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1、7/2/20222 Process Flow ChartSMT印刷機 SPI 高速機泛用機 ICT入庫 AOIQC Chart x-ray迴焊爐Visual7/2/20223Machine Type收板機 AOI 迴焊爐 泛用機 高速機 SPI 印刷機 送板機收板機 AOI 迴焊爐 泛用機 高速機 SPI 印刷機 送板機7/2/20224SolderPrintingPick & placeReflowTurn OverBareBoardSMT Process Flow Diagram2nd SideSMT7/2/20225SMT Layout SetupSMT Layout Setup印刷機錫
2、膏檢測機高速機泛用機7/2/20226SMT Equipment IntroductionScreen Print Solder PasteMaximum Size 510 x 508 mm /(610 x 508mm*) Minimum Size 40 x 50 mmThickness range 0.2 6 mmUnderside component clearance 3- 42 mmAlignment: Stencil to Board Repeatability 1.6 Cpk +/- 25mProduct Changeover: 2 minutes New Product Setu
3、p: =液狀液狀=固固狀的過程將狀的過程將PCBPCB的的PADPAD與元件結合在與元件結合在一起一起7/2/202216SMT Equipment IntroductionAutomatic optical inspection;AOIField of View:0.7”x0.53”Warp compensation across panel:+/-200milNumber of Camera:1 Top 4 AngleCamera resolution:33m/square pixelInspection area:50 x75500 x400mmPosition resolution 2
4、.4mBoard imaging rate:5 square inches/secPCB Size 50 x70500 x400mmPCB Thickness:0.6mm5mmReliable 0201 micro chipLead Free ProcessEasy ProgrammingSolderPrintingPick&PlaceReflowSolderingAOIInspectionICTTestX-RayInspectionSolderPasteInspection7/2/202217AOI(Automatic Optical Inspection)自動光學檢測機自動光學檢測機工作內
5、容:透過光學檢測判定良品或不良品工作內容:透過光學檢測判定良品或不良品工作原理:透過可程式控的的光源變化經截取影像後區分出良品工作原理:透過可程式控的的光源變化經截取影像後區分出良品或是不良品或是不良品7/2/202218SMT Equipment IntroductionInspection BGA ,CSP and Flip-Chip SolderingX-Y Scanning area 610mm x 410mmMaximum sample size:710 x 560 mmMaximum sample weight:5 kgMaximum tube voltage:160kvX-AIP
6、 VISOEasy Operator1D/2D ScanningSolderPrintingPick&PlaceReflowSolderingAOIInspectionICTTestX-RayInspectionSolderPasteInspection7/2/202219SMT Equipment IntroductionIn Circuit tester;ICTShort、Open and Power TestLow MDA Entry PriceConduct function test with Advanced PXI Module ArchitectureOptional Digi
7、tal Components TestOptional On Board programming and Boundary Scan TestTwo Stage Fixtures AvailableSolderPrintingPick&PlaceReflowSolderingAOIInspectionICTTestX-RayInspectionSolderPasteInspection7/2/202220表面粘著技術是什麼表面粘著技術是什麼? 輕薄短小的實現 快穩準自動化的實現 標準化大量生產的實現 零件、材料、設備、製程的整合 高可靠度與高品質的表現7/2/202221The compone
8、nt Comparison插件元件表面貼裝的元件7/2/202222Surface Mount TechnologyPIN-Through-HoleSMTPTH/DIPSurface Mount TechnologyPIN-Through-HoleSMTSMT的優缺點7/2/202223The SMD Technology Comparison產品的體積大幅縮小SMT type也就是單位尺寸內所放置的零件增加而密度縮小7/2/202224零件置放實景由人工插件、自動插件,一直到SMT置件,其作業工時可由3sec大幅縮減至0.06sec左右3sec 1sec 0.06M/I A/I SMT7/2/202225溫度跟成型溫度跟成型210235錫膏板錫膏板7/2/202226各類SMT零件實裝展示整合了各樣功能的元件,使其能標準化, 可自動裝著及焊接特性。7/2/20222728 结束语结束语