can not be visible clearly3.Excess solder on the side of solder land允收狀況(Accept Condition)AB 第16页，本讲稿共31页Rev:1.0 17理想狀況(Target Condition)拒收狀況(Reject Condition)SMT焊點性工藝標準-晶片狀(Chip)零件之最小焊點(三面或五面焊點)SMD solder joint workmanship criteria-M

33、inimum solder fillet of chip component(3 or 5 face terminations)1.焊錫帶延伸到晶片端電極高度的25%以上。(h1/4T)2.焊錫帶從晶片外端向外延伸到焊墊的距離為晶片高度的25%以上。(X1/4H)1.1/4 component height be fillet by solder at least2.Solder flow spread on the land shall 1/4 width of component height at least,(Count from tip of component)1.焊錫帶延伸到晶片

34、端電極高度的25%以下(MI)。(h1/4T)2.焊錫帶從晶片外端向外延伸到焊墊端的距離為晶片高度的25%以下(MI)。(X1/4T)3.Whichever is rejected.允收狀況(Accept Condition)T h1/4 T X1/4 T h1/4 T X8mil。(D,L8mil)2.Whichever is rejected.允收狀況(Accept Condition)可被剝除者可被剝除者D 8mil 可被剝除者可被剝除者D 8mil 不易被剝除者不易被剝除者L 8mil 不易被剝除者不易被剝除者L 8mil第19页，本讲稿共31页Rev:1.0 20理想狀況(Targe

35、t Condition)拒收狀況(Reject Condition)允收狀況(Accept Condition)X0X0 X0 YYTTYTX1.各接腳都能座落在各焊 墊的中央，而未發生偏 滑。1.The footprint of every lead be centered on the land1.各接腳已發生偏滑，引線 腳的側面仍保留在焊墊 上(X0),2.各接腳已發生偏滑，腳跟剩餘焊墊的寬度，最少保有一個接腳厚度(YT)。Footprint had shifted1.Side face still on the land(X0)2.The space from end of land

36、to heel shall over the thickness of lead 1.各接腳己發生偏滑，引線腳 的側面已超出焊墊(X0)。2.各接腳已發生偏滑，腳跟 剩餘焊墊的寬度，小於一個 接腳厚度(Y0.5mm傾斜傾斜Wh0.5mm1.量測零件基座與PCB零件面之最大距離0.5mm。(Lh,Wh0.5mm)2.錫面可見零件腳出孔。3.無短路。1.量測零件基座與PCB零件面之最大距離0.5mm(MI)。(Lh,Wh0.5mm)2.零件腳折腳、未入孔、缺件等缺點影響功能(MA)。3.短路(MA)。4.Whichever is rejected.第22页，本讲稿共31页Rev:1.0 23拒收狀

37、況(Reject Condition)DIP零件組裝工藝標準-DIP Connector 腳折腳、未入孔 DIP component Assembly workmanship criteria-Lead bend and no-inside the hole of assembley1.零件組裝正確位置與極性。2.應有之零件腳出焊錫面，無零 件腳之折腳、未入孔、未出孔 、缺零件腳等缺點。1.零件腳折腳(跪腳）影響功能(MA)。1.零件腳折腳、未入孔、缺件等缺點影響功能(MA)。允收狀況(Accept Condition)拒收狀況(Reject Condition)第23页，本讲稿共31页Rev

38、:1.0 24L拒收狀況(Reject Condition)DIP零件組裝工藝標準-板彎、板翹、板扭(平面度)DIP component Assembly workmanship criteria-board wrapage中心線D1.板彎,板翹,板扭計算方式：W=(D*100)/L W=彎(翹)度或扭度(%)D=半成品板材變形之最大距離 L=半成品板材之長邊2.零件組裝後產生之板彎,板翹,板扭程度趨近於0%。1.零件組裝後產生之板彎,板翹,板扭程度 W0.75%。允收狀況(Accept Condition)1.零件組裝後產生之板彎,板翹,板扭程度 W0.75%(MA)。W=(D*100)/L

39、 0.75%W=(D*100)/L 1%理想狀況(Target Condition)W=(D*100)/L 0%D第24页，本讲稿共31页Rev:1.0 25拒收狀況(Reject Condition)DIP零件組裝工藝標準-零件破損 DIP component Assembly workmanship criteria-component broken1.零件內部晶片無外露,IC封裝 良好，無破損。1.IC無破裂現象。2.IC腳與本體封裝處不可破裂3.零件腳無損傷。1.IC 破裂現象(MA)。2.IC 腳與本體連接處破裂(MA)3.零件腳吃錫位置電鍍不均，生銹沾油脂或影響焊錫性(MA)。4.

40、本體破損不露出內部底材，但寬度超過1.5mm(MI)。5.Whichever is rejected.允收狀況(Accept Condition)+理想狀況(Target Condition)+第25页，本讲稿共31页Rev:1.0 26理想狀況(Target Condition)拒收狀況(Reject Condition)DIP焊錫性工藝標準-零件面孔填錫與切面焊錫性標準DIP soldering workmanship-the solder fillet in the PTH by cross-section1.焊錫面需有向外及向上之擴展 ，且外觀成一均勻弧度。2.無冷焊現象與其表面光亮。

41、3.無過多的助焊劑殘留。1.可垂直目視者，零件面吃錫以孔內填錫量達PCB板厚的75%以上為允收。2.不可垂直目視者，零件面吃錫以目視可見孔內吃錫為允收3.軸狀腳零件,焊錫延伸最大允 許至彎腳。1.可垂直目視者，零件面吃錫孔內填錫量未達PCB板厚的75%以上(MI)。2.不可垂直目視者，零件面吃錫目視未見孔內吃錫(MI)。3.焊錫超越觸及零件本體(MA)4.不影響功能之其他焊錫性不良現象(MI)。5.Whichever is rejected.允收狀況(Accept Condition)目視可見錫或孔內填錫量目視可見錫或孔內填錫量達達PCBPCB板厚的板厚的75%+無法目視可見錫無法目視可見錫零

42、件面焊點零件面焊點視線視線第26页，本讲稿共31页Rev:1.0 27理想狀況(Target Condition)拒收狀況(Reject Condition)1.焊錫面需有向外及向上之擴展 ，且外觀成一均勻弧度。2.無冷焊現象或其表面光亮。3.無過多的助焊劑殘留。1.可見零件腳且沾錫角度90度。2.焊錫不超越過錫墊邊緣與觸 及零件或PCB板面。3.未使用任何放大工具於目視 距離20cm30cm未見針孔或錫 洞。1.未見零件腳或沾錫角度90度。2.焊錫超越過錫墊邊緣與觸及 零件或PCB板面,不影響功能 (MI)。3.未使用任何放大工具於目視距離20cm30cm可見錫洞,不被接受(MI)。7.Wh

43、ichever is rejected.允收狀況(Accept Condition)90度度 +沾錫角沾錫角 90度度錫洞等其它焊錫性不良錫洞等其它焊錫性不良焊錫面焊點焊錫面焊點焊錫面焊點焊錫面焊點焊錫面DIP焊錫性工藝標準-焊錫面焊錫性標準(1)DIP soldering workmanship-soldering standard on solder side(1)第27页，本讲稿共31页Rev:1.0 28DIP焊錫性工藝標準-DIP插件孔焊錫性檢驗圖示DIP soldering workmanship-Figure of PTH solder fillet evaluation基板(P

44、CB)基板(PCB)Lmin目視零件腳出錫面目視零件腳出錫面 Lmax 2.5mm 焊錫面焊錫面(Solder Side)焊錫面吃錫良好焊錫面吃錫良好-允收允收(Accept)焊錫面吃錫、沾錫角焊錫面吃錫、沾錫角 5點點與沾錫角與沾錫角9090度度-拒收。拒收。需剪腳零件腳長度需剪腳零件腳長度 L L 計算計算:需從需從PCBPCB沾沾錫平面為衡量基準，錫平面為衡量基準，LminLmin長度下限長度下限標準，為目視零件腳出錫面，標準，為目視零件腳出錫面，LmaxLmax零零件腳最長之長度件腳最長之長度 2.5mm-2.5mm-允收。允收。第28页，本讲稿共31页Rev:1.0 29拒收狀況(R

45、eject Condition)DIP焊錫性工藝標準-焊錫性問題(錫橋、短路、錫裂)DIP soldering workmanship-soldering issue(Bridge,short,crack)錫短路、錫橋:1.兩導體或兩零件腳有錫短路、錫橋(MA)。錫裂:1.因不適當之外力或不銳利之修 整工具，造成零件腳與焊錫面 產生裂紋，其長度超過零件腳 外徑1/2圈,不影響功能(MI)。拒收狀況(Reject Condition)拒收狀況(Reject Condition)錫短路、錫橋:1.兩導體或兩零件腳有錫短路、錫橋(MA)。第29页，本讲稿共31页Rev:1.0 30PCBA 檢驗缺點等級一覽表第30页，本讲稿共31页Rev:1.0 31PCBA 檢驗缺點等級一覽表第31页，本讲稿共31页