《ipc印制电路板.doc》由会员分享，可在线阅读，更多相关《ipc印制电路板.doc（5页珍藏版）》请在taowenge.com淘文阁网|工程机械CAD图纸|机械工程制图|CAD装配图下载|SolidWorks_CaTia_CAD_UG_PROE_设计图分享下载上搜索。
1、印 制 电 路 板（Printed Circuit Boards） IPC-M-105Rigid Printed Board Manual 刚性印制板设计手册IPC-D-325ADocumentation Requirements for Printed Boards 印制板设计文件图册要求IPC-PE-740ATroubleshooting for Printed Board Manufacture and Assembly印制板制造和组装的故障排除IPC-MB-380Guidelines for Molded Interconnection Devices 模压互连器件导则IPC-D-32
2、6AInformation Requirements for Manufacturing Printed Circuit Boards and Other Electronic Assemblies印制板制造和其它电子组装的信息要求规范IPC-6010 SeriesIPC-6010 Qualification and Performance SeriesIPC-6010印制电路板质量标准和性能规范系列手册IPC-6011Generic Performance Specification for Printed Boards 印制板通用性能规范IPC-6012BQualification and
3、 Performance Specification for Rigid Printed Boards刚性板的合格和性能规范要求IPC-6015Qualification & Performance Specification for Organic Multichip Module (MCM-L) Mounting and Interconnections 有机多芯片模块(MCM-L)安装及互连结构的鉴定与性能规范IPC-6016Qualification & Performance Specification for High Density Interconnect (HDI) Laye
4、rs or Boards 高密度互连(HDI)层或印制板的鉴定与性能规范IPC-6018AMicrowave End Product Board Inspection and Tech 微波成品印制板的检验和测试 IPC-A-600GAcceptability of Printed Boards 印制板验收条件IPC-QE-605A Printed Board Quality Evaluation Handbook 印制板质量评价IPC-PWB-EVAL-CHPrinted Circuit Board Defect Evaluation Chart印制板缺陷评估图表IPC-HM-860Spec
5、ification for Multilayer Hybrid Circuits多层混合电路规范IPC-TF-870Qualification and Performance of Polymer Thick Film Printed Boards聚合物厚膜印制板的鉴定与性能IPC-ML-960Qualification and Performance Specification for Mass Lamination Panels for Multilayer printed Boards 多层印制板的鉴定与性能规范用预制内层在制板的鉴定与性能规范IPC-TR-481Results of M
6、ultilayer Tests Program Round Robin多层印制板联合试验计划结果IPC-TR-551Quality Assessment of Printed Boards Used for Mounting and Interconnecting Electronic Components 用于电子元件安装与互连的印制板质量评价IPC-TR-579Round Robin Reliability Evaluation of Small Diameter Plated Through Holes in PCBs 印制板中小直径镀覆孔可靠性评价联合试验IPC-4552Specifi
7、cation for Electroless Nickel/Immersion Gold(ENIG) Plating for Printed Circuit Boards 印制电路板表面非电镀镍/沉金规范IPC-DR-572Drilling Guidelines for Printed Boards 印制板钻孔导则IT-95080Improvements/Alternatives to Mechanical Drilling of PCB Vias印制板通孔机加工方案的改进和优选手册IPC-NC-349Computer Numerical Control Formatting for Dril
8、lers and Routers钻床和铣床用计算机数字控制格式IPC-SM-839Pre & Post Solder Mask Application Cleaning Guidelines施加阻焊前及施加后清洗导则IPC-HDI-1High Density Interconnect Microvia Technology Compendium高密度(HDI)互连微通孔技术纲要IPC/JPCA-4104Specification for High Density Interconnect (HDI) and Microvia Materials高密度互连(HDI)及微导通孔材料规范IPC-60
9、16Qualification & Performance Specification for High Density Interconnect (HDI) Layers or Boards 高密度互连(HDI)层或印制板的鉴定与性能规范IPC/JPCA-6801IPC/JPCA Terms & Definitions, Test Methods, and Design Examples for Build-Up/High Density Interconnection 积层/高密度互连的术语和定义、试验方法与设计例IPC-DD-135Qualification Testing for De
10、posited Organic Interlayer Dielectric Materials for Multichip Modules 多芯片组件内层有机绝缘材料的鉴定试验IT-96060High Density PCB Microvia Evaluation (October Project), Phase I, Round 1高密度印制板微通孔评价指标手册, 第一期第一版IT-97071High Density PCB Microvia Evaluation, Phase I, Round 2高密度印制板微通孔评价指标手册, 第一期第二版IT-30101High Density PCB
11、 Microvia Evaluation, Phase I, Round 3高密度印制板微通孔评价指标手册, 第一期第三版IT-98123Microvia Manufacturing Technology Cost Analysis Report微通孔制作技术成本核算报告IPC-2141AControlled Impedance Circuit Boards & High Speed Logic Design控制阻抗电路板与高速逻辑设计IPC-2251Design Guide for the Packaging of High Speed Electronic Circuits高速电子电路封装
12、的设计指南IPC-2252Design Guide for RF/Microwave Circuit Boards 射频/微波电路板设计指南IPC-4103Specification for Base Materials for High Speed/High Frequency Applications 高速高频用基材规范IPC-6018AMicrowave End Product Board Inspection and Test 微波成品印制板的检验和测试IPC-D-317ADesign Guidelines for Electronic Packaging Utilizing High
13、 Speed Techniques采用高速技术电子封装设计导则IPC-M-102Flexible Circuits Compendium 挠性电路纲要IPC-4202Flexible Base Dielectrics for Use in Flexible Printed Circuitry挠性印制线路用挠性绝缘基底材料IPC-4203Adhesive Coated Dielectric Films for Use as Cover Sheets for Flexible Printed Circuitry and Flexible Adhesive Bonding Films 挠性印制线路覆
14、盖层用涂粘接剂绝缘薄膜IPC-4204Flexible Metal-Clad Dielectrics for Use in Fabrication of Flexible Printed Circuitry挠性金属箔去电应用于柔性电路组装IPC-6013AQualification & Performance Specification for Flexible Printed Boards挠性印制板的鉴定与性能规范IPC/JPCA-6202IPC/JPCA Performance Guide Manual for Single- and Double-Sided Flexible Print
15、ed Wiring Boards IPC/JPCA单双面挠性印制板性能手册IPC-FA-251Guidelines for Assembly of Single- and Double-Sided Flex Circuits单面和双面挠性电路组装导则IPC-FC-234Composite Metallic Materials Specification for Printed Wiring Boards印制线路板复合金属材料规范IPC-M-107Standards for Printed Board Materials Manual 印制板材料标准手册IPC-MI-660Incoming In
16、spection of Raw Materials Manual 原材料接收检验手册IPC-4101ASpecifications for Base Materials for Rigid and Multilayer Printed Boards刚性及多层印制板用基材规范IPC-4121Guidelines for Selecting Core Construction for Multilayer Printed Wiring Board Applications 多层印制板用芯板结构选择导则IPC-4562Metal Foil for Printed Wiring Application
17、s 印制线路用金属箔IPC-CF-148AResin Coated Metal for Printed Boards 印制板用涂树脂金属箔IPC-CF-152BComposite Metallic Materials Specification for Printed Wiring Boards印制线路板复合金属材料规范IPC-TR-482New Developments in Thin Copper Foils 薄铜箔的新发展IPC-TR-484Results of IPC Copper Foil Ductility Round Robin StudyIPC铜箔延展性联合研究结果 IPC-T
18、R-485Results of Copper Foil Rupture Strength Test Round Robin Study铜箔断裂强度试验联合研究结果IPC-4412Specification for Finished Fabric Woven from ”E” Glass for Printed Boards“E”类精纺玻璃纤维层印制板技术规范IPC-4130Specification & Characterization Methods for Nonwoven E Glass MaterialsE 玻璃纤维非织布材料规范及性能确定方法IPC-4110Specification
19、 and Characterization Methods for Nonwoven Cellulose Based Paper for Printed Boards印制板用纤维纸规范及性能确定方法IPC-4411-ASpecification and Characterization Methods for Non-Woven Para-Aramid Reinforcement聚芳基酰胺非织布规范及性能确定方法IPC-SG-141Specification for Finished Fabric Woven from S Glass for Printed Boards印制板用经处理S玻璃纤
20、维织物规范IPC-A-142Specification for Finished Fabric Woven from Aramid for Printed Boards印制板用经处理聚芳酰胺纤维编织物规范IPC-QF-143Specification for Finished Fabric Woven from Quartz (Pure Fused Silica) for Printed Boards 印制板用经处理石英（熔融纯氧化硅）纤维编织物规范IPC-2524PWB Fabrication Data Quality Rating System 印制板制造数据质量定级体系IPC-9151A
21、Printed Board Process, Capability, Quality and Relative Reliability Benchmark Test Standard and Database印制板工艺, 容量, 质量,可靠性试验标准和数据库IPC-9191General Guidelines for Implementation of Statistical Process Control (SPC) 实施统计过程控制(SPC)的通用导则IPC-9199Statistical Process Control (SPC) Quality Rating 统计分析控制IPC-925
22、2Guidelines and Requirements for Electrical Testing of Unpopulated Printed Boards 未组装印制板电测试要求和指南IT-97061PWB Hole to Land Misregistration: Causes and Reliability印制线路板通孔与焊盘的错位: 原因和可靠性IT-98103Reliability of Misregistered and Landless Innerlayer Interconnects in Thick Panels 多层板内部无焊盘层互连错位的可靠性IPC-MS-810G
23、uidelines for High Volume Microsection 大批量显微剖切导则IPC-QL-653ACertification of Facilities that Inspect/Test Printed Boards, Components & Materials 印制板、元器件及材料检验试验设备的认证IPC-TR-483Dimensional Stability Testing of Thin Laminates-Report on Phase 1 & 2 International Round Robin Test薄层压板尺寸稳走性试-国际联合试验计划I阶段及II阶段报告IPC-TR-486Round Robin Study to Correlate IST & Microsectioning Evaluations for Inner-Layer Separation 内层分离的互连应力测试(IST)与显微剖切相关性联合研究