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1、精选优质文档-倾情为你奉上工 程 英 文 确 认 常 用 词 及 常 用 语 句 汇 总专心-专注-专业单词1. 附件：attached (attachment)2. 样品：sample3. 承认：approval4. 答复：answer;reply5. 规格：spec (specification)6. 与.同样的：the same as (identical to)7. 前版本：previous version(old version)8. 生产：production9. 确认：confirm10. 再次确认：double confirm11. 工程问题：engineering query
2、（EQ）12. 尽快：ASAP(as soon as possible)13. 生产文件：production gerber14. 联系某人：contact somebody15. 提交样板：submit sample16. 交货期：delivery date17. 电测成本：ET（electrical test） cost18. 通断测试：Open and short testing19. 参考：refer to20. IPC标准：IPC standard21. IPC二级：IPC class 222. 可接受的：acceptable23. 允许：permit (allow)24. 制造：m
3、anufacture (fabricate)25. 修改：revise /amend /change /modify26. 公差：tolerance27. 忽略：ignore(omit)28. 工具孔：tooling hole29. 安装孔：mounting hole30. 元件孔：component hole31. 槽孔：slot32. 邮票孔：snap off hole (break off holes)33. 导通孔：via34. 盲孔： blind via35. 埋孔：buried via36. 金属化孔：PTH(plating through hole)37. 非金属化孔：NPTH(
4、 no plating through hole)38. 孔位：hole location (position)39. 避免：avoid (in case of)40. 原设计：original design41. 修改：modify42. 按原设计：leave it as it is43. 附边：waste tab44. 铜条：copper strip45. 拼板强度：panel strength46. 板厚：board thickness47. 删除：remove(delete /erase)48. 削铜：shave the copper49. 露铜：copper exposure50.
5、光标点：fiducial mark51. 不同：be different from(differ from)52. 内弧：inside radius53. 焊环：annular ring54. 单板尺寸：single size55. 拼板尺寸：panel size56. 铣：routing57. 铣刀：router58. V-cut：scoring59. 哑光：matt60. 光亮的：glossy61. 锡珠：solder ball(solder plugs)62. 阻焊：solder mask(solder resist)63. 阻焊开窗：solder mask opening64. 单面开
6、窗：single side mask opening65. 补油：touch up solder mask66. 补线：track welds67. 毛刺：burrs68. 去毛刺：deburr69. 镀层厚度：plating thickness70. 清洁度：cleanliness71. 离子污染：ionic contamination72. 阻燃性：flammability retardant73. 黑化：black oxidation74. 棕化：brown oxidation75. 红化：red oxidation76. 可焊性：solderability77. 焊料：solder78
7、. 包装：packaging79. 角标：corner mark80. 特性阻抗：characteristic impedance81. 差分阻抗：differential impedance82. 正像：positive83. 负片：negative84. 镜像：mirror85. 线宽：conductor width86. 线距：conductor spacing87. 做样：build sample88. 按照：as per89. 成品：finished90. 做变更：make the change91. 相类似：similar to92. 规格：specification93. 下移：
8、shift down94. 垂直地：vertically95. 水平的：horizontally96. 增大：increase97. 缩小：decrease98. 表面处理：Surface Finishing99. 波峰焊：wave solder100. 钻孔数据：drilling date101. 标记：Logo (marking)102. Ul 标记：Ul Marking103. 蚀刻标记：etched marking104. 周期：date code105. 翘曲：bow and twist106. 外层：outer layer107. 内层：internal layer108. 顶层：
9、top layer109. 底层：bottom layer110. 元件面：component side111. 焊接面：solder side112. 阻焊层：solder mask layer113. 丝印层：legend layer (silkscreen layer)114. 兰胶层：peelable SM layer115. 贴片层：paste mask layer116. 碳油层：carbon layer117. 外形层：outline layer(profile layer)118. 白油：white ink119. 绿油：green ink120. 喷锡：hot air lev
10、eling (HAL) =hot air solder leveling (HASL)121. 水金：flash gold122. 插头镀金：plated gold edge-board contacts (gold finger)123. 金手指：Gold-finger124. 防氧化：Entek(OSP)125. 沉金：Immersion gold (chem. Gold)126. 沉锡：Immersion Tin(chem.Tin)127. 沉银：Immersion Silver (chem. silver)128. 单面板：single sided board129. 双面板：doub
11、le sided board130. 多层板：multilayer board131. 刚性板：rigid board132. 挠性板：flexible board133. 刚挠板：flex-rigid board134. 铣：CNC (mill , routing)135. 冲：punching136. 倒角：beveling 137. 倒斜角：chamfer138. 倒圆角：fillet139. 尺寸：dimension140. 材料：material141. 介电常数：Dielectric constant142. 菲林：film143. 成像：Imaging144. 板镀：Panel
12、Plating145. 图镀：Pattern Plating146. 后清洗：Final Cleaning147. 叠层：layup (stack-up)148. 污染焊盘：contaminate pad149. 分孔图：drill chart150. 度数：degree151. 被覆盖：be covered with152. 负公差：minus tolerance153. 标靶盘： target pad154. 外形公差：routing tolerance155. 芯板：core常用语句、厚度1. 要求孔内铜厚0.001,超过了IPC二级标准，我们建议按IPC二级0.0008。The cop
13、per thickness of the wall of the plated-through holes is specified 0.001. Its exceeding IPC class 2 and We suggest as per IPC class 2.thats to say ,Its 0.0008 .2.要求金手指镀金厚度为1.2-1.5um，超过IPC标准太多，建议按我们常规0.45um。The plating thickness of Au in edge contact is specified 1.2-1.5um,it exceed IPC standard too
14、much we suggest following standard ,thickness 0.45um instead.3.建议所要求的铜厚2OZ为成品铜厚，而且我们将用基铜1.5OZ电镀到2OZ。The copper thickness is specified 2OZ .We suggest the finished copper thickness 2OZ. And we will use the base material with 1.5OZ copper thickness and plate up to 2OZ. 4.要求锡厚为0.0005-0.003，相对IPC标准要求难很多
15、，建议按IPC二级，即保证可焊性，The solder thickness required 0.0005-0.003 ,it is much more than IPC std. .We suggest following IPC class 2 this is to say to assure the solderability. 二、公差1. XXX.的尺寸公差为+/-0.005，建议按IPC二级标准也就是+/-10mil，或我方最好控制能力+/-8mil生产。The tolerance of dimension is specified XXX.+/-0.005 .we recomme
16、nd as per IPC class 2 as we previously agreed ,this is to say +/-10mil,or +/-8mil that is our best we meet.2.在*.pdf文件中要求外形公差为+/-0.005，建议按IPC 二级+/-0.01代替。The profile tolerance is specified +/-0.005 in *.pdf file. We suggest as per IPC class 2，that is to say, it is +/-0.01.3. 在叠层图中要求板厚公差为+/-0.007，而not
17、es 1中要求板厚公差为+/-0.005，他们是不同的，建议按0.062+/-0.007这与IPC标准相符 The tolerance of the board thickness is specified +/-0.007 in layup detail which is different form NOTES 1 +/-0.005.We suggest 0.062+/-0.007 based on IPC class 2.4.外形公差要求+/-0.1mm，建议按IPC二级标准也就是+/-10mil，或我方最好控制能力+/-8mil生产。The tolerance of the outli
18、ne is specified +/-0.1mm.Its above us we recommend as per IPC class 2 as we previously agreed, this is to say +/-10mil,or +/-8mil that is our best we meet.5. v-cut留厚公差为+/-0.06mm上下偏移公差为+/-0.05mm，建议标准公差即+/-0.1mm控制。The remaining tolerance of v-cut is specified +/-0.06mm and offset tolerance is +/-0.05m
19、m.,we suggest both tolerance are +/-0.1mm instead.as per standard spec.6.孔位公差为0.05mm，这比IPC标准严很多，建议用+/-0.076mm替代。The tolerance of the hole position is specified 0.05mm.it is much higher than IPC class 2, We suggest +/-0.076mm instead.7. 角度公差为+/-0.5度，这要比通常的标准高出很多，建议按通常标准公差+/-5度制作。The tolerance of angl
20、e is +/-0.5 degree ,it is much higher than standard spec ,we suggest as per standard tolerance +/-5 degree.8.在1MB5476-01.pdf文件中要求孔到板中心的公差是+/-0.05mm，这要比IPC标准高出很多，建议按我们最好的能力+/-0.15MM 。It is special that the tolerance of the hole to board center is +/-0.05mm in the 1MB5476-01.pdf file , it is much high
21、er than IPC class 2，we suggest as per +/-0.15MM that is our best we meet. .9.要求线宽和线间距公差为+/-0.03，请确认按IPC2级标准放松到+/-20%。It stated that conductor width and spacing shall be within +/-0.03(0.001) of gerber data , we would like to do as per IPC class 2 and relax to +/-20%.Pls confirm.10.3.0的孔径公差要求+0.05mm，
22、请确认可以按IPC二级标准+/-0.076mm制作或者按我司最好控制能力+0.1/-0mm。The tolerance of the holes with diameter 3.0mm is required to control within +0.05mm , Pls confirm we can do per IPC class 2 +/-0.076mm or +0.1/-0mm that is our best.三、线路层1.两个孔到外形很近，这将引起露铜和破孔，建议允许露铜与破孔。Two holes are close to the outline,it will cause cop
23、per exposed and hole broken,we suggest copper exposed and hole broken is permitable.2.有些盘离外形很近，建议削铜皮0.4mm，避免露铜。Some pads are close to the outline .We suggest shaving the pads about 0.4mm to avoid copper exposure.3. 焊盘延伸出板外，如按原设计，板边将会露铜，建议允许露铜。The copper pad extend outside of the board outline, it wi
24、ll lead to copper exposed if we follow Gerber to do, We suggest copper exposed is acceptable.4.有三个盘离v-cut 线很近将会引起露铜，建议削焊盘0.4mm避免露铜。The three pads are so close to the v-cut that they will cause copper exposure. We suggest shaving the pads 0.4mm to avoid the copper exposure.5.底层有些地方线路网格间距仅有0.178mm，建议减
25、小线宽使间距达到0.2mm.以便生产。Some of the copper grids on bottom side is only 0.178mm. we suggest decreasing the copper to enlarge the gap to 0.2mm for better production.6. 既然没有功能上的影响，我们建议所有层附边均加些铜皮以提高电镀质量。We suggest putting some extra copper on the waste tab in all layers to improve plating quality since this
26、 is no function effect.7.建议加在顶层空白区域加些铜以提高电镀质量。We suggest putting some extra copper in blank area on top side to improve plating quality.8.我们发现有两处铜皮间距仅有0.013mm，建议把它们连接起来。We have found that the gap between two block copper is only 0.013mm on bottom side, we suggest they are connected.9. 两个光标点处在v-cut线上
27、，它们将被削到，我们建议向左边移1.0mm。The two fiducial marks are over v-groove line . They will be cut . We suggest moving them 1.0mm toward the left . 四、孔层1. 两个直径2.0MM的孔，4个直径4.0MM的孔，4个直径1.3MM的孔双面没有焊盘，但它们被定义成PTH孔，我们建议做NPTH孔The 2 holes with dia.2.0mm , 4 holes with dia.4.0mm and 4 holes with dia.1.3mm have no pads o
28、n top and bottom copper layer .But they are specified PTH in drill chart. We suggest build them as NPTH.2这些孔（直径1.4MM，1.6mm,1.8mm,2.5mm）被定义成PTH孔，但它们的焊盘与孔径等大，我们建议做NPTH孔。These holes (dia.1.4mm ,1.6mm,1.8mm,2.5mm)are specified PTH .But they have pads size which are the same as the holes in copper layer
29、.We suggest them NPTH.3.六个直径0.25MM的孔在分孔图中定义为NPTH孔，但它们的线路焊盘比孔大，我们建议做PTH孔。The 6 holes with dia.0.25mm are specified NPTH in drill chart .But they have pads which are larger than the holes in copper layers .We sugget them PTH .4. 直径0.11“的孔对应的焊盘比孔大，但它们被定义成NPTH孔，我们建议沿孔边削铜皮0.3MM ，请确认The hole with dia.0.11
30、 have larger pad than itself in top and bottom copper layer .But its specified NPTH.we suggest shaving the pads 0.3mm around the hole.Pls confirm.5.GERBER中孔的类型没有定义，2个直径0.120“的孔双面没有焊盘，我们想确认这2个直径0.120”的孔为NPTH孔。The hole type(PTH or NPTH) is not defined in the Gerber, the two holes with diameter have no
31、t copper pads on both sides, we would like to confirm they are non-plating holes.6.一些1.5mm的孔靠得非常近，建议把他们制成槽孔。Some holes with dia.1.5mm stay are very close, we suggest doing them oval hole.7.有两个0.991、0.762重叠在一起，建议保留一个0.991mm的孔。One hole with dia.0.991 mm overlap with the other one with dia.0.762 mm in
32、one place,we suggest doing witch final dia.0.991mm.8.在DRD孔表中直径0.012英寸孔数是291，而在钻孔文件中孔数是290，请确认以钻孔文件为准孔数是290而不是291。The quantity of diameter 0.012 inch in the drill chart (file DRD) is 291, but the drilling data(through,tap)is only 290. please confirm the drilling data should prevail, that is to say th
33、e correct QTY is 2909.在孔表中标明1.7*1.9mm的槽数量为4个，但gerber中仅有两个，建议按gerber制作。In the drilldraw file,it stated that the quantity of slots 1.7*1.9mm is 4 ,but we have found only two slots in the gerber file ,we suggest as per gerber file.10.因为铣外形没有定位孔，我们建议附边加四个2.0mm孔。Due to no located holes for our routing,we
34、 suggest four additional holes with dia.2.0mmin waste tab.五、阻焊层1在字符J3处，一些0.065 inch & 0.0461 inch的孔两面没有开窗，为避免阻焊污染焊盘，在对孔双面加开窗。On the location of J3,some holes with diameter 0.065 inch & 0.0461 inch have not mask opening on both sides, we would like to add mask opening for these holes to avoid solder
35、resist encroach into the pad on both sides.2.这些焊盘仅TOP面有阻焊开窗，为了避免油墨渗上焊盘，我们建议在BOTTOM面也加上与TOP面等大的阻焊开窗These pads have single sided mask opening on the top side , we suggest extra maskopening on the bottom side with the same size as pads to avoid mask creeping onto pad.3.我们发现6个直径0.8MM的孔双面没有阻焊开窗，我们认为它们应为元
36、件孔，建议双面加直径1.75MM的阻焊开窗。We found the 6 holes with dia.0.8mm have not solder-mask opening on both sides. We think they should be component holes. We suggest solder mask opening with dia.1.75mm over the pads on both sides.4.我们发现单板内有些光标点没开窗，这点我们应该按原设计吗？We found some fiducially inside the board without ma
37、sk opening. Should we just follow the original design and leave them?5.锡珠，小挡点根据原设计多数过孔没有开窗，但也没有堵孔要求，在我们生产过程中，这样会造成因为孔内有绿油但又没堵满导致锡珠残留在孔内，为此我们有三种建议，请自行选择确认：建议1：允许部分过孔孔内有锡珠。建议2：若不同意建议1，我们将对这些孔双面加一比孔大些的开窗，使用这种方法的结果是：这些过孔的孔壁不会有绿油，过孔焊盘被绿油覆盖但有部分小锡环。建议3：若不同意以上两点，我们将对双面未开窗的过孔进行堵孔，但这将增加成本和增加制程时间，我们不推荐这种建议。我们希
38、望你能选择建议1或建议2Most of vias have no solder mask opening as per original design and no vias-plugged request .During our process of HAL, the solder ball will hind inside the vias ,so come three of our suggestion as below:suggestion1 :Solder ball inside partial vias is permitted.suggestion2: If you dont a
39、gree with our suggestion 1, we would like to put an extra SM opening with a little larger size than holes on both sides .this will have no SM inside the via,but with a small solder coating annuler ring around the vias.suggestion3: If you dont agree with above two,we will have to plug those vias whic
40、h have no opening on both side with solder resist . But it will increase our production cost and request much more lead-time. This suggestion is not recommended.We would like to hope you could choose our suggestion 1or 2.6. 过孔要求堵孔，但一些过孔顶层有开窗，建议保留过孔开窗且对0.46mm的过孔堵孔。The via is specified to be plugged.
41、But some vias have mask opening in top layer. We suggest all vias with dia.0.406mm will be plugged and their mask opening in top layer will be kept. 7. 根据原设计光标点开窗压到周围的些线或盘，建议削光标点开窗，避免露线。In the borad ,some soldermask opening of fiducial marks cover the nearby traces or pads on top side per original d
42、esign. We suggest that shave a little soldermask opening of fiducial marks to avoid the trace exposed .8. 开窗与线路盘现状不同，我们应该修改开窗使按键处全部上金还是依据原设计制作？The solder mask opening shape mismatch the circuit pad , should we modify the solder mask opening shape to assure all the key pad will be covered with gold c
43、ompletely , or we will follow Gerber to do . 9. 能我们使用太阳PSR 2000油墨代替太阳PSR 4000油墨？因为我们没有这类型的油墨。Can we use the solder-mask type with TAYO ink PSR 2000 instead of TAYO ink PSR 4000 H85?because we have not this type 六、字符层1.大部分的丝印字符都在焊盘上。我们建议此板没有白字，如果需要丝印字符，我们建议删去上焊盘的字符。Most of silkscreen is on the pads,
44、we suggest no silkscreen instead, if the silkscreen has to be needed, we suggest removal of those which are on pads.2.原设计白油上焊盘，为了避免油墨污染焊盘，我们建议削去5焊盘的白油，请确认。There is white ink on the top pads per original design, We suggest shaving the white ink in case of comtamination on the pads. Pls confirm.3.一些字符
45、靠近焊盘，恐怕它们会污染焊盘，建议允许削少许字符，也就是说字符残缺是允许的。Some legends are close to pads .we are afraid they will contaminate the pads.so we suggest shaving them a bit.but need to confirm a small parfial silkscreen missing is permitable.4.GERBER文件没有发现丝印层，请确认此板没有字符，如果需要丝印字符，请将字符文件发给我们。We didnt find any silkscreen layer
46、in gerber file.pls confirm no marking for this part.If need ,Pls send us the file.5.在U1和U5区域，两个IC焊盘的间距只有0.3MM ，如果按原设计制作，白油会污染焊盘，但请确认白油上焊盘是可接收的。In U1 & U5 area the gap between two IC pads is only 0.3mm ，and the white ink will contaminate pads if we follow the original gerber,the white ink over the pa
47、ds is acceptable.Pls confirm.6.按原设计，字符在大锡面上，是否为了避免白油污染锡面需要削掉白油，或者需要我们按原设计制作？请指示The notation will be over the pads per original design ,pls advise if we need to shave them avoid contamination to the pads or just leave them and follow the gerber?7. 所有底层字符都没镜像，建议没有底层字符或如果要做出他们需要镜像，请提出你的建议。All the legends on bottom side are not mirrored per gerber file,we suggest no bottom side silkscreen or just have them mirrored for production.Pls advise.8在GM4层有些字符，我们忽略它们或是加到顶层？There are some legends on the GM4 layer,should we omit them or add th