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1、1Prepared by MFG Training CenterPrepared by MFG Training Centerv 常用词汇介绍常用词汇介绍 FABFAB区常用词汇区常用词汇 工作区常用词汇工作区常用词汇 公司常用词汇公司常用词汇12 公司常用词汇公司常用词汇nSMIC(Semiconductor Manufacturing International Corporation)中芯囯际集成电路制造有限公司中芯囯际集成电路制造有限公司nMES(Manufacturing Execution System)生產操作介面軟件生產操作介面軟件nERC(Emergency Response
2、 Center)緊急應變中心緊急應變中心23nHR(Human Resource)人事部人事部nGA(General Affairs)总务部总务部nAccounting 会计部会计部nMFG(Manufacturing)制造部制造部nENG.(Engineering)工程部工程部nFinance 财务部财务部nPC(production control)生产控制生产控制nPR(public relation)公关部公关部34nConference 會議會議nTraining room 训練教室训練教室nTraining course 训練课程训練课程nShuttle bus 交通車交通車nIn
3、ternet 國际互國际互联联網絡網絡nIntranet 企業內部互企業內部互联联網絡網絡nISO 9000(International Standard Organization)国际标准组织国际标准组织45nIT(Information Technology)信息技术部信息技术部门门nTD(Technical Development)技术研发部门技术研发部门nDCC(Document Control Center)文件管制中心文件管制中心nISEP(Industrial Safety Environment Protection)工安环保工安环保nEAP(Equipment Automat
4、ion Project)机台自动化方案机台自动化方案56Prepared by MFG Training CenterPrepared by MFG Training Center FAB区常用词汇区常用词汇Air Shower空气洁净室空气洁净室Alarm警讯警讯Average 平均平均APD异常处理单异常处理单Abort放弃放弃Acid酸酸Auto/Manual自动自动/手动手动AMHS自动化物料传输系统自动化物料传输系统Area区域区域Batch群;组群;组Back up备用备用Bay rack货架货架Bay工作区工作区Bank储存所储存所“A“A”“B“B”67“C“C”Cancel取
5、消取消Clean room无尘室无尘室Cassette装晶片的晶舟装晶片的晶舟Chemical化学药剂化学药剂Check检查;核对检查;核对CIM电脑整和制造电脑整和制造Class洁净室等级洁净室等级CMP化学机械研磨化学机械研磨Child lot子批子批Correct正确正确Cycle time生产周期生产周期Code代码代码Control控制控制Chip(die)晶粒晶粒Comment注解注解Critical layer重要层重要层Confirm确认确认Chamber反应室反应室CD关键性尺寸关键性尺寸Cart手推车手推车Chart图表图表Control Wafer控片控片78Prepar
6、ed by MFG Training CenterPrepared by MFG Training Center“D“D”Dummy wafer挡片挡片Daily check每天检查每天检查Diffusion扩散扩散DI water去离子水去离子水Damage损害损害Display展示展示Double重复;加倍重复;加倍Defect缺陷缺陷Doping掺杂掺杂Downgrade降级降级Due date交期交期Discipline 纪律纪律89Prepared by MFG Training CenterPrepared by MFG Training CenterEtch蚀刻蚀刻Error错误
7、错误EE设备工程师设备工程师Emergency紧急状况紧急状况Exit退出退出Entry进入进入Energy能量能量Environment环境环境EQ rack机台货架机台货架ET设备技术员设备技术员EQ Status机台状态机台状态“E“E”910Prepared by MFG Training CenterPrepared by MFG Training CenterFoundry代工代工Fail失败失败FAB工厂工厂Filter过滤器过滤器Function功能功能Gas气体气体Gowning room更衣室更衣室“F“F”“G”“G”1011Prepared by MFG Trainin
8、g CenterPrepared by MFG Training Center“H“H”Hold暂停暂停Hot back烘烤烘烤I.C集成电路集成电路Idle闲置闲置Implant植入植入Inter bay自动传输轨道系统自动传输轨道系统ID辨认,鉴定辨认,鉴定IPA有机清洁溶剂有机清洁溶剂“I“I”1112Prepared by MFG Training CenterPrepared by MFG Training CenterLayer层次层次Lot批批Line线距线距Loop巡路巡路Load载入载入Login/logout注册注册/离离开开Log sheet记录本记录本Logo标志标志L
9、ocation位置位置Login登录登录Logout退出退出Lot Status产品状态产品状态Laundry洗衣房洗衣房“L“L”1213Prepared by MFG Training CenterPrepared by MFG Training CenterMachine机器机器Module模块模块Move产量产量Monitor 测机测机Merge合并合并Micron微米微米Metal金属金属MFG制造部制造部Mark标志标志Mask(reticle)光罩光罩Manual手动手动Measure测量测量Mapping映射映射Mode模式模式Message讯息讯息Mean平均值平均值Meas
10、ure测量测量“M”1314Prepared by MFG Training CenterPrepared by MFG Training CenterNon-critical非重要非重要“N”Oxide氧化物氧化物Owner拥有者拥有者O.I操作指导手册操作指导手册OPI操作界面操作界面OOS超出规格界线超出规格界线OOC超出控制界线超出控制界线OCAP超出管制界线的因应对策超出管制界线的因应对策“O”1415Prepared by MFG Training CenterPrepared by MFG Training Center“P”Pod装晶舟与晶片的盒子装晶舟与晶片的盒子Photo黄
11、光或微影黄光或微影Particle含尘量含尘量/微尘粒子微尘粒子Password密码密码Poly复晶复晶Passivation保护层保护层Polymer聚合物聚合物Profile侧面侧面Power电源电源Pressure压力压力P.R.光阻光阻Parent lot母批母批Pause暂停暂停Process进行进行/过程过程/程序程序PE制程工程师制程工程师Peeling掀起掀起Pattern图形图形Priority优先权优先权Product产品产品PM预防保养预防保养PN制程通报制程通报POD晶盒晶盒1516Prepared by MFG Training CenterPrepared by M
12、FG Training Center“Q”Quality品质品质Certify(Qualify)取得资格取得资格Quantity(QTY)数量数量Queue time等待时间等待时间“R”Recipe程式程式Rework再做一次再做一次/重做重做Robot机械手臂机械手臂Run跑(货)跑(货)Release放行放行Run Card卡片,注明程式内容卡片,注明程式内容Ready准备准备Recycle回收回收Reclaim再生再生Remove去除去除Request要求要求Reject退回(出)退回(出)Range范围范围Record记录记录Review重新检查重新检查Retest再测试再测试161
13、7Prepared by MFG Training CenterPrepared by MFG Training Center“S”Semiconductor半导体半导体Scrap报废报废Si硅原子硅原子Start开始开始Spec规格规格Schedule指目录或时间表指目录或时间表Step步骤步骤Smif Arm标准机械界面标准机械界面Smart Tag电子式标签电子式标签Ship传送传送Smart Tray托盘托盘Space空间空间Sidewall侧壁侧壁Stocker仓储仓储Split分批分批Shut down停工停工Sticker防错标签防错标签Stop停止停止Standby准备,待命准
14、备,待命Scrubber洗刷洗刷Set up测试测试SOP标准操作程序标准操作程序1718Prepared by MFG Training CenterPrepared by MFG Training Center“S”Slot槽位槽位Solvent溶剂溶剂Scratch刮伤刮伤Sorter晶片分片晶片分片/整理机整理机Summary总计总计SPC制程统计管制制程统计管制Strip剥去剥去SPC-Chart制程统计控制图形制程统计控制图形“T”T.A.技术助理技术助理Transfer传送传送T.M.领班领班/训练员训练员Throughput产量产量Thickness厚度厚度Test Wafer
15、测试晶片测试晶片Transistor电晶体电晶体Track in 进货进货1819Prepared by MFG Training CenterPrepared by MFG Training CenterTrack out出货出货Tag电子显示器电子显示器Thin Film薄膜薄膜Temperature温度温度TECN临时工程变更通知临时工程变更通知Tunnel(Bay)通道通道Turn Ratio周转率(周转率(T/R)Trolley手推车手推车“T”“U”Unload载出载出Up向上向上Update更新资料更新资料Uniformity均匀度均匀度“V”V.L.S.I超大型积体电路超大型积
16、体电路Vacuum真空真空1920Prepared by MFG Training CenterPrepared by MFG Training Center“W”WAT晶圆测试晶圆测试Wafer晶圆晶圆Wafer Start晶片投入晶片投入WIP在制品在制品Wet Bench酸槽酸槽Well井区井区W(Tungsten)钨钨WPH 每小時機台產出晶片數每小時機台產出晶片數 Wait等待等待Warning 警告警告Wiper无尘布无尘布“Y”Yield良率良率2021Prepared by MFG Training CenterPrepared by MFG Training CenterCo
17、nfidentialConfidential 工作区常用词汇工作区常用词汇DIFF Area (扩散区)(扩散区)单字单字解释解释单字单字解释解释Pad Oxide垫氧化层垫氧化层Gate Oxide闸氧化层闸氧化层Field Oxide场氧化层场氧化层Density密化密化BPSG含硼及磷的硅化物含硼及磷的硅化物Backside Etch背面蚀刻背面蚀刻Anneal回火回火Nitride(Si3N4)氮化硅氮化硅Furnace炉管炉管Alloy融合:电压与电流成线性关系,降低接触的阻值融合:电压与电流成线性关系,降低接触的阻值TEOS四乙基氧化硅:在四乙基氧化硅:在IC里通常当作绝缘曾使用里
18、通常当作绝缘曾使用2122Prepared by MFG Training CenterPrepared by MFG Training CenterETCH Area(蚀刻区)(蚀刻区)单字单字解释解释单字单字解释解释AEI蚀科后检查蚀科后检查Under Etch蚀刻不足蚀刻不足ASI光阻去除后检查光阻去除后检查Metal Via金属接触窗金属接触窗Contact Hole接触窗接触窗Over Etch过蚀刻过蚀刻Descum预处理预处理Plasma电浆电浆Dry Clean干洗干洗Season暖机暖机SEM扫描式电子显微镜扫描式电子显微镜Selectivity选择比选择比End Point
19、蚀刻终点蚀刻终点Electrode电极电极2223Prepared by MFG Training CenterPrepared by MFG Training CenterConfidentialConfidentialIMPLANT Area(植入区)(植入区)单字单字解释解释单字单字解释解释A.M.U原子质量数原子质量数High-Current高电流高电流Angle角度角度High-Energy高能量高能量Beam-Current电子束电流电子束电流Mid-Current中电流中电流Depth深度深度Magnet磁场磁场Dose剂量剂量Source-Head离子源离子源High-Volt
20、age高压高压2324Prepared by MFG Training CenterPrepared by MFG Training CenterConfidentialConfidentialPHOTO Area(黄光区)(黄光区)单字单字解释解释单字单字解释解释ADIAfter develop inspection显影后检视显影后检视Exhaust排气(将管路中的空排气(将管路中的空气排除)气排除)Alignment排成一直线,对平排成一直线,对平Exposure曝光曝光Break中断,中断,stepper机台内中机台内中途停止键途停止键H.M.D.SHexamethyldisilazan
21、e,经去水烘烤的晶片,经去水烘烤的晶片,将涂上一层增加光阻将涂上一层增加光阻与晶片表面附着力的与晶片表面附着力的化合物,称化合物,称H.M.D.SBackside晶片背面晶片背面Finished完成,货已执行完成完成,货已执行完成2425Prepared by MFG Training CenterPrepared by MFG Training CenterConfidentialConfidentialPHOTO Area(黄光区)(黄光区)单字单字解释解释单字单字解释解释Coating 涂布,光阻覆盖涂布,光阻覆盖Execute执行执行Coater光阻覆盖(机台)光阻覆盖(机台)Flat
22、ness平坦度平坦度Developer显影液;显影(机显影液;显影(机台)台)Focus焦距焦距Development显影显影Local当地的,本地的当地的,本地的Diagnosis诊断,诊断结果,诊断,诊断结果,stepper机台执行测机台执行测机时之按键机时之按键Local defocus局部失焦因机台或晶局部失焦因机台或晶片造成之脏污片造成之脏污2526Prepared by MFG Training CenterPrepared by MFG Training CenterConfidentialConfidentialPHOTO Area(黄光区)(黄光区)单字单字解释解释单字单字解
23、释解释Dose曝光量曝光量Lamp灯灯Offset弥补弥补Over flow溢出溢出Overlay测量前层与本层之测量前层与本层之间曝光的准确度间曝光的准确度Spin旋转旋转 Spin Dry 旋干旋干P.R.Photo resisit 光阻光阻Rotation旋转旋转Pilot实验的实验的Search寻找寻找Query疑问疑问WEE周边曝光周边曝光Queue time等待时间等待时间Register记录,登记记录,登记Rinse湿润湿润Reticle光罩光罩2627Prepared by MFG Training CenterPrepared by MFG Training CenterTHINFILM Area(薄膜区)薄膜区)单字单字解释解释单字单字解释解释PVD物理气相淀积物理气相淀积CVD化学气相淀积化学气相淀积IMD内金属介电层内金属介电层ILD内层介电层内层介电层ARC防反射层防反射层Sputter溅射溅射RF射频射频HDP高密度等离子体高密度等离子体Ti钛钛TiN氮化钛氮化钛Stress内应力内应力Resistance电阻电阻27