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1、1、BGA 封装(ball grid array)球形触点陈列，表面贴装型封装之一。在印刷基板的背面按陈列方式制作出球形凸点用以 代替引脚，在印刷基板的正面装配LSI 芯片，然后用模压树脂或灌封方法进行密封。也 称为凸点陈列载体(PAC)。引脚可超过200，是多引脚LSI 用的一种封装。封装本体也可做得比QFP(四侧引脚扁平封装)小。例如，引脚中心距为 1.5mm 的 360 引脚BGA 仅为 31mm 见方;而引脚中心距为0.5mm 的 304 引脚QFP 为 40mm 见方。而且 BGA 不 用担心 QFP 那样的引脚变形问题。该封装是美国Motorola 公司开发的，首先在便携式电话等设
2、备中被采用，今后在美国有可 能在个人计算机中普及。最初，BGA 的引脚(凸点)中心距为1.5mm，引脚数为 225。现在也有 一些LSI 厂家正在开发500 引脚的BGA。BGA 的问题是回流焊后的外观检查。现在尚不清楚是否有效的外观检查方法。有的认为，由于焊接的中心距较大，连接可以看作是稳定的，只能通过功能检查来处理。美国 Motorola 公司把用模压树脂密封的封装称为OMPAC，而把灌封方法密封的封装称为GPAC(见 OMPAC 和 GPAC)。2、BQFP 封装(quad flat package with bumper)带缓冲垫的四侧引脚扁平封装。QFP 封装之一，在封装本体的四个角
3、设置突起(缓冲垫)以 防止在运送过程中引脚发生弯曲变形。美国半导体厂家主要在微处理器和ASIC 等电路中采用此封装。引脚中心距0.635mm，引脚数从84 到196 左右(见 QFP)。3、碰焊PGA 封装(butt joint pin grid array)表面贴装型PGA 的别称(见表面贴装型PGA)。4、C-(ceramic)封装表示陶瓷封装的记号。例如，CDIP 表示的是陶瓷DIP。是在实际中经常使用的记号。5、Cerdip 封装用玻璃密封的陶瓷双列直插式封装，用于ECL RAM，DSP(数字信号处理器)等电路。带有玻璃窗口的Cerdip 用于紫外线擦除型EPROM 以及内部带有EPR
4、OM 的微机电路等。引脚中心 距 2.54mm，引脚数从8 到 42。在日本，此封装表示为DIP-G(G 即玻璃密封的意思)。6、Cerquad 封装表面贴装型封装之一，即用下密封的陶瓷QFP，用于封装DSP 等的逻辑LSI 电路。带有窗口的Cerquad 用 于封装EPROM 电路。散热性比塑料QFP 好，在自然空冷条件下可容许1.5 2W 的功率。但封装成本比塑料QFP 高 3 5 倍。引脚中心距有1.27mm、0.8mm、0.65mm、0.5mm、0.4mm 等多种规格。引脚数从32 到 368。带引脚的陶瓷芯片载体，表面贴装型封装之一，引脚从封装的四个侧面引出，呈丁字形。带有窗口的用于
5、封装紫外线擦除型EPROM 以及带有EPROM 的微机电路等。此封装也称为QFJ、QFJ-G(见 QFJ)。文档编码:CJ1H7T3K4O8 HT6U5Z4J1P5 ZE10T1U4J4J1文档编码:CJ1H7T3K4O8 HT6U5Z4J1P5 ZE10T1U4J4J1文档编码:CJ1H7T3K4O8 HT6U5Z4J1P5 ZE10T1U4J4J1文档编码:CJ1H7T3K4O8 HT6U5Z4J1P5 ZE10T1U4J4J1文档编码:CJ1H7T3K4O8 HT6U5Z4J1P5 ZE10T1U4J4J1文档编码:CJ1H7T3K4O8 HT6U5Z4J1P5 ZE10T1U4J4J1
6、文档编码:CJ1H7T3K4O8 HT6U5Z4J1P5 ZE10T1U4J4J1文档编码:CJ1H7T3K4O8 HT6U5Z4J1P5 ZE10T1U4J4J1文档编码:CJ1H7T3K4O8 HT6U5Z4J1P5 ZE10T1U4J4J1文档编码:CJ1H7T3K4O8 HT6U5Z4J1P5 ZE10T1U4J4J1文档编码:CJ1H7T3K4O8 HT6U5Z4J1P5 ZE10T1U4J4J1文档编码:CJ1H7T3K4O8 HT6U5Z4J1P5 ZE10T1U4J4J1文档编码:CJ1H7T3K4O8 HT6U5Z4J1P5 ZE10T1U4J4J1文档编码:CJ1H7T3K
7、4O8 HT6U5Z4J1P5 ZE10T1U4J4J1文档编码:CJ1H7T3K4O8 HT6U5Z4J1P5 ZE10T1U4J4J1文档编码:CJ1H7T3K4O8 HT6U5Z4J1P5 ZE10T1U4J4J1文档编码:CJ1H7T3K4O8 HT6U5Z4J1P5 ZE10T1U4J4J1文档编码:CJ1H7T3K4O8 HT6U5Z4J1P5 ZE10T1U4J4J1文档编码:CJ1H7T3K4O8 HT6U5Z4J1P5 ZE10T1U4J4J1文档编码:CJ1H7T3K4O8 HT6U5Z4J1P5 ZE10T1U4J4J1文档编码:CJ1H7T3K4O8 HT6U5Z4J1
8、P5 ZE10T1U4J4J1文档编码:CJ1H7T3K4O8 HT6U5Z4J1P5 ZE10T1U4J4J1文档编码:CJ1H7T3K4O8 HT6U5Z4J1P5 ZE10T1U4J4J1文档编码:CJ1H7T3K4O8 HT6U5Z4J1P5 ZE10T1U4J4J1文档编码:CJ1H7T3K4O8 HT6U5Z4J1P5 ZE10T1U4J4J1文档编码:CJ1H7T3K4O8 HT6U5Z4J1P5 ZE10T1U4J4J1文档编码:CJ1H7T3K4O8 HT6U5Z4J1P5 ZE10T1U4J4J1文档编码:CJ1H7T3K4O8 HT6U5Z4J1P5 ZE10T1U4J4
9、J1文档编码:CJ1H7T3K4O8 HT6U5Z4J1P5 ZE10T1U4J4J1文档编码:CJ1H7T3K4O8 HT6U5Z4J1P5 ZE10T1U4J4J1文档编码:CJ1H7T3K4O8 HT6U5Z4J1P5 ZE10T1U4J4J1文档编码:CJ1H7T3K4O8 HT6U5Z4J1P5 ZE10T1U4J4J1文档编码:CJ1H7T3K4O8 HT6U5Z4J1P5 ZE10T1U4J4J1文档编码:CJ1H7T3K4O8 HT6U5Z4J1P5 ZE10T1U4J4J1文档编码:CJ1H7T3K4O8 HT6U5Z4J1P5 ZE10T1U4J4J1文档编码:CJ1H7T
10、3K4O8 HT6U5Z4J1P5 ZE10T1U4J4J1文档编码:CJ1H7T3K4O8 HT6U5Z4J1P5 ZE10T1U4J4J1文档编码:CJ1H7T3K4O8 HT6U5Z4J1P5 ZE10T1U4J4J1文档编码:CJ1H7T3K4O8 HT6U5Z4J1P5 ZE10T1U4J4J1文档编码:CJ1H7T3K4O8 HT6U5Z4J1P5 ZE10T1U4J4J1文档编码:CJ1H7T3K4O8 HT6U5Z4J1P5 ZE10T1U4J4J1文档编码:CJ1H7T3K4O8 HT6U5Z4J1P5 ZE10T1U4J4J1文档编码:CJ1H7T3K4O8 HT6U5Z4
11、J1P5 ZE10T1U4J4J1文档编码:CJ1H7T3K4O8 HT6U5Z4J1P5 ZE10T1U4J4J1文档编码:CJ1H7T3K4O8 HT6U5Z4J1P5 ZE10T1U4J4J1文档编码:CJ1H7T3K4O8 HT6U5Z4J1P5 ZE10T1U4J4J1文档编码:CJ1H7T3K4O8 HT6U5Z4J1P5 ZE10T1U4J4J1文档编码:CJ1H7T3K4O8 HT6U5Z4J1P5 ZE10T1U4J4J17、CLCC 封装(ceramic leaded chip carrier)带引脚的陶瓷芯片载体，表面贴装型封装之一，引脚从封装的四个侧面引出，呈丁字形。带
12、有窗口的用于封装紫外线擦除型EPROM 以及带有EPROM 的微机电路等。此封装也称为QFJ、QFJ-G(见 QFJ)。8、COB 封装(chip on board)板上芯片封装，是裸芯片贴装技术之一，半导体芯片交接贴装在印刷线路板上，芯片与基板的电气连接用引线缝合方法实现，芯片与基板的电气连接用引线缝合方法实现，并用树脂覆盖以确保可*性。虽然COB 是最简单的裸芯片贴装技术，但它的封装密度远不如TAB 和倒片焊技术。9、DFP(dual flat package)双侧引脚扁平封装。是 SOP 的别称(见 SOP)。以前曾有此称法，现在已基本上不用。文档编码:CB4E9Z1U6B9 HH7Y9
13、V9Z4W3 ZM4Z1Y8B4L1文档编码:CB4E9Z1U6B9 HH7Y9V9Z4W3 ZM4Z1Y8B4L1文档编码:CB4E9Z1U6B9 HH7Y9V9Z4W3 ZM4Z1Y8B4L1文档编码:CB4E9Z1U6B9 HH7Y9V9Z4W3 ZM4Z1Y8B4L1文档编码:CB4E9Z1U6B9 HH7Y9V9Z4W3 ZM4Z1Y8B4L1文档编码:CB4E9Z1U6B9 HH7Y9V9Z4W3 ZM4Z1Y8B4L1文档编码:CB4E9Z1U6B9 HH7Y9V9Z4W3 ZM4Z1Y8B4L1文档编码:CB4E9Z1U6B9 HH7Y9V9Z4W3 ZM4Z1Y8B4L1文档
14、编码:CB4E9Z1U6B9 HH7Y9V9Z4W3 ZM4Z1Y8B4L1文档编码:CB4E9Z1U6B9 HH7Y9V9Z4W3 ZM4Z1Y8B4L1文档编码:CB4E9Z1U6B9 HH7Y9V9Z4W3 ZM4Z1Y8B4L1文档编码:CB4E9Z1U6B9 HH7Y9V9Z4W3 ZM4Z1Y8B4L1文档编码:CB4E9Z1U6B9 HH7Y9V9Z4W3 ZM4Z1Y8B4L1文档编码:CB4E9Z1U6B9 HH7Y9V9Z4W3 ZM4Z1Y8B4L1文档编码:CB4E9Z1U6B9 HH7Y9V9Z4W3 ZM4Z1Y8B4L1文档编码:CB4E9Z1U6B9 HH7Y9
15、V9Z4W3 ZM4Z1Y8B4L1文档编码:CB4E9Z1U6B9 HH7Y9V9Z4W3 ZM4Z1Y8B4L1文档编码:CB4E9Z1U6B9 HH7Y9V9Z4W3 ZM4Z1Y8B4L1文档编码:CB4E9Z1U6B9 HH7Y9V9Z4W3 ZM4Z1Y8B4L1文档编码:CB4E9Z1U6B9 HH7Y9V9Z4W3 ZM4Z1Y8B4L1文档编码:CB4E9Z1U6B9 HH7Y9V9Z4W3 ZM4Z1Y8B4L1文档编码:CB4E9Z1U6B9 HH7Y9V9Z4W3 ZM4Z1Y8B4L1文档编码:CB4E9Z1U6B9 HH7Y9V9Z4W3 ZM4Z1Y8B4L1文档
16、编码:CB4E9Z1U6B9 HH7Y9V9Z4W3 ZM4Z1Y8B4L1文档编码:CB4E9Z1U6B9 HH7Y9V9Z4W3 ZM4Z1Y8B4L1文档编码:CB4E9Z1U6B9 HH7Y9V9Z4W3 ZM4Z1Y8B4L1文档编码:CB4E9Z1U6B9 HH7Y9V9Z4W3 ZM4Z1Y8B4L1文档编码:CB4E9Z1U6B9 HH7Y9V9Z4W3 ZM4Z1Y8B4L1文档编码:CB4E9Z1U6B9 HH7Y9V9Z4W3 ZM4Z1Y8B4L1文档编码:CB4E9Z1U6B9 HH7Y9V9Z4W3 ZM4Z1Y8B4L1文档编码:CB4E9Z1U6B9 HH7Y9
17、V9Z4W3 ZM4Z1Y8B4L1文档编码:CB4E9Z1U6B9 HH7Y9V9Z4W3 ZM4Z1Y8B4L1文档编码:CB4E9Z1U6B9 HH7Y9V9Z4W3 ZM4Z1Y8B4L1文档编码:CB4E9Z1U6B9 HH7Y9V9Z4W3 ZM4Z1Y8B4L1文档编码:CB4E9Z1U6B9 HH7Y9V9Z4W3 ZM4Z1Y8B4L1文档编码:CB4E9Z1U6B9 HH7Y9V9Z4W3 ZM4Z1Y8B4L1文档编码:CB4E9Z1U6B9 HH7Y9V9Z4W3 ZM4Z1Y8B4L1文档编码:CB4E9Z1U6B9 HH7Y9V9Z4W3 ZM4Z1Y8B4L1文档
18、编码:CB4E9Z1U6B9 HH7Y9V9Z4W3 ZM4Z1Y8B4L1文档编码:CB4E9Z1U6B9 HH7Y9V9Z4W3 ZM4Z1Y8B4L1文档编码:CB4E9Z1U6B9 HH7Y9V9Z4W3 ZM4Z1Y8B4L1文档编码:CB4E9Z1U6B9 HH7Y9V9Z4W3 ZM4Z1Y8B4L1文档编码:CB4E9Z1U6B9 HH7Y9V9Z4W3 ZM4Z1Y8B4L1文档编码:CB4E9Z1U6B9 HH7Y9V9Z4W3 ZM4Z1Y8B4L1文档编码:CB4E9Z1U6B9 HH7Y9V9Z4W3 ZM4Z1Y8B4L1文档编码:CB4E9Z1U6B9 HH7Y9
19、V9Z4W3 ZM4Z1Y8B4L1文档编码:CB4E9Z1U6B9 HH7Y9V9Z4W3 ZM4Z1Y8B4L1文档编码:CB4E9Z1U6B9 HH7Y9V9Z4W3 ZM4Z1Y8B4L110、DIC(dual in-line ceramic package)陶瓷DIP(含玻璃密封)的别称(见 DIP).11、DIL(dual in-line)DIP 的别称(见 DIP)。欧洲半导体厂家多用此名称。12、DIP(dual in-line package)双列直插式封装。插装型封装之一，引脚从封装两侧引出，封装材料有塑料和陶瓷两种。DIP 是最普及的插装型封装，应用范围包括标准逻辑IC，
20、存贮器LSI，微机电路等。引脚中心距2.54mm，引脚数从6 到 64。封装宽度通常为15.2mm。有的把宽度为 7.52mm 和 10.16mm 的封装分别称为skinny DIP 和 slim DIP(窄体型DIP)。但多数情况下并不加区分，只简单地统称为DIP。另外，用低熔点玻璃密封的陶瓷DIP 也称为cerdip(见 cerdip)。13、DSO(dual small out-lint)双侧引脚小外形封装。SOP 的别称(见 SOP)。部分半导体厂家采用此名称。文档编码:CB4E9Z1U6B9 HH7Y9V9Z4W3 ZM4Z1Y8B4L1文档编码:CB4E9Z1U6B9 HH7Y9V
21、9Z4W3 ZM4Z1Y8B4L1文档编码:CB4E9Z1U6B9 HH7Y9V9Z4W3 ZM4Z1Y8B4L1文档编码:CB4E9Z1U6B9 HH7Y9V9Z4W3 ZM4Z1Y8B4L1文档编码:CB4E9Z1U6B9 HH7Y9V9Z4W3 ZM4Z1Y8B4L1文档编码:CB4E9Z1U6B9 HH7Y9V9Z4W3 ZM4Z1Y8B4L1文档编码:CB4E9Z1U6B9 HH7Y9V9Z4W3 ZM4Z1Y8B4L1文档编码:CB4E9Z1U6B9 HH7Y9V9Z4W3 ZM4Z1Y8B4L1文档编码:CB4E9Z1U6B9 HH7Y9V9Z4W3 ZM4Z1Y8B4L1文档编
22、码:CB4E9Z1U6B9 HH7Y9V9Z4W3 ZM4Z1Y8B4L1文档编码:CB4E9Z1U6B9 HH7Y9V9Z4W3 ZM4Z1Y8B4L1文档编码:CB4E9Z1U6B9 HH7Y9V9Z4W3 ZM4Z1Y8B4L1文档编码:CB4E9Z1U6B9 HH7Y9V9Z4W3 ZM4Z1Y8B4L1文档编码:CB4E9Z1U6B9 HH7Y9V9Z4W3 ZM4Z1Y8B4L1文档编码:CB4E9Z1U6B9 HH7Y9V9Z4W3 ZM4Z1Y8B4L1文档编码:CB4E9Z1U6B9 HH7Y9V9Z4W3 ZM4Z1Y8B4L1文档编码:CB4E9Z1U6B9 HH7Y9V
23、9Z4W3 ZM4Z1Y8B4L1文档编码:CB4E9Z1U6B9 HH7Y9V9Z4W3 ZM4Z1Y8B4L1文档编码:CB4E9Z1U6B9 HH7Y9V9Z4W3 ZM4Z1Y8B4L1文档编码:CB4E9Z1U6B9 HH7Y9V9Z4W3 ZM4Z1Y8B4L1文档编码:CB4E9Z1U6B9 HH7Y9V9Z4W3 ZM4Z1Y8B4L1文档编码:CB4E9Z1U6B9 HH7Y9V9Z4W3 ZM4Z1Y8B4L1文档编码:CB4E9Z1U6B9 HH7Y9V9Z4W3 ZM4Z1Y8B4L1文档编码:CB4E9Z1U6B9 HH7Y9V9Z4W3 ZM4Z1Y8B4L1文档编
24、码:CB4E9Z1U6B9 HH7Y9V9Z4W3 ZM4Z1Y8B4L1文档编码:CB4E9Z1U6B9 HH7Y9V9Z4W3 ZM4Z1Y8B4L1文档编码:CB4E9Z1U6B9 HH7Y9V9Z4W3 ZM4Z1Y8B4L1文档编码:CB4E9Z1U6B9 HH7Y9V9Z4W3 ZM4Z1Y8B4L1文档编码:CB4E9Z1U6B9 HH7Y9V9Z4W3 ZM4Z1Y8B4L1文档编码:CB4E9Z1U6B9 HH7Y9V9Z4W3 ZM4Z1Y8B4L1文档编码:CB4E9Z1U6B9 HH7Y9V9Z4W3 ZM4Z1Y8B4L1文档编码:CB4E9Z1U6B9 HH7Y9V
25、9Z4W3 ZM4Z1Y8B4L1文档编码:CB4E9Z1U6B9 HH7Y9V9Z4W3 ZM4Z1Y8B4L1文档编码:CB4E9Z1U6B9 HH7Y9V9Z4W3 ZM4Z1Y8B4L1文档编码:CB4E9Z1U6B9 HH7Y9V9Z4W3 ZM4Z1Y8B4L1文档编码:CB4E9Z1U6B9 HH7Y9V9Z4W3 ZM4Z1Y8B4L1文档编码:CB4E9Z1U6B9 HH7Y9V9Z4W3 ZM4Z1Y8B4L1文档编码:CB4E9Z1U6B9 HH7Y9V9Z4W3 ZM4Z1Y8B4L1文档编码:CB4E9Z1U6B9 HH7Y9V9Z4W3 ZM4Z1Y8B4L1文档编
26、码:CB4E9Z1U6B9 HH7Y9V9Z4W3 ZM4Z1Y8B4L1文档编码:CB4E9Z1U6B9 HH7Y9V9Z4W3 ZM4Z1Y8B4L1文档编码:CB4E9Z1U6B9 HH7Y9V9Z4W3 ZM4Z1Y8B4L1文档编码:CB4E9Z1U6B9 HH7Y9V9Z4W3 ZM4Z1Y8B4L1文档编码:CB4E9Z1U6B9 HH7Y9V9Z4W3 ZM4Z1Y8B4L1文档编码:CB4E9Z1U6B9 HH7Y9V9Z4W3 ZM4Z1Y8B4L1文档编码:CB4E9Z1U6B9 HH7Y9V9Z4W3 ZM4Z1Y8B4L1文档编码:CB4E9Z1U6B9 HH7Y9V
27、9Z4W3 ZM4Z1Y8B4L1文档编码:CB4E9Z1U6B9 HH7Y9V9Z4W3 ZM4Z1Y8B4L114、DICP(dual tape carrier package)双侧引脚带载封装。TCP(带载封装)之一。引脚制作在绝缘带上并从封装两侧引出。由于利用的是TAB(自 动带载焊接)技术，封装外形非常薄。常用于液晶显示驱动LSI，但多数为定制品。另外，0.5mm 厚的存储器LSI 簿形封装正处于开发阶段。在日本，按照EIAJ(日本电子机械工业)会标准规定，将 DICP 命名为 DTP。15、DIP(dual tape carrier package)同上。日本电子机械工业会标准对D
28、TCP 的命名(见 DTCP)。16、FP(flat package)扁平封装。表面贴装型封装之一。QFP 或 SOP(见 QFP 和 SOP)的别称。部分半导体厂家采用此名称。17、Flip-chip倒焊芯片。裸芯片封装技术之一，在LSI 芯片的电极区制作好金属凸点，然后把金属凸点与印刷基板上的电极区进行压焊连接。封装的占有面积基本上与芯片尺寸相同。是所有封装技术中体积最小、最薄的一种。但如果基板的热膨胀系数与LSI 芯片不同，就会在接合处产生反应，从而影响连接的可靠性。因此必须用树脂来加固LSI 芯片，并使用热膨胀系数基本相同的基板材料。其中SiS 756 北桥芯片采用最新的Flip-ch
29、ip 封装，全面支持AMD 文档编码:CB4E9Z1U6B9 HH7Y9V9Z4W3 ZM4Z1Y8B4L1文档编码:CB4E9Z1U6B9 HH7Y9V9Z4W3 ZM4Z1Y8B4L1文档编码:CB4E9Z1U6B9 HH7Y9V9Z4W3 ZM4Z1Y8B4L1文档编码:CB4E9Z1U6B9 HH7Y9V9Z4W3 ZM4Z1Y8B4L1文档编码:CB4E9Z1U6B9 HH7Y9V9Z4W3 ZM4Z1Y8B4L1文档编码:CB4E9Z1U6B9 HH7Y9V9Z4W3 ZM4Z1Y8B4L1文档编码:CB4E9Z1U6B9 HH7Y9V9Z4W3 ZM4Z1Y8B4L1文档编码:C
30、B4E9Z1U6B9 HH7Y9V9Z4W3 ZM4Z1Y8B4L1文档编码:CB4E9Z1U6B9 HH7Y9V9Z4W3 ZM4Z1Y8B4L1文档编码:CB4E9Z1U6B9 HH7Y9V9Z4W3 ZM4Z1Y8B4L1文档编码:CB4E9Z1U6B9 HH7Y9V9Z4W3 ZM4Z1Y8B4L1文档编码:CB4E9Z1U6B9 HH7Y9V9Z4W3 ZM4Z1Y8B4L1文档编码:CB4E9Z1U6B9 HH7Y9V9Z4W3 ZM4Z1Y8B4L1文档编码:CB4E9Z1U6B9 HH7Y9V9Z4W3 ZM4Z1Y8B4L1文档编码:CB4E9Z1U6B9 HH7Y9V9Z4
31、W3 ZM4Z1Y8B4L1文档编码:CB4E9Z1U6B9 HH7Y9V9Z4W3 ZM4Z1Y8B4L1文档编码:CB4E9Z1U6B9 HH7Y9V9Z4W3 ZM4Z1Y8B4L1文档编码:CB4E9Z1U6B9 HH7Y9V9Z4W3 ZM4Z1Y8B4L1文档编码:CB4E9Z1U6B9 HH7Y9V9Z4W3 ZM4Z1Y8B4L1文档编码:CB4E9Z1U6B9 HH7Y9V9Z4W3 ZM4Z1Y8B4L1文档编码:CB4E9Z1U6B9 HH7Y9V9Z4W3 ZM4Z1Y8B4L1文档编码:CB4E9Z1U6B9 HH7Y9V9Z4W3 ZM4Z1Y8B4L1文档编码:C
32、B4E9Z1U6B9 HH7Y9V9Z4W3 ZM4Z1Y8B4L1文档编码:CB4E9Z1U6B9 HH7Y9V9Z4W3 ZM4Z1Y8B4L1文档编码:CB4E9Z1U6B9 HH7Y9V9Z4W3 ZM4Z1Y8B4L1文档编码:CB4E9Z1U6B9 HH7Y9V9Z4W3 ZM4Z1Y8B4L1文档编码:CB4E9Z1U6B9 HH7Y9V9Z4W3 ZM4Z1Y8B4L1文档编码:CB4E9Z1U6B9 HH7Y9V9Z4W3 ZM4Z1Y8B4L1文档编码:CB4E9Z1U6B9 HH7Y9V9Z4W3 ZM4Z1Y8B4L1文档编码:CB4E9Z1U6B9 HH7Y9V9Z4
33、W3 ZM4Z1Y8B4L1文档编码:CB4E9Z1U6B9 HH7Y9V9Z4W3 ZM4Z1Y8B4L1文档编码:CB4E9Z1U6B9 HH7Y9V9Z4W3 ZM4Z1Y8B4L1文档编码:CB4E9Z1U6B9 HH7Y9V9Z4W3 ZM4Z1Y8B4L1文档编码:CB4E9Z1U6B9 HH7Y9V9Z4W3 ZM4Z1Y8B4L1文档编码:CB4E9Z1U6B9 HH7Y9V9Z4W3 ZM4Z1Y8B4L1文档编码:CB4E9Z1U6B9 HH7Y9V9Z4W3 ZM4Z1Y8B4L1文档编码:CB4E9Z1U6B9 HH7Y9V9Z4W3 ZM4Z1Y8B4L1文档编码:C
34、B4E9Z1U6B9 HH7Y9V9Z4W3 ZM4Z1Y8B4L1文档编码:CB4E9Z1U6B9 HH7Y9V9Z4W3 ZM4Z1Y8B4L1文档编码:CB4E9Z1U6B9 HH7Y9V9Z4W3 ZM4Z1Y8B4L1文档编码:CB4E9Z1U6B9 HH7Y9V9Z4W3 ZM4Z1Y8B4L1文档编码:CB4E9Z1U6B9 HH7Y9V9Z4W3 ZM4Z1Y8B4L1文档编码:CB4E9Z1U6B9 HH7Y9V9Z4W3 ZM4Z1Y8B4L1文档编码:CB4E9Z1U6B9 HH7Y9V9Z4W3 ZM4Z1Y8B4L1文档编码:CB4E9Z1U6B9 HH7Y9V9Z4
35、W3 ZM4Z1Y8B4L1文档编码:CB4E9Z1U6B9 HH7Y9V9Z4W3 ZM4Z1Y8B4L1文档编码:CB4E9Z1U6B9 HH7Y9V9Z4W3 ZM4Z1Y8B4L1文档编码:CB4E9Z1U6B9 HH7Y9V9Z4W3 ZM4Z1Y8B4L1Athlon 64/FX中央处理器。支持PCI Express X16 接口，提供显卡最高8GB/s 双向传输带宽。支持最高HyperTransport Technology，最高 2000MT/s MHz的传输带宽。内建矽统科技独家Advanced HyperStreaming Technology，MuTIOL 1G Tech
36、nology。18、FQFP(fine pitch quad flat package)小引脚中心距QFP。通常指引脚中心距小于0.65mm 的 QFP(见 QFP)。部分导导体厂家采用此名称。塑料四边引出扁平封装PQFP(Plastic Quad Flat Package)PQFP 的封装形式最为普遍。其芯片引脚之间距离很小，引脚很细，很多大规模或超大集成电路都采用这种封装形式，引脚数量一般都在100 个以上。Intel 系列CPU 中 80286、80386 和某些 486 主板芯片采用这种封装形式。此种封装形式的芯片必须采用SMT 技术(表面安装设备)将芯片与电路板焊接起来。采用SMT
37、技术安装的芯片不必在电路板上打孔，一般在电路板表面上有设计好的相应引脚的焊点。将芯片各脚对准相应的焊点，即可实现与主板的焊接。用这种方法焊上去的芯片，如果不用专用工具是很难拆卸下来的。SMT 技术也被广泛的使用在芯片焊接领域，此后很多高级的封装技术都需要使用SMT 焊接。以下是一颗AMD 的 QFP 封装的 286 处理器芯片。0.5mm 焊区中心距，208根 I/O 引脚，外形尺寸28 28mm，芯片尺寸10 10mm，则芯片面积/封装面积=10 10/28 28=1:7.8，由此可见QFP 比 DIP 的封装尺寸大大减小了。PQFP 封装的主板声卡芯片19、CPAC(globe top p
38、ad array carrier)文档编码:CB4E9Z1U6B9 HH7Y9V9Z4W3 ZM4Z1Y8B4L1文档编码:CB4E9Z1U6B9 HH7Y9V9Z4W3 ZM4Z1Y8B4L1文档编码:CB4E9Z1U6B9 HH7Y9V9Z4W3 ZM4Z1Y8B4L1文档编码:CB4E9Z1U6B9 HH7Y9V9Z4W3 ZM4Z1Y8B4L1文档编码:CB4E9Z1U6B9 HH7Y9V9Z4W3 ZM4Z1Y8B4L1文档编码:CB4E9Z1U6B9 HH7Y9V9Z4W3 ZM4Z1Y8B4L1文档编码:CB4E9Z1U6B9 HH7Y9V9Z4W3 ZM4Z1Y8B4L1文档编
39、码:CB4E9Z1U6B9 HH7Y9V9Z4W3 ZM4Z1Y8B4L1文档编码:CB4E9Z1U6B9 HH7Y9V9Z4W3 ZM4Z1Y8B4L1文档编码:CB4E9Z1U6B9 HH7Y9V9Z4W3 ZM4Z1Y8B4L1文档编码:CB4E9Z1U6B9 HH7Y9V9Z4W3 ZM4Z1Y8B4L1文档编码:CB4E9Z1U6B9 HH7Y9V9Z4W3 ZM4Z1Y8B4L1文档编码:CB4E9Z1U6B9 HH7Y9V9Z4W3 ZM4Z1Y8B4L1文档编码:CB4E9Z1U6B9 HH7Y9V9Z4W3 ZM4Z1Y8B4L1文档编码:CB4E9Z1U6B9 HH7Y9V
40、9Z4W3 ZM4Z1Y8B4L1文档编码:CB4E9Z1U6B9 HH7Y9V9Z4W3 ZM4Z1Y8B4L1文档编码:CB4E9Z1U6B9 HH7Y9V9Z4W3 ZM4Z1Y8B4L1文档编码:CB4E9Z1U6B9 HH7Y9V9Z4W3 ZM4Z1Y8B4L1文档编码:CB4E9Z1U6B9 HH7Y9V9Z4W3 ZM4Z1Y8B4L1文档编码:CB4E9Z1U6B9 HH7Y9V9Z4W3 ZM4Z1Y8B4L1文档编码:CB4E9Z1U6B9 HH7Y9V9Z4W3 ZM4Z1Y8B4L1文档编码:CB4E9Z1U6B9 HH7Y9V9Z4W3 ZM4Z1Y8B4L1文档编
41、码:CB4E9Z1U6B9 HH7Y9V9Z4W3 ZM4Z1Y8B4L1文档编码:CB4E9Z1U6B9 HH7Y9V9Z4W3 ZM4Z1Y8B4L1文档编码:CB4E9Z1U6B9 HH7Y9V9Z4W3 ZM4Z1Y8B4L1文档编码:CB4E9Z1U6B9 HH7Y9V9Z4W3 ZM4Z1Y8B4L1文档编码:CB4E9Z1U6B9 HH7Y9V9Z4W3 ZM4Z1Y8B4L1文档编码:CB4E9Z1U6B9 HH7Y9V9Z4W3 ZM4Z1Y8B4L1文档编码:CB4E9Z1U6B9 HH7Y9V9Z4W3 ZM4Z1Y8B4L1文档编码:CB4E9Z1U6B9 HH7Y9V
42、9Z4W3 ZM4Z1Y8B4L1文档编码:CB4E9Z1U6B9 HH7Y9V9Z4W3 ZM4Z1Y8B4L1文档编码:CB4E9Z1U6B9 HH7Y9V9Z4W3 ZM4Z1Y8B4L1文档编码:CB4E9Z1U6B9 HH7Y9V9Z4W3 ZM4Z1Y8B4L1文档编码:CB4E9Z1U6B9 HH7Y9V9Z4W3 ZM4Z1Y8B4L1文档编码:CB4E9Z1U6B9 HH7Y9V9Z4W3 ZM4Z1Y8B4L1文档编码:CB4E9Z1U6B9 HH7Y9V9Z4W3 ZM4Z1Y8B4L1文档编码:CB4E9Z1U6B9 HH7Y9V9Z4W3 ZM4Z1Y8B4L1文档编
43、码:CB4E9Z1U6B9 HH7Y9V9Z4W3 ZM4Z1Y8B4L1文档编码:CB4E9Z1U6B9 HH7Y9V9Z4W3 ZM4Z1Y8B4L1文档编码:CB4E9Z1U6B9 HH7Y9V9Z4W3 ZM4Z1Y8B4L1文档编码:CB4E9Z1U6B9 HH7Y9V9Z4W3 ZM4Z1Y8B4L1文档编码:CB4E9Z1U6B9 HH7Y9V9Z4W3 ZM4Z1Y8B4L1文档编码:CB4E9Z1U6B9 HH7Y9V9Z4W3 ZM4Z1Y8B4L1文档编码:CB4E9Z1U6B9 HH7Y9V9Z4W3 ZM4Z1Y8B4L1文档编码:CB4E9Z1U6B9 HH7Y9V
44、9Z4W3 ZM4Z1Y8B4L1文档编码:CB4E9Z1U6B9 HH7Y9V9Z4W3 ZM4Z1Y8B4L1文档编码:CB4E9Z1U6B9 HH7Y9V9Z4W3 ZM4Z1Y8B4L1文档编码:CB4E9Z1U6B9 HH7Y9V9Z4W3 ZM4Z1Y8B4L1美国Motorola 公司对BGA 的别称(见 BGA)。20、CQFP 軍用晶片陶瓷平版封裝(Ceramic Quad Flat-pack Package)右邊這顆晶片為一種軍用晶片封裝(CQFP)，這是封裝還沒被放入晶體以前的樣子。這種封裝在軍用品以及航太工業用晶片才有機會見到。晶片槽旁邊有厚厚的黃金隔層(有高起來，照片
45、上不明顯)用來防止輻射及其他干擾。外圍有螺絲孔可以將晶片牢牢固定在主機板上。而最有趣的就是四周的鍍金針腳，這種設計可以大大減少晶片封裝的厚度並提供極佳的散熱。21、H-(with heat sink)表示带散热器的标记。例如，HSOP 表示带散热器的SOP。22、Pin Grid Array(Surface Mount Type)文档编码:CB4E9Z1U6B9 HH7Y9V9Z4W3 ZM4Z1Y8B4L1文档编码:CB4E9Z1U6B9 HH7Y9V9Z4W3 ZM4Z1Y8B4L1文档编码:CB4E9Z1U6B9 HH7Y9V9Z4W3 ZM4Z1Y8B4L1文档编码:CB4E9Z1U6
46、B9 HH7Y9V9Z4W3 ZM4Z1Y8B4L1文档编码:CB4E9Z1U6B9 HH7Y9V9Z4W3 ZM4Z1Y8B4L1文档编码:CB4E9Z1U6B9 HH7Y9V9Z4W3 ZM4Z1Y8B4L1文档编码:CB4E9Z1U6B9 HH7Y9V9Z4W3 ZM4Z1Y8B4L1文档编码:CB4E9Z1U6B9 HH7Y9V9Z4W3 ZM4Z1Y8B4L1文档编码:CB4E9Z1U6B9 HH7Y9V9Z4W3 ZM4Z1Y8B4L1文档编码:CB4E9Z1U6B9 HH7Y9V9Z4W3 ZM4Z1Y8B4L1文档编码:CB4E9Z1U6B9 HH7Y9V9Z4W3 ZM4Z1
47、Y8B4L1文档编码:CB4E9Z1U6B9 HH7Y9V9Z4W3 ZM4Z1Y8B4L1文档编码:CB4E9Z1U6B9 HH7Y9V9Z4W3 ZM4Z1Y8B4L1文档编码:CB4E9Z1U6B9 HH7Y9V9Z4W3 ZM4Z1Y8B4L1文档编码:CB4E9Z1U6B9 HH7Y9V9Z4W3 ZM4Z1Y8B4L1文档编码:CB4E9Z1U6B9 HH7Y9V9Z4W3 ZM4Z1Y8B4L1文档编码:CB4E9Z1U6B9 HH7Y9V9Z4W3 ZM4Z1Y8B4L1文档编码:CB4E9Z1U6B9 HH7Y9V9Z4W3 ZM4Z1Y8B4L1文档编码:CB4E9Z1U6
48、B9 HH7Y9V9Z4W3 ZM4Z1Y8B4L1文档编码:CB4E9Z1U6B9 HH7Y9V9Z4W3 ZM4Z1Y8B4L1文档编码:CB4E9Z1U6B9 HH7Y9V9Z4W3 ZM4Z1Y8B4L1文档编码:CB4E9Z1U6B9 HH7Y9V9Z4W3 ZM4Z1Y8B4L1文档编码:CB4E9Z1U6B9 HH7Y9V9Z4W3 ZM4Z1Y8B4L1文档编码:CB4E9Z1U6B9 HH7Y9V9Z4W3 ZM4Z1Y8B4L1文档编码:CB4E9Z1U6B9 HH7Y9V9Z4W3 ZM4Z1Y8B4L1文档编码:CB4E9Z1U6B9 HH7Y9V9Z4W3 ZM4Z1
49、Y8B4L1文档编码:CB4E9Z1U6B9 HH7Y9V9Z4W3 ZM4Z1Y8B4L1文档编码:CB4E9Z1U6B9 HH7Y9V9Z4W3 ZM4Z1Y8B4L1文档编码:CB4E9Z1U6B9 HH7Y9V9Z4W3 ZM4Z1Y8B4L1文档编码:CB4E9Z1U6B9 HH7Y9V9Z4W3 ZM4Z1Y8B4L1文档编码:CB4E9Z1U6B9 HH7Y9V9Z4W3 ZM4Z1Y8B4L1文档编码:CB4E9Z1U6B9 HH7Y9V9Z4W3 ZM4Z1Y8B4L1文档编码:CB4E9Z1U6B9 HH7Y9V9Z4W3 ZM4Z1Y8B4L1文档编码:CB4E9Z1U6
50、B9 HH7Y9V9Z4W3 ZM4Z1Y8B4L1文档编码:CB4E9Z1U6B9 HH7Y9V9Z4W3 ZM4Z1Y8B4L1文档编码:CB4E9Z1U6B9 HH7Y9V9Z4W3 ZM4Z1Y8B4L1文档编码:CB4E9Z1U6B9 HH7Y9V9Z4W3 ZM4Z1Y8B4L1文档编码:CB4E9Z1U6B9 HH7Y9V9Z4W3 ZM4Z1Y8B4L1文档编码:CB4E9Z1U6B9 HH7Y9V9Z4W3 ZM4Z1Y8B4L1文档编码:CB4E9Z1U6B9 HH7Y9V9Z4W3 ZM4Z1Y8B4L1文档编码:CB4E9Z1U6B9 HH7Y9V9Z4W3 ZM4Z1