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1、SMT Manufacture process Write by MOEBG/SMTManufacture Engineer Yx lan TEL:3417SDcardsocketSOPBGAQFNConnecterCrystalDSC-Main boardMain component-BGA chipsetDSC-FPC board Optical component-CCDSMT IntroductionAutomaticSMTline:71linesLocation:Cbuild-Floor242Dbuild-Floor3,42Ebuild-Floor2,3,4Linechange：30
2、minsProductionEfficiency：99.5%Throughrate:88%DefectPPM:50PPMLostrate:0.4%PCBAaverageoutput:400K/monthControl by KPIControl by KPISMT processPCBA Flow ChartPCBPartsPrinterMountReflowSMTS.M.T:SurfaceMountTechnologyWhatisSMT:GoodPrint,and Mount Good!DIPSONY SIP-950SONY SIP-300SONY SVP-2000TypeStencil s
3、ize(mm)Print directionWipePCB size(mm)PCB Thickness(mm)Print precision(m)SVP-2000650*550*30Y-dir.Automatic(Wet,Dry&Vacuum)(W)50*(D)50 (W)250*(D)3300.31.625SIP-950650*550*30X-dir.Automatic(Wet,Dry&Vacuum)(W)50*(D)70 (W)460*(D)3600.32.512SIP-300650*550*30Y-dir.Automatic(Wet,Dry&Vacuum)(W)50*(D)50 (W)4
4、60*(D)5100.43.020SMT EquipmentPrinter(SONY)Solder paste vendor(Lead-free type)Photo SuppliersSenjuSenjuTypeM705-GRN360-K2-VL23-BLT5-T7FPowder alloySn 96.5/Ag 3.0/Cu 0.5Sn 42/Ag 1.0/Bi 57Melt point217138204Powder size25-36m25-36mFlux content10.5-12.5%10.0%Viscosity(pa.s)200200Stencil design ruleTypeP
5、recision(mm)Speed(sec)Component sizeComponent height(mm)Min Pitch(mm)AnglePCB size(mm)PCB height(mm)E-1000/11000.060.17 Chip 0402-12m1 6 0.3 0-36050*50-460*3600.5-2.6F-1300.06 0.139 Chip 0201-12m1 6 0.3 0-36050*50-460*3600.5-2.6SMT-Mounter(SONY)SMT實裝設備中高速機(SONY)SMT實裝設備汎用機(SONY)TypePrecision(mm)Speed
6、(sec)Component sizeComponent height(mm)Min Pitch(mm)AnglePCB size(mm)PCB height(mm)E-2000/21000.04 Moved:0.6Fixed:1.4Chip 2012-32m 250.3 0-36050*50-460*3600.5-2.6F-2090.04 Moved:0.49 Fixed:1.4Chip 2012-32m 25 0.3 0-36050*50-460*3600.5-2.6SMT-Mounter(SONY)Mounter functionX-YDATACAM350editGerberfileCo
7、mbinationX-YDataandGerberfilebyCPSNozzleTypenumberAF06021(E&F)AF06042(E&F)AF10071(E&F)AF12082(E&F)AF25200(E&F)Outsidesize0.6mm0.6mm1.0mm1.4mm2.5mmInsidesize0.2mm0.4mm0.7mm1.0mm2.0mmComponent01005,0201RLCchip0402RLCchip0603RLCchip0805RLCchip1208RLCchipType numberArticle：Lead-Free N2 Reflow Type：NIS-3
8、11TR/NIS-2082C/N30-122-RLF Characteristic：1.The consistency of N2 is low-reduce，Using N2 by PSA to control output and cost 2.PPM control system to control the consistency of O2 in 500PPM3.Uniform heat convection make BGA and CSP heat completely.4.More heating zone could offer better temperature prof
9、ile(8 zones and 12 zones)SMT-Reflow(ETC)Method-Reflow profile(example:Lead free)25150150217Over217Over230below217Rampup:6/sec(max)Rampdown:6/sec(max)25150217230Pre-heatSoakingReflowCoolingPeaktemp=235255TempTimeSMT profile Pre-heat zoneThis heating zone cause the uniform-temperature in all part of P
10、CBA,that can reduce PCB warped,and avoid solder-paste heating disproportion ally to cause splash down to get another failurePre-heat zone temperature setting:(generally setting,actually constant follow vendors data specification)Lead-free 25(room temp)150 :SMT profile Soaking zoneSolder-paste includ
11、e solder alloy and Flux.Commonly,Flux content include Rosin,Activation,Solvent,and Rchological addition.Flux-heating can cause the content of Flux deoxidize solder to raise the soldering of the joint.Soaking zone temperature setting:(generally setting,actually constant follow vendors data specificat
12、ion Lead-free 150 220 :SMT profile Reflow zoneIn the Reflow zone,solder-joint comes into being Interface-alloy,that because most of metal becomes being melting.Peak temperature is in this zone,that is the highest temperature in the profile.Generally,in this zone(230 to peak temp)means solder alloy i
13、s in the melting states and different metals are becoming interface-alloy.Sometimes,we can raise the of this zone to reduce void occur ratio.Reflow zone temperature setting:(generally setting,actually constant follow vendors data specification)Lead-free Over 220 Peak temp:235255 In IPC 610-D,solder-
14、joint must to be bright,shine and smooth.When interface-alloy coagulated,the ramp down ratio(cooling rate)is more fast,that cause alloy atomic bond becomes more tightly,that cause solder surface is more shine and smooth.Cooling zone temperature setting:(generally setting,actually constant follow ven
15、dors data specification)Lead-free Ramp down ratio:6/secSMT profile Cooling zoneProfile limitSolder-Paste Mpt:217 220Reflow peak temp:235255 Reflow zone(over 220):6090secTemperature profile boardSixmeasurepoint(foractualPCBstates)Temppoint:criticalpartsExp:BGA,IC,SD ConnectorConnectthethermalcoupleto
16、measureprofileProfile measurement(for Data PAQ)Reflow profileAutomatic Optic Inspection (AOI)Separationratio：12m(framesize10X12mm)Separationratio：19m(framesize15X19mm)Separationratio：15.5m(framesize19.3X15.5mm)Separationratio：15m(framesize19.3X15mm)Scanningspeed：0.22sec/aframeScanningspeed：0.30sec/a
17、frameScanningspeed：0.23sec/aframeScanningspeed：0.22sec/aframeInspectiontype：Afterprinting，AfterReflowInspectiontype：AfterprintingInspectiontype：AfterReflowInspectiontype：Afterprinting，AfterReflowCPC-1000CPC-500XCPC-1500Cyclone系列Sampleimageinspectimage1.Adopt 2D AOI inspect technique；2.Inspection Ite
18、m：Missing parts/Polarity/Reverse/missing solder/Bridge/Shift/etc;3.Inspect the minimum part：Angular chips 0201；Automatic InspectionCCC system Function：By Regional network,control production line and feedback the NG phenomenon from AOI machine in factory at once.REPAIR system Function：1.Record the NG data for AOI.2.Mark the NG location.3.Using the statistic data to calculate the NG rate by SPC.On production AOI in line recordAOI-CCC/Repair systemApprove document-IPC-610 DThanks!any questions?