《贴片元件焊接标准 41页 0、7M.pdf》由会员分享，可在线阅读，更多相关《贴片元件焊接标准 41页 0、7M.pdf（41页珍藏版）》请在taowenge.com淘文阁网|工程机械CAD图纸|机械工程制图|CAD装配图下载|SolidWorks_CaTia_CAD_UG_PROE_设计图分享下载上搜索。
1、 Corporate Quality Standard Number: Title: Date: 29007-B WMS - Soldering (Part 2 : Surface Mounted Components) Page 1 of 43 Corporate Quality Assurance Department 1.0 Contents 目录目录目录目录 Page 1.0 Content 目录- 1 2.0 Purpose 目的- 1 3.0 Scope 范围- 1 4.0 Description 定义 1 4.1 Tools & Equipment 工具和设备 - 1 4.2 S
2、older Joint for Surface Mounted Components 表面贴装元件的焊接- 2 4.2.1 Chip Component 片状元件- 3-7 4.2.2 Cylindrical Devices 圆柱形元件- 8-9 4.2.3 LCC Devices - 10-11 4.2.4 PLCC Devices - 12-15 4.2.5 SOIC Devices (Gull-Wing) - 16-17 4.2.6 QFP Devices (Gull-Wing) - 18-21 4.2.7 Flush Terminations - 22 4.2.8 Partial Wr
3、aparound Terminations (Tantalum Capacitor) - 23-25 4.2.9 Round Conductor - 26-27 4.2.10 Solder Balls - 28 4.2.11 Solder Splash & Solder Webs - 29 4.2.12 Ball Array Grid(BGA) 30-31 4.2.13 Illustration on Acceptable Soldering Requirements 32-33 4.2.14 Illustration on Rejectable Soldering Requirements
4、34-42 5.0 Reference 参考资料 - 43 6.0 Remarks 备注- 43 7.0 Revision History 版本- 43 8.0 Approval 批准- 43 2.0 Purpose 目的目的目的目的 This document provides the soldered joints acceptability requirements to be met for surface mounted components throughout the PCBA surface mount assembly 本文件制定了 PCBA 表面贴装过程中表面贴装元件的焊接
5、可接受要求。 3.0 Scope 范围范围范围范围 This document established the workmanship standard criteria for soldered joints of surface mounted components to be applied for PCBA throughout the soldering processes. The standards are explained in details by illustrations and descriptions 本文件为表面贴切装元件的焊接所制定的工艺标准规范适用于 PCBA
6、 整个焊接过程。本标准在细节方面由插图和描述作解释。 4.0 Description 定义定义定义定义 4.1. Tools and Equipment 工具和设备工具和设备工具和设备工具和设备 电子工程师俱乐部，中国高级电子工程师论坛 Corporate Quality Standard Number: Title: Date: 29007-B WMS - Soldering (Part 2 : Surface Mounted Components) Page 2 of 43 Corporate Quality Assurance Department Refer to Creative W
7、orkmanship Standard (Docu. No.: 29000) 参照创新工艺标准(Docu. No.: 29000) 4.2 Solder Joint For Surface Mounted Components 表面贴装元件的焊接表面贴装元件的焊接表面贴装元件的焊接表面贴装元件的焊接 4.2.1 Chip Component 片状元件片状元件片状元件片状元件 4.2.1.1 Minimum Solder Coverage 少锡覆盖少锡覆盖少锡覆盖少锡覆盖 PREFERRED (1) Solder fillet is concave and wetted termination
8、by 100% of the height (H) and 100% of the width (W). 焊接带呈现凹形并且终端高度和宽充分 润湿。 Figure 4.1 电子工程师俱乐部，中国高级电子工程师论坛 Corporate Quality Standard Number: Title: Date: 29007-B WMS - Soldering (Part 2 : Surface Mounted Components) Page 3 of 43 Corporate Quality Assurance Department ACCEPTABLE (1) The solder fille
9、t extends at least 25% of the height (H) and 50% of the width (W). 焊接带延伸至少至高度的 25%和宽度的50% 。 Figure 4.2 REJECTABLE (1) Insufficient solder with fillet extends less than 25% of the height (H) and 50% of the width (W). 焊接带少锡，不足高度的 25%和宽度和50% 。 Figure 4.3 4.2.1.2 Maximum Solder Coverage PREFERRED (1) So
10、lder fillet is concave and wetted the.termination by 100% of the height (H) and 100% of the width (W). 焊接带呈现凹形并且终端高度和宽充分 润湿. Figure 4.4 电子工程师俱乐部，中国高级电子工程师论坛 Corporate Quality Standard Number: Title: Date: 29007-B WMS - Soldering (Part 2 : Surface Mounted Components) Page 4 of 43 Corporate Quality As
11、surance Department Figure 4.5 ACCEPTABLE (1) Connection area exhibits a concave solder fillet rising to the top of chip. Good wetting to chip and land surface. 连接区域呈现出一个延伸到贴片元件上表面的凹形焊接带。贴片元件与焊盘润湿良好。 Figure 4.6 REJECTABLE (1) Excessive solder overhang the land or non-metallized portion forming a conv
12、ex fillet. Evidence of non-wetting. 多余的焊料悬垂在焊盘或非镀金属表面上，形成了一个凸形的焊接带。明显的润湿不良。 4.2.1.3 Voids, Blow Holes & Pin Holes 空隙空隙空隙空隙，气泡与针孔气泡与针孔气泡与针孔气泡与针孔 PREFERRED (1) Solder is smooth, bright, shiny and continuous with no evidence of pin holes, blow holes or voids. 焊接光滑、明亮有光泽并呈现出良好的连续性，没有明显的针孔、气泡或空隙。 Figure
13、4.7 电子工程师俱乐部，中国高级电子工程师论坛 Corporate Quality Standard Number: Title: Date: 29007-B WMS - Soldering (Part 2 : Surface Mounted Components) Page 5 of 43 Corporate Quality Assurance Department ACCEPTABLE (1) The solder connection may exhibit voids, blow hole or pin hole in which the surface area covers le
14、ss than 50% of the component width (W). 焊接处有空隙、气泡或针孔，总体覆盖面积小于元件宽度的 50% 。 Figure 4.8 REJECTABLE (1) The entire surface area of the voids, blow hole or pin holes.cover more than 50% of the component width (W). 整个表面区域有空隙、气泡或针孔，总体覆盖面积大于元件宽度的 50% 。 Figure 4.9 4.2.1.4 Tombstone 立碑立碑立碑立碑 PREFERRED (1) Chip
15、 component is mounted properly on the terminal pads with complete wetting of solder on the land surface and the end metallization of the component. 贴片元件恰当的贴装于终端 焊盘，并且元件终端和焊盘均润湿良好。 Figure 4.10 电子工程师俱乐部，中国高级电子工程师论坛 Corporate Quality Standard Number: Title: Date: 29007-B WMS - Soldering (Part 2 : Surfa
16、ce Mounted Components) Page 6 of 43 Corporate Quality Assurance Department ACCEPTABLE (1) Chip component mounted sideways is permissible provided that there is a complete wetting of solder on the land surface and the end metallization of the component. 贴片元件贴装移位但仍润湿良好。 (2) Height of sideway mounted c
17、omponent is not the maximum for the whole PCBA. 贴装移位的元件的高度不是整个 PCBA 的最大高度。 Figure 4.11 REJECTABLE (1) Chip component standing on one side of the terminal pad (tombstoning). 立碑 (2) Height of sideway mounted component is maximum for the whole PCBA. 贴装移位的元件的高度是整个 PCBA 的最大高度。 Figure 4.12 电子工程师俱乐部，中国高级电子
18、工程师论坛 Corporate Quality Standard Number: Title: Date: 29007-B WMS - Soldering (Part 2 : Surface Mounted Components) Page 7 of 43 Corporate Quality Assurance Department 4.2.2 Cylindrical Devices 圆柱形元件圆柱形元件圆柱形元件圆柱形元件 4.2.2.1 Minimum Solder Coverage 最少焊锡覆盖最少焊锡覆盖最少焊锡覆盖最少焊锡覆盖 W = Termination Width = Diam
19、eter of Cylindrical Device H = Termination Height = Diameter of Cylindrical Device PREFERRED (1) Solder fillet is concave and wetted the termination by 100% of the height (H) and 100% of the width (W). 呈现出凹形焊接带且终端润湿良好。 Figure 4.13 ACCEPTABLE (1) Solder fillet extends at least 50% of the height (H) a
20、nd 50% of the width (W) of the device. 焊接带至少延伸至高度的 50%和宽度的50% 。 Figure 4.14 REJECTABLE (1) Insufficient solder with fillet extends less than 50% of the height (H) and 50% of the width (W) of the device. 少锡，焊接带不能延伸至元件高度和宽度的50% Figure 4.15 电子工程师俱乐部，中国高级电子工程师论坛 Corporate Quality Standard Number: Title:
21、 Date: 29007-B WMS - Soldering (Part 2 : Surface Mounted Components) Page 8 of 43 Corporate Quality Assurance Department 4.2.2.2 Maximum Solder Coverage 最大焊锡覆盖最大焊锡覆盖最大焊锡覆盖最大焊锡覆盖 W = Termination Width = Diameter of Cylindrical Device H = Termination Height = Diameter of Cylindrical Device PREFERRED (
22、1) Solder fillet is concave and wetted the termination by 100% of the height (H) and 100% of the width (W). 呈现出凹形焊接带且终端润湿良好。 Figure 4.16 ACCEPTABLE (1) Solder fillet is slightly convex but does not overhang the termination or land with evidence of proper wetting. 焊接带呈现出轻微凸起但焊盘或终端没有悬垂，呈现出适当的润湿。 Figur
23、e 4.17 REJECTABLE (1) Excessive solder overhangs the land or termination forming a convex fillet. . 多锡，焊锡悬垂在焊盘与终端上形成了一个凸形焊接带。 Figure 4.18 4.2.3 LCC Devices 电子工程师俱乐部，中国高级电子工程师论坛 Corporate Quality Standard Number: Title: Date: 29007-B WMS - Soldering (Part 2 : Surface Mounted Components) Page 9 of 43
24、Corporate Quality Assurance Department 7.2.3.1 Minimum Solder Coverage 少锡少锡少锡少锡 PREFERRED (1) Solder wetting extends to the top of the castellation forming a concave solder fillet (F). 焊锡润湿至城形顶端，形成了一个凹形焊接带。 Figure 4.19 ACCEPTABLE (1) Solder fillet is evident and extends at least 25% of the castellat
25、ion height (H) equal to 50% of the fillet height (F). 焊接带延伸至少至城形高度的 25%相当于焊接带高度的 50% 。 Figure 4.20 REJECTABLE (1) Insufficient solder with fillet extends less than 25% of the castellation height (H) and 50% of the fillet height (F). 少锡，焊接带延伸少于城形高度的 25%即少于焊接带高度的 50% 。 Figure 4.21 4.2.3.2 Maximum Sold
26、er Coverage 多锡多锡多锡多锡 电子工程师俱乐部，中国高级电子工程师论坛 Corporate Quality Standard Number: Title: Date: 29007-B WMS - Soldering (Part 2 : Surface Mounted Components) Page 10 of 43 Corporate Quality Assurance Department PREFERRED (1) Solder wetting extends to the top of the castellation forming a concave solder fi
27、llet (F). 焊锡润湿至城形顶端，形成了一个凹形焊接带。 Figure 4.22 ACCEPTABLE (1) Solder fillet is slightly convex with evidence of proper wetting. Solder does not overhang the castellation or land area. 焊接带轻微凸起但适当润湿。焊锡没有悬垂在城形或焊盘上。 Figure 4.23 REJECTABLE (1) Excessive solder overhangs the castellation or land area forming
28、 a convex fillet. No evidence of proper wetting. 多余焊锡悬垂于城形或焊盘上形成了一个凸形焊接带。明显润湿不良。 Figure 4.24 4.2.4 PLCC Devices 4.2.4.1 Minimum Solder Coverage 少锡少锡少锡少锡 电子工程师俱乐部，中国高级电子工程师论坛 Corporate Quality Standard Number: Title: Date: 29007-B WMS - Soldering (Part 2 : Surface Mounted Components) Page 11 of 43 Co
29、rporate Quality Assurance Department PREFERRED (1) Solder fillet is evident and extends onto the inner surface of the lead and covers.all four sides of the lead and land. 焊接带明显且延伸到引脚内表面并且引脚四面和焊盘润湿良好。 (2) Solder fillet extends 25% up the lead height (H). 焊接带延伸至引脚高度的 25% 。 Figure 4.25 ACCEPTABLE (1) S
30、older fillet is evident on at least 3 sides of the lead with solder cover at least 50% of the lead width (W). 至少引脚的三面覆盖有焊锡形成了明显的焊接带且至少为引脚宽度的 50% 。 (2) Solder fillet must extend at least 10% up the lead height (H). 焊接带至少延伸至引脚高度的 10% 。 Figure 4.26 REJECTABLE (1) Insufficient solder cover less than 3 s
31、ides of the lead and 50% of the lead width (W). 少锡，引脚覆锡少于 3 面且每面少于引脚宽度的 50% 。 (2) Solder fillet extends less than 10% of the lead height (H). 焊接带没有延伸至引脚高度的 10% 。 Figure 4.27 4.2.4.2 Maximum Solder Coverage 多锡多锡多锡多锡 电子工程师俱乐部，中国高级电子工程师论坛 Corporate Quality Standard Number: Title: Date: 29007-B WMS - So
32、ldering (Part 2 : Surface Mounted Components) Page 12 of 43 Corporate Quality Assurance Department PREFERRED (1) Solder fillet is evident and extends onto the inner surface of the lead and covers.all four sides of the lead and land with no evidence of overhang. 焊接带明显且延伸至引脚的内表面，引脚四面和焊盘没有焊料悬垂。 (2) Sol
33、der fillet extends 25% up the lead height (H). 焊接带延伸至引脚高度的 25% 。 Figure 4.28 ACCEPTABLE (1) Solder fillet is evident and covers all four sides of the lead and solder overhang the land must not be greater than 50% of the lead width (W). 焊接带明显并且引脚四面覆有焊锡，焊锡悬垂不得超过引脚宽度的 50% 。 (2) Maximum solder fillet ex
34、tends up the lead is 50% of the lead height (H). 最大焊接带为引脚高度的 50% 。 Figure 4.29 REJECTABLE (1) Solder fillet overhangs the land more than 50% of the lead width (W) with no evidence of proper wetting. 焊接带悬垂在焊盘上，大于引脚宽度的50% ，明显的润湿不良。 (2) Excessive solder extends more than 50% up the lead height (H). 多余焊
35、锡超出引脚高度的 50% 。 Figure 4.30 电子工程师俱乐部，中国高级电子工程师论坛 Corporate Quality Standard Number: Title: Date: 29007-B WMS - Soldering (Part 2 : Surface Mounted Components) Page 13 of 43 Corporate Quality Assurance Department 4.2.4.3 Unsoldered Connection & Bridging 未焊接与桥接未焊接与桥接未焊接与桥接未焊接与桥接 PREFERRED (1) Good wett
36、ing of solder within the boundaries of the pad. The wetting angle of the solder to the component and to the pad is less than 90 degrees. 焊盘分界线润湿良好。元件与焊盘之间的焊接润湿角小于 90。 Figure 4.31 REJECTABLE (1) No wetting or bonding between the lead and the terminal pad. 在引脚与终端焊盘之间没有润湿或没有结合物。 Figure 4.32 REJECTABLE
37、(1) Solder projects beyond the pad or lead forming a short circuit between adjacent pads, leads or traces. 焊锡突出焊盘与引脚，在相邻的焊盘、引脚或迹线之间形成短路。 Figure 4.33 电子工程师俱乐部，中国高级电子工程师论坛 Corporate Quality Standard Number: Title: Date: 29007-B WMS - Soldering (Part 2 : Surface Mounted Components) Page 14 of 43 Corpor
38、ate Quality Assurance Department 4.2.5 SOIC Devices ( Gull-Wing ) 4.2.5.1 Minimum Solder Coverage 最少焊锡覆盖最少焊锡覆盖最少焊锡覆盖最少焊锡覆盖 PREFERRED (1) Solder fillet is evident and wetted on all four sides of the lead and land. 焊接带明显 ，引脚四面与焊接面润湿良好。 Figure 4.34 ACCEPTABLE (1) At least 50% of perimeter of each lead
39、have good wetted solder fillets with solder cover at least 50% of the lead side (L), 50% of the lead width (W) and 50% of the lead thickness (T). 每个引脚周长至少 50% 焊接带润湿良好，且至少引脚长宽高的 50%覆有焊锡。 (2) Must have sufficient solder to form a properly wetted fillet. 少锡必须形成一个适当润湿的焊接带。 Figure 4.35 REJECTABLE (1) Ins
40、ufficient solder cover less than 50% of perimeter of the lead with solder cover less than 50% of the lead side (L) and./ or less than 50% of the lead width (W) and / or less than 50% of the lead thickness (T). 少锡，每个引脚周长少于 50% 焊接带润湿且引脚长宽高覆锡少于 50% 。 Figure 4.36 4.2.5.2 Maximum Solder Coverage 多锡多锡多锡多锡
41、 电子工程师俱乐部，中国高级电子工程师论坛 Corporate Quality Standard Number: Title: Date: 29007-B WMS - Soldering (Part 2 : Surface Mounted Components) Page 15 of 43 Corporate Quality Assurance Department PREFERRED (1) Solder fillet is evident and wetted on all four sides of the lead and land. 焊接带明显且引脚四面与焊接面润湿良好。 Figur
42、e 4.37 ACCEPTABLE (1) Solder wetted on all sides of the lead and extends less than 50% of the distance (D) between the upper and lower bend points. 引脚的所有面均润湿，且小于上下弯曲点间距离的 50% 。 (2) Maximum height of the solder joint (H) is 3 times the lead thickness (T). 焊点的最大高度是引脚厚度的 3 倍。 Figure 4.38 REJECTABLE (1)
43、 Excessive solder cover the whole lead and extends more than 50% of the distance (D) between the upper and lower bend points. 整个引脚多锡覆盖，且超出上下弯曲点之间距离的 50% 。 (2) The height of the solder joint (H) is greater than 3 times the lead thickness (T). 焊点高度大于引脚厚度的 3 倍。 Figure 4.39 电子工程师俱乐部，中国高级电子工程师论坛 Corporat
44、e Quality Standard Number: Title: Date: 29007-B WMS - Soldering (Part 2 : Surface Mounted Components) Page 16 of 43 Corporate Quality Assurance Department 4.2.6 QFP Devices ( Gull-Wing ) 4.2.6.1 Minimum Solder Coverage 少锡少锡少锡少锡 PREFERRED (1) Solder fillet is evident and wetted on all four sides of t
45、he lead and land . 焊接带明显，引脚四面与焊接面润湿良好 Figure 4.40 ACCEPTABLE (1) At least 50% of perimeter of each lead have good wetted solder fillets with solder cover at least 50% of the lead side (L), 50% of the lead width (W) and 50% of the lead thickness (T). 每个引脚周长至少 50% 焊接带润湿良好，且至少引脚长宽高的 50%覆有焊锡。 (2) Must h
46、ave sufficient solder to form a properly wetted fillet. 少锡必须形成一个适当的焊接带。 Figure 4.41 REJECTABLE (1) Insufficient solder cover less than 50% of perimeter of the lead with solder cover less than 50% of the lead side (L), less than 50% of the lead width (W) and / or 50% of the lead thickness (T). 少锡，每个引
47、脚周长少于 50% 焊接带润湿且引脚长宽高覆锡少于 50% 。 Figure 4.42 电子工程师俱乐部，中国高级电子工程师论坛 Corporate Quality Standard Number: Title: Date: 29007-B WMS - Soldering (Part 2 : Surface Mounted Components) Page 17 of 43 Corporate Quality Assurance Department 4.2.6.2 Maximum Solder Coverage 多锡多锡多锡多锡 PREFERRED (1) Solder fillet is
48、evident and wetted on all four sides of the lead and land. 焊接带明显且引脚四面与焊接面润湿良好 Figure 4.43 ACCEPTABLE (1) Solder wetted on all sides of the lead and extends less than 50% of the distance (D) between the upper and lower bend points. 引脚的所有面均润湿，且小于上下弯曲点间距离的 50% 。 (2) Maximum height of the solder joint (
49、H) is 3 times the lead thickness (T). 焊点的最大高度是引脚厚度的 3 倍。 Figure 4.44 REJECTABLE (1) Excessive solder cover the whole lead and extends more than 50% of the distance (D) between the upper and lower bend points. 多锡覆盖整个引脚，且大于上下弯曲点间距的 50% 。 (2) The height of the solder joint (H) is greater than 3 times t
50、he lead thickness (T). 焊点高度大于引脚厚度的 3 倍。 Figure 4.45 电子工程师俱乐部，中国高级电子工程师论坛 Corporate Quality Standard Number: Title: Date: 29007-B WMS - Soldering (Part 2 : Surface Mounted Components) Page 18 of 43 Corporate Quality Assurance Department 4.2.6.3 Cold Solder Joint & Flux Residue 冷焊与助焊剂残留物冷焊与助焊剂残留物冷焊与助焊